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Your search for "Bonding Wires" gave back 13417 results.
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
December 2024
Price: USD 4,900.00
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Wire Bonders market size was valued at US$ million in 2023. With growing demand in downstream market, the Wire Bonders is forecast to a...
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LPI
December 2024
Price: USD 3,660.00
The global Wedge Bonding Tools market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of %...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Wire Bonders market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %...
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GIR
December 2024
Price: USD 3,480.00
The global Wire Bonder and Die Bonder market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Wire Bonder and Die Bonder market size was valued at US$ million in 2023. With growing demand in downstream market, the Wire Bonder and...
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LPI
October 2024
Price: USD 3,660.00
The global Diamond Beaded Wire market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR...
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GIR
February 2024
Price: USD 3,480.00
The global Wire Bonder Equipment market size was valued at US$ 996.8 million in 2023. With growing demand in downstream market, the Wire Bonder...
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LPI
September 2024
Price: USD 3,660.00
Single-head die bonding machine is a kind of equipment used in the semiconductor packaging process, mainly used for fixing and welding the connecting...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Dual Ball and Wedge Wire Bonder market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
August 2024
Price: USD 2,900.00
Double-head die bonder is a kind of equipment used to fix and package electronic components. It is commonly used in the semiconductor industry,...
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MRRPB5
August 2024
Price: USD 2,900.00
Thermosonic wire bonder is equipment used in the field of semiconductor packaging. Thermosonic bonding is a method of bonding that utilizes both high...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Semiconductor Assembly Equipment market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
June 2024
Price: USD 3,480.00
The global Semiconductor Assembly Process Equipment market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million...
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GIR
June 2024
Price: USD 3,480.00
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