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Your search for "silicon carbide (SiC) substrates" gave back 10367 results.
The global market for Hybrid Ceramic Ball Bearings was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
November 2024
Price: USD 3,950.00
According to QYResearch’s new survey, global SiC Substrate Slicer market is projected to reach US$ million in 2029, increasing from US$ million in...
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MRRPB5
June 2023
Price: USD 2,900.00
The global market for SiC Trench Etcher was valued at US$ 164 million in the year 2024 and is projected to reach a revised size of US$ 362 million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Full Ceramic Bearing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
April 2024
Price: USD 2,900.00
The global SiC Crystal Growth Furnace Systems market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by...
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GIR
October 2024
Price: USD 3,480.00
The global Hybrid Ceramic Ball Bearings market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
February 2023
Price: USD 2,900.00
SiC (Silicon Carbide) Wafer Pattern Inspection System is a specialized system used to inspect the patterns and quality of SiC wafers used in...
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MRRPB5
August 2024
Price: USD 2,900.00
SiC (Silicon Carbide) wafer dicing machines are specialized equipment used in semiconductor manufacturing to precisely cut SiC wafers into individual...
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LPI
July 2024
Price: USD 3,660.00
A tubular arrester is a type of surge arrester that uses a protective gap with high arc extinguishing ability to protect electrical equipment from...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Graphite Crucible market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during...
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MRRPB5
March 2023
Price: USD 2,900.00
The global market for SiC Wafer Thinning Equipment was valued at US$ 114 million in the year 2024 and is projected to reach a revised size of US$ 338...
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MRRPB5
April 2025
Price: USD 2,900.00
SiC (Silicon Carbide) wafer dicing machines are specialized equipment used in semiconductor manufacturing to precisely cut SiC wafers into individual...
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MRRPB5
July 2024
Price: USD 2,900.00
SiC (Silicon Carbide) wafer laser dicing machines are advanced equipment used in semiconductor manufacturing for precise cutting of SiC wafers into...
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MRRPB5
July 2024
Price: USD 2,900.00
Diesel particulate filters (DPF) are devices that physically capture diesel particulates to prevent their release to the atmosphere. Diesel...
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MRRPB5
September 2024
Price: USD 3,950.00
The global Automatic Wafer Bonding Equipment market size is predicted to grow from US$ 328 million in 2025 to US$ 444 million in 2031; it is expected...
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LPI
February 2025
Price: USD 3,660.00

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