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Your search for "OSAT" gave back 385 results.
A Fully Automatic Wafer Probe Equipment, is a specialized piece of equipment used in semiconductor and microelectronics testing and characterization...
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LPI
April 2024
Price: USD 3,660.00
Advanced packaging metrology equipment refers to specialized tools and systems used in the semiconductor industry to measure, characterize, and...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Wire Bonding Equipment market size was valued at US$ million in 2023. With growing demand in downstream market, the Wire Bonding Equipment...
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LPI
March 2024
Price: USD 3,660.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
March 2024
Price: USD 2,900.00
Die bonders are specialized semi- or fully-automatic high-precision machine tools used in semiconductor device fabrications. They fix the...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Die Attach Systems market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during...
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MRRPB5
March 2024
Price: USD 2,900.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
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MRRPB5
March 2024
Price: USD 3,950.00
The global Semiconductor Assembly Process Equipment market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
February 2024
Price: USD 3,660.00
The global Semiconductor Assembly & Packaging Equipment market size was valued at US$ million in 2023. With growing demand in downstream market,...
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LPI
February 2024
Price: USD 3,660.00
Die Bonding Equipment is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a board...
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MRRPB5
January 2024
Price: USD 2,900.00
Semiconductor Assembly Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed...
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MRRPB5
January 2024
Price: USD 2,900.00
Semiconductor Assembly Process Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the...
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MRRPB5
January 2024
Price: USD 2,900.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
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MRRPB5
January 2024
Price: USD 2,900.00
The global Ball Bonder Machine market size was valued at US$ 1100.4 million in 2023. With growing demand in downstream market, the Ball Bonder...
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LPI
January 2024
Price: USD 3,660.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
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GIR
September 2024
Price: USD 3,480.00
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