0 items USD 0.00Search
Your search for "3D packaging" gave back 103505 results.
The global CMP Slurries for Advanced Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
April 2024
Price: USD 2,900.00
The global Interposer and Fan-out Wafer Level Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
June 2024
Price: USD 2,900.00
The Global Polyimides Â鶹Դ´ is expected to grow at a CAGR of 6.9%. Some of the factors such as rising usage of polyimide in automotive and aerospace...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
Stratistics MRC
February 2019
Price: USD 4,150.00
An 3D integrated circuit is a miniature electronic device or component. Adopt a certain process to interconnect transistors, resistors, capacitors,...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
October 2024
Price: USD 3,950.00
The global Advanced Packaging market size was valued at US$ 14560 million in 2023. With growing demand in downstream market, the Advanced Packaging...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
LPI
January 2024
Price: USD 3,660.00
The global Semiconductor Packaging and Testing Technology market size was valued at US$ 12810 million in 2024 and is forecast to a readjusted size of...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
GIR
March 2025
Price: USD 3,480.00
A system in package (SiP) orsystem-in-a-package is a number of integrated circuits enclosed in a single chip carrier package. ...SiP dies can be...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
January 2023
Price: USD 2,900.00
3D encapsulation adhesive is temporary adhesives for 3D packaging that allow silicon wafers to adhere to the glass substrate during the polishing and...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
June 2024
Price: USD 2,900.00
The global 3D Integrated Circuit market size was valued at US$ million in 2023. With growing demand in downstream market, the 3D Integrated Circuit...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
LPI
October 2024
Price: USD 3,660.00
The global Wafer Bonder market size was valued at US$ 330 million in 2024 and is forecast to a readjusted size of USD 462 million by 2031 with a CAGR...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
GIR
July 2025
Price: USD 3,480.00
The global Memory Package Substrate market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of %...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
April 2023
Price: USD 2,900.00
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
January 2023
Price: USD 4,000.00
The global Through Glass Vias (TGV) Packaging Solution market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
November 2023
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
June 2024
Price: USD 2,900.00
3D Bin Picking Robot is an automated robotic system designed to identify, grasp, and manipulate objects from a bin or container in a three-...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
April 2024
Price: USD 2,900.00
Ìý
