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Your search for "high-performance computing" gave back 128962 results.
Power Integrated ICs combine high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly,...
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MRRPB5
April 2023
Price: USD 2,900.00
Power Integrated ICs combine high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly,...
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MRRPB5
April 2023
Price: USD 2,900.00
The global market for Electronic Ignition Module was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by...
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MRRPB5
November 2024
Price: USD 3,950.00
High-performance inertial sensors have traditionally been exclusively made with non-MEMS technologies such as fiber optic gyroscopes (FOGs) and ring...
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MRRPB5
January 2023
Price: USD 2,900.00
The global high-performance NAND Flash Memory market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Computing Electronics market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
November 2024
Price: USD 3,480.00
The global market for TGV Glass Core Substrate was valued at US$ 206 million in the year 2024 and is projected to reach a revised size of US$ 607...
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MRRPB5
June 2025
Price: USD 2,900.00
High-performance MEMS inertial sensors can perceive and measure specific states and changes of objects, and convert the measured states and changes...
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MRRPB5
February 2023
Price: USD 2,900.00
This studies the logic technology wafer foundry, include the advanced logic process (below 28nm, including 3nm, 5nm, 7nm, 10nm, 14nm, 16nm, etc.) and...
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LPI
November 2024
Price: USD 3,660.00
The global Ethernet Switch ICs market size was valued at US$ 3757 million in 2024 and is forecast to a readjusted size of USD 5315 million by 2031...
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GIR
January 2025
Price: USD 3,480.00
Glass carriers are indeed becoming a crucial component in Fan-Out Panel Level Packaging (FOPLP), an advanced semiconductor packaging technology that...
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LPI
August 2024
Price: USD 3,660.00
Glass carriers are indeed becoming a crucial component in Fan-Out Panel Level Packaging (FOPLP), an advanced semiconductor packaging technology that...
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LPI
August 2024
Price: USD 3,660.00
The global market for High Performance Laser Distance Sensor was valued at US$ million in the year 2024 and is projected to reach a revised size of...
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MRRPB5
February 2025
Price: USD 2,900.00
The global ASIC Bitcoin Mining Hardware market size was valued at USD 8858.9 million in 2023 and is forecast to a readjusted size of USD 16090...
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GIR
January 2024
Price: USD 3,480.00
The global market for Ethernet Switch ICs was valued at US$ 3835 million in the year 2024 and is projected to reach a revised size of US$ 5445...
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MRRPB5
March 2025
Price: USD 2,900.00
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