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Your search for "Consumer Packaging" gave back 18799 results.
The global Infrared Detector Package Shell market size was valued at US$ million in 2023. With growing demand in downstream market, the Infrared...
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LPI
August 2024
Price: USD 3,660.00
The global Electronic Packaging Ceramic Heat Sink market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
December 2024
Price: USD 3,660.00
The global HTCC Package market size is predicted to grow from US$ 3364 million in 2025 to US$ 5081 million in 2031; it is expected to grow at a CAGR...
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LPI
April 2025
Price: USD 3,660.00
Electronic packaging thin carrier tape is a high-performance material used for packaging and transporting electronic components. It is specially...
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LPI
November 2024
Price: USD 3,660.00
Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF...
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LPI
November 2024
Price: USD 3,660.00
The global Advanced Electronic Packaging Materials market size was valued at US$ 9898.3 million in 2023. With growing demand in downstream market,...
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LPI
October 2024
Price: USD 3,660.00
The global Transistor Outline (TO) Package market size was valued at US$ million in 2023. With growing demand in downstream market, the Transistor...
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LPI
June 2024
Price: USD 3,660.00
The global Simple Packaged MEMS Oscillator market size is predicted to grow from US$ 181 million in 2025 to US$ 565 million in 2031; it is expected...
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LPI
January 2025
Price: USD 3,660.00
The global 3D TSV Package market size was valued at US$ 844.2 million in 2023. With growing demand in downstream market, the 3D TSV Package is...
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LPI
October 2024
Price: USD 3,660.00
The global Simple Packaged Crystal Oscillator market size is predicted to grow from US$ 2275 million in 2025 to US$ 2904 million in 2031; it is...
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LPI
January 2025
Price: USD 3,660.00
The global Glass Carrier for Semiconductor Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
October 2024
Price: USD 3,660.00
CSP, or Chip Scale Package, is a type of integrated circuit (IC) packaging that is designed to be roughly the same size as the semiconductor die it...
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LPI
April 2024
Price: USD 3,660.00
The semiconductor supply chain involves a complex network of companies, organizations, and individuals involved in the design, manufacturing,...
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LPI
November 2024
Price: USD 3,660.00
The global Semiconductor Packaging Equipment market size was valued at US$ 6122.5 million in 2023. With growing demand in downstream market, the...
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LPI
September 2024
Price: USD 3,660.00
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial...
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LPI
April 2024
Price: USD 3,660.00
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