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Your search for "OSAT" gave back 385 results.
The global market for Thermosonic Flip Chip Bonding Machine was valued at US$ 264 million in the year 2023 and is projected to reach a revised size...
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MRRPB5
December 2024
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
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MRRPB5
December 2024
Price: USD 3,950.00
The global market for Analog Tester was valued at US$ 671 million in the year 2023 and is projected to reach a revised size of US$ 1169 million by...
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MRRPB5
December 2024
Price: USD 2,900.00
Semiconductor wafer slicing equipment is mainly used in the packaging process. It is a device that divides wafers containing many chips into wafer...
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MRRPB5
December 2024
Price: USD 3,950.00
The global market for Die Bonder Machinery was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030...
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MRRPB5
December 2024
Price: USD 3,950.00
The global market for DRAM Testers was valued at US$ 557 million in the year 2023 and is projected to reach a revised size of US$ 987 million by 2030...
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MRRPB5
November 2024
Price: USD 2,900.00
The global market for High-Speed Flip Chip Bonder was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for High-Accuracy Flip Chip Bonder was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
November 2024
Price: USD 3,950.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
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MRRPB5
November 2024
Price: USD 3,950.00
A wafer chip sorter is a device used in the semiconductor industry to sort and inspect semiconductor wafers for defects. The global market for Wafer...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for Wafer Probing Machine was estimated to be worth US$ 1158.7 million in 2023 and is forecast to a readjusted size of US$ 1438.1...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for Wafer Probe Equipment was estimated to be worth US$ 1555 million in 2023 and is forecast to a readjusted size of US$ 2264.5...
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MRRPB5
October 2024
Price: USD 3,950.00
The global Wire Bonder and Die Bonder market size was valued at US$ million in 2023. With growing demand in downstream market, the Wire Bonder and...
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LPI
October 2024
Price: USD 3,660.00
Filming on wafers used in the production of semiconductor integrated circuits. The global market for Wafer Level Vacuum Lamination Machine was...
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MRRPB5
October 2024
Price: USD 3,950.00
Semiconductor Assembly Process Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the...
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MRRPB5
September 2024
Price: USD 3,950.00
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