0 items USD 0.00Search
Your search for "Bonding Wires" gave back 58276 results.
The global Bonding Wires for Power Device market size is predicted to grow from US$ 1413 million in 2025 to US$ 2483 million in 2031; it is expected...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
LPI
February 2025
Price: USD 3,660.00
The global Bonding Wires market size was valued at US$ 11250 million in 2024 and is forecast to a readjusted size of USD 17660 million by 2031 with a...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
GIR
June 2025
Price: USD 3,480.00
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
Wire bonding machines are used in the semiconductor industry for making electrical connections between semiconductor chips (integrated circuits or...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
The global market for Bonding Wires for Power Device was valued at US$ 1360 million in the year 2024 and is projected to reach a revised size of US$...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
January 2025
Price: USD 2,900.00
The global Aluminum Bonding Wires market size is predicted to grow from US$ 191 million in 2025 to US$ 280 million in 2031; it is expected to grow at...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
LPI
April 2025
Price: USD 3,660.00
The global Palladium Coated Copper Bonding Wires market size is predicted to grow from US$ 1480 million in 2025 to US$ 4264 million in 2031; it is...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
LPI
December 2024
Price: USD 3,660.00
The copper wire bonding can be defined as the wire bonding process in semiconductor packaging using copper wire instead of traditional semiconductor...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
The global Battery Al Wire Bonding Machine market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 4,900.00
The global Aluminum Bonding Wires market size was valued at US$ 180 million in 2024 and is forecast to a readjusted size of USD 273 million by 2031...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
GIR
January 2025
Price: USD 3,480.00
The global market for Bonding Wire for Semiconductor was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
December 2024
Price: USD 3,950.00
The global Copper Wire Bonding Equipment market was valued at US$ 436 million in 2023 and is anticipated to reach US$ 707 million by 2030, witnessing...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
November 2024
Price: USD 2,900.00
Ìý
