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Your search for "high-performance computing" gave back 128696 results.
Micro-channel cooling is commonly achieved with the aid of a heat sink consisting of a high conductivity substrate that contains a large number of...
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MRRPB5
October 2023
Price: USD 2,900.00
The global High Thermal Conductivity Film For Electronic Products market was valued at US$ million in 2023 and is anticipated to reach US$ million by...
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MRRPB5
March 2024
Price: USD 2,900.00
The global IC Photoresist market size is predicted to grow from US$ 2688 million in 2025 to US$ 4096 million in 2031; it is expected to grow at a...
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LPI
April 2025
Price: USD 3,660.00
The global market for Semiconductor Assembly Materials was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
A FinFET is a type of field-effect transistor (FET) that has a thin vertical fin instead of being completely planar. The gate is fully 鈥渨rapped鈥�...
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LPI
November 2024
Price: USD 3,660.00
The global Computational Camera market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR...
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GIR
May 2025
Price: USD 3,480.00
Automotive AI chips are chips used for AI technologies applied in the automotive field. These chips usually have high-performance computing power and...
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LPI
April 2024
Price: USD 3,660.00
The global market for Power ICs was valued at US$ 23560 million in the year 2024 and is projected to reach a revised size of US$ 30480 million by...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Wafer Hybrid Bonding Equipment was valued at US$ 164 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The special CPU for notebook computers is called Mobile CPU (Mobile CPU). It not only pursues performance, but also low calorie and low power...
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MRRPB5
March 2024
Price: USD 2,900.00
The global market for High Bandwidth Memory for AI was valued at US$ 19120 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
June 2025
Price: USD 2,900.00
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial...
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LPI
April 2024
Price: USD 3,660.00
The global Embedded Computer Boards and Modules market size was valued at US$ 3392.6 million in 2023. With growing demand in downstream market, the...
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LPI
February 2024
Price: USD 3,660.00
The global Industrial Fanless Embedded System market size is predicted to grow from US$ 727 million in 2025 to US$ 955 million in 2031; it is...
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LPI
July 2025
Price: USD 3,660.00
The high computing power intelligent driving domain controller is a high-performance electronic control unit (ECU) mainly used to realize the...
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MRRPB5
January 2024
Price: USD 2,900.00
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