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Your search for "Consumer Goods Packaging" gave back 48180 results.
The global Ceramic to Metal Package & Shell market size was valued at US$ 2136.5 million in 2023. With growing demand in downstream market, the...
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LPI
October 2024
Price: USD 3,660.00
The global HTCC Package market size is predicted to grow from US$ 3364 million in 2025 to US$ 5081 million in 2031; it is expected to grow at a CAGR...
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LPI
April 2025
Price: USD 3,660.00
The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by...
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MRRPB5
November 2024
Price: USD 3,950.00
Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for...
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MRRPB5
March 2024
Price: USD 2,900.00
Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for...
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GIR
August 2024
Price: USD 3,480.00
The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by...
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MRRPB5
March 2024
Price: USD 2,900.00
The COB packaged optical module is a module that integrates optical devices and electronic chips through chip-on-board packaging technology. The...
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LPI
May 2024
Price: USD 3,660.00
The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by...
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MRRPB5
April 2023
Price: USD 2,900.00
鈥淚ntegrated Device Manufacturer (IDM)鈥� refers to corporations that handles all processes in manufacturing semiconductors. This means one corporation...
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LPI
August 2024
Price: USD 3,660.00
The global market for Flip Chip CSP (FCCSP) Package was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
January 2025
Price: USD 2,900.00
FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Electronic Packaging Materials market size was valued at US$ 5365.4 million in 2023. With growing demand in downstream market, the...
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LPI
January 2024
Price: USD 3,660.00
The global High Temperature Co-Fired Ceramic (HTCC) Packages and Substrates market size was valued at US$ 2136.5 million in 2023. With growing demand...
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LPI
October 2024
Price: USD 3,660.00
The global market for COB Packaged Optical Module was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million...
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MRRPB5
May 2025
Price: USD 2,900.00
FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better...
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MRRPB5
February 2023
Price: USD 2,900.00
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