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Your search for "Copper" gave back 518 results.
The global Adhesive Three-Layer Flexible Copper Clad Plate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is...
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LPI
August 2024
Price: USD 3,660.00
The global Adhesive Flexible Copper Clad Plate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to...
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LPI
August 2024
Price: USD 3,660.00
The main substrate for double-sided polyimide copper-clad laminates is polyimide, with copper foil covering both sides of the polyimide substrate,...
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LPI
August 2024
Price: USD 3,660.00
LCP adhesiveless flexible copper clad laminate (FCCL) is a two-layer adhesiveless FCCL with liquid crystal polymer (LCP) as the insulating layer...
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LPI
August 2024
Price: USD 3,660.00
3C copper heat pipe is a heat conduction device used in consumer electronic equipment. It is composed of a copper pipe and an internal medium. By...
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LPI
July 2024
Price: USD 3,660.00
The copper-aluminum composite sheet is an integral component specifically designed for use in lithium batteries. This innovative material seamlessly...
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LPI
July 2024
Price: USD 3,660.00
The global Halogen-Free Polyimide Flexible Copper Clad Plate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is...
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LPI
August 2024
Price: USD 3,660.00
The global Copper Nickel Silicon Lead Frame market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow...
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LPI
July 2024
Price: USD 3,660.00
Fluorinated high-speed copper clad laminate, as the name implies, is a copper clad laminate material containing fluorine. It is usually made of...
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LPI
July 2024
Price: USD 3,660.00
The cloth-paper composite copper-clad substrate is made of fiberglass cloth and bleached wood pulp paper as reinforcing materials, which are...
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LPI
July 2024
Price: USD 3,660.00
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic...
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LPI
May 2024
Price: USD 3,660.00
Peelable ultra-thin copper foil with carrier is a necessary base material for preparing chip packaging substrates and HDI boards. Its thickness is...
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LPI
July 2024
Price: USD 3,660.00
The global Tin-plated Copper Busbar market size was valued at US$ million in 2023. With growing demand in downstream market, the Tin-plated Copper...
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LPI
March 2024
Price: USD 3,660.00
AMB Ceramic Copper Clad Laminate is a type of substrate material used in the manufacturing of printed circuit boards (PCBs). It is designed to...
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LPI
May 2024
Price: USD 3,660.00
The global Copper Needle Type Heat Dissipation Substrate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is...
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LPI
July 2024
Price: USD 3,660.00
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