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Your search for "3D packaging" gave back 8346 results.
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
March 2023
Price: USD 2,900.00
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2022 and is anticipated to reach US$ 268230 million by 2029,...
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MRRPB5
January 2023
Price: USD 2,900.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
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MRRPB5
January 2023
Price: USD 2,900.00
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die...
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MRRPB5
April 2023
Price: USD 2,900.00
Three-dimensional integrated interposer (3D-IC) is an advanced semiconductor packaging technology that forms a tightly integrated three-dimensional...
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LPI
April 2024
Price: USD 3,660.00
The global 3D Integrated Adapter Board market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast...
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GIR
March 2024
Price: USD 4,480.00
Three-dimensional integrated interposer (3D-IC) is an advanced semiconductor packaging technology that forms a tightly integrated three-dimensional...
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MRRPB5
March 2024
Price: USD 2,900.00
The global 3D Integrated Adapter Board market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with...
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GIR
March 2024
Price: USD 3,480.00
The global 3D IC and 2.5D IC market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of...
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GIR
May 2024
Price: USD 3,480.00
The global 3D TSV market size was valued at US$ million in 2023. With growing demand in downstream market, the 3D TSV is forecast to a readjusted...
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LPI
February 2024
Price: USD 3,660.00
3D Integration is an advanced semiconductor packaging technology that involves stacking multiple layers of integrated circuits (ICs) on top of each...
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MRRPB5
November 2023
Price: USD 2,900.00
The global 3D TSV market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during...
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GIR
July 2024
Price: USD 3,480.00
3D Integration is an advanced semiconductor packaging technology that involves stacking multiple layers of integrated circuits (ICs) on top of each...
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MRRPB5
October 2024
Price: USD 3,950.00
3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect...
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MRRPB5
January 2024
Price: USD 2,900.00
3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect...
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MRRPB5
February 2023
Price: USD 2,900.00
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