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Your search for "Packaging" gave back 6368 results.
The global market for Aluminum Nitride Ceramic Package was valued at US$ 303 million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
February 2025
Price: USD 2,900.00
The global IGBT Module Packages market size was valued at US$ million in 2023. With growing demand in downstream market, the IGBT Module Packages is...
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LPI
December 2024
Price: USD 3,660.00
The global Integrated Circuit Packaging Solder Ball market size was valued at US$ 237 million in 2023. With growing demand in downstream market, the...
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LPI
December 2024
Price: USD 3,660.00
The global IC Packaging Solder Ball market size was valued at US$ 237 million in 2023. With growing demand in downstream market, the IC Packaging...
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LPI
December 2024
Price: USD 3,660.00
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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MRRPB5
December 2024
Price: USD 3,950.00
The global market for DIP/SMD/SOP Packaged Thyristor Optocoupler was valued at US$ 527 million in the year 2023 and is projected to reach a revised...
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MRRPB5
December 2024
Price: USD 2,900.00
Microwave packaged photodiode utilize high-speed planar PIN photodiodes to provide highly reliable high-power photodiode assemblies. This package is...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for PCB Chemical and Semiconductor Packaging Material was valued at US$ 32070 million in the year 2024 and is projected to reach a...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Electronic Package Metal Heat Sink market size was valued at US$ million in 2023. With growing demand in downstream market, the Electronic...
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LPI
December 2024
Price: USD 3,660.00
A semiconductor package substrate for a PC (personal computer) is a material used to attach and connect a semiconductor device (such as a...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Multi-chip Package GaN Chips market was valued at US$ 678 million in 2023 and is anticipated to reach US$ 1288 million by 2030, witnessing...
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MRRPB5
November 2024
Price: USD 2,900.00
Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for Advanced Electronic Packaging Materials was valued at US$ 11220 million in the year 2024 and is projected to reach a revised...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for 3D-IC Packaging was valued at US$ 18470 million in the year 2024 and is projected to reach a revised size of US$ 29850 million...
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MRRPB5
January 2025
Price: USD 2,900.00
Package on package (PoP packaging), also known as stacked packaging, is one of the very popular three-dimensional overlay technologies developed for...
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MRRPB5
September 2024
Price: USD 2,900.00
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