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Your search for "OSAT" gave back 385 results.
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the...
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MRRPB5
September 2024
Price: USD 3,950.00
The global market for Die Attach Systems was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030...
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MRRPB5
September 2024
Price: USD 3,950.00
A mechanical wafer saw is a precision tool used in the semiconductor manufacturing process to cut or dice silicon wafers into individual chips or...
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MRRPB5
September 2024
Price: USD 2,900.00
The global market for Flip Chip Die Attach Equipment was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
September 2024
Price: USD 3,950.00
Semiconductor wafer slicing equipment is mainly used in the packaging process. It is a device that divides wafers containing many chips into wafer...
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MRRPB5
August 2024
Price: USD 2,900.00
Wafer thermocompression bonders are specialized machines used in the semiconductor industry to bond wafers through a process that combines heat and...
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GIR
August 2024
Price: USD 3,480.00
Thermosonic wire bonder is equipment used in the field of semiconductor packaging. Thermosonic bonding is a method of bonding that utilizes both high...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Multifunctional Ball Bonder market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Die Sorting Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Die Bonder Machinery market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
July 2024
Price: USD 2,900.00
Filming on wafers used in the production of semiconductor integrated circuits. The global Vacuum Wafer Mounter market was valued at US$ million in...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Flip Chip Die Attach Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Die Pick and Place Equipment market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a...
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LPI
July 2024
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Chip Handler market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the...
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MRRPB5
June 2024
Price: USD 2,900.00
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