Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip on the front of the wafer, so that the grinding machine can grind the silicon wafer on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 渭m. After grinding, the thickness of the wafer becomes 200 渭m, or even reaches the level of 120 渭m. It depends on the customer鈥檚 requirements and the application environment of the chip, that is, the wafer thinning process. Wafer will stick a layer of film on the back of Wafer before slicing. The function of this film is to stick the chip on the film, which can keep the grain intact during the cutting process and reduce the chipping during the cutting process. Ensure that the die will not be displaced and dropped during the normal transfer process, that is, the scribing process in the post-chip packaging and testing process. A film used to fix Wafer and chip is used in chip thinning and dicing process. In the actual production process, this kind of film generally uses UV film
The global market for Wafer Thinning and Dicing UV Film was estimated to be worth US$ 981 million in 2023 and is forecast to a readjusted size of US$ 1216.6 million by 2030 with a CAGR of 3.1% during the forecast period 2024-2030
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Thinning and Dicing UV Film, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Wafer Thinning and Dicing UV Film by region & country, by Type, and by Application.
The Wafer Thinning and Dicing UV Film market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Thinning and Dicing UV Film.
麻豆原创 Segmentation
By Company
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Segment by Type:
Back Grinding UV Film
Wafer Dicing UV Film
Segment by Application
IDMs
OSAT
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Wafer Thinning and Dicing UV Film manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Wafer Thinning and Dicing UV Film in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Wafer Thinning and Dicing UV Film in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 麻豆原创 Overview
1.1 Wafer Thinning and Dicing UV Film Product Introduction
1.2 Global Wafer Thinning and Dicing UV Film 麻豆原创 Size Forecast
1.2.1 Global Wafer Thinning and Dicing UV Film Sales Value (2019-2030)
1.2.2 Global Wafer Thinning and Dicing UV Film Sales Volume (2019-2030)
1.2.3 Global Wafer Thinning and Dicing UV Film Sales Price (2019-2030)
1.3 Wafer Thinning and Dicing UV Film 麻豆原创 Trends & Drivers
1.3.1 Wafer Thinning and Dicing UV Film Industry Trends
1.3.2 Wafer Thinning and Dicing UV Film 麻豆原创 Drivers & Opportunity
1.3.3 Wafer Thinning and Dicing UV Film 麻豆原创 Challenges
1.3.4 Wafer Thinning and Dicing UV Film 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Thinning and Dicing UV Film Players Revenue Ranking (2023)
2.2 Global Wafer Thinning and Dicing UV Film Revenue by Company (2019-2024)
2.3 Global Wafer Thinning and Dicing UV Film Players Sales Volume Ranking (2023)
2.4 Global Wafer Thinning and Dicing UV Film Sales Volume by Company Players (2019-2024)
2.5 Global Wafer Thinning and Dicing UV Film Average Price by Company (2019-2024)
2.6 Key Manufacturers Wafer Thinning and Dicing UV Film Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Wafer Thinning and Dicing UV Film Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Wafer Thinning and Dicing UV Film
2.9 Wafer Thinning and Dicing UV Film 麻豆原创 Competitive Analysis
2.9.1 Wafer Thinning and Dicing UV Film 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Wafer Thinning and Dicing UV Film Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Thinning and Dicing UV Film as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Back Grinding UV Film
3.1.2 Wafer Dicing UV Film
3.2 Global Wafer Thinning and Dicing UV Film Sales Value by Type
3.2.1 Global Wafer Thinning and Dicing UV Film Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Wafer Thinning and Dicing UV Film Sales Value, by Type (2019-2030)
3.2.3 Global Wafer Thinning and Dicing UV Film Sales Value, by Type (%) (2019-2030)
3.3 Global Wafer Thinning and Dicing UV Film Sales Volume by Type
3.3.1 Global Wafer Thinning and Dicing UV Film Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Wafer Thinning and Dicing UV Film Sales Volume, by Type (2019-2030)
3.3.3 Global Wafer Thinning and Dicing UV Film Sales Volume, by Type (%) (2019-2030)
3.4 Global Wafer Thinning and Dicing UV Film Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 IDMs
4.1.2 OSAT
4.2 Global Wafer Thinning and Dicing UV Film Sales Value by Application
4.2.1 Global Wafer Thinning and Dicing UV Film Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Wafer Thinning and Dicing UV Film Sales Value, by Application (2019-2030)
4.2.3 Global Wafer Thinning and Dicing UV Film Sales Value, by Application (%) (2019-2030)
4.3 Global Wafer Thinning and Dicing UV Film Sales Volume by Application
4.3.1 Global Wafer Thinning and Dicing UV Film Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Wafer Thinning and Dicing UV Film Sales Volume, by Application (2019-2030)
4.3.3 Global Wafer Thinning and Dicing UV Film Sales Volume, by Application (%) (2019-2030)
4.4 Global Wafer Thinning and Dicing UV Film Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Wafer Thinning and Dicing UV Film Sales Value by Region
5.1.1 Global Wafer Thinning and Dicing UV Film Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Wafer Thinning and Dicing UV Film Sales Value by Region (2019-2024)
5.1.3 Global Wafer Thinning and Dicing UV Film Sales Value by Region (2025-2030)
5.1.4 Global Wafer Thinning and Dicing UV Film Sales Value by Region (%), (2019-2030)
5.2 Global Wafer Thinning and Dicing UV Film Sales Volume by Region
5.2.1 Global Wafer Thinning and Dicing UV Film Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Wafer Thinning and Dicing UV Film Sales Volume by Region (2019-2024)
5.2.3 Global Wafer Thinning and Dicing UV Film Sales Volume by Region (2025-2030)
5.2.4 Global Wafer Thinning and Dicing UV Film Sales Volume by Region (%), (2019-2030)
5.3 Global Wafer Thinning and Dicing UV Film Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
5.4.2 North America Wafer Thinning and Dicing UV Film Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
5.5.2 Europe Wafer Thinning and Dicing UV Film Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
5.6.2 Asia Pacific Wafer Thinning and Dicing UV Film Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
5.7.2 South America Wafer Thinning and Dicing UV Film Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
5.8.2 Middle East & Africa Wafer Thinning and Dicing UV Film Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Thinning and Dicing UV Film Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Wafer Thinning and Dicing UV Film Sales Value
6.2.1 Key Countries/Regions Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.2.2 Key Countries/Regions Wafer Thinning and Dicing UV Film Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.3.2 United States Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.4.2 Europe Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.5.2 China Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.5.3 China Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.6.2 Japan Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.7.2 South Korea Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.8.2 Southeast Asia Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Wafer Thinning and Dicing UV Film Sales Value, 2019-2030
6.9.2 India Wafer Thinning and Dicing UV Film Sales Value by Type (%), 2023 VS 2030
6.9.3 India Wafer Thinning and Dicing UV Film Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Mitsui Chemicals Tohcello
7.1.1 Mitsui Chemicals Tohcello Company Information
7.1.2 Mitsui Chemicals Tohcello Introduction and Business Overview
7.1.3 Mitsui Chemicals Tohcello Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Mitsui Chemicals Tohcello Wafer Thinning and Dicing UV Film Product Offerings
7.1.5 Mitsui Chemicals Tohcello Recent Development
7.2 LINTEC
7.2.1 LINTEC Company Information
7.2.2 LINTEC Introduction and Business Overview
7.2.3 LINTEC Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.2.4 LINTEC Wafer Thinning and Dicing UV Film Product Offerings
7.2.5 LINTEC Recent Development
7.3 Denka
7.3.1 Denka Company Information
7.3.2 Denka Introduction and Business Overview
7.3.3 Denka Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Denka Wafer Thinning and Dicing UV Film Product Offerings
7.3.5 Denka Recent Development
7.4 Nitto
7.4.1 Nitto Company Information
7.4.2 Nitto Introduction and Business Overview
7.4.3 Nitto Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Nitto Wafer Thinning and Dicing UV Film Product Offerings
7.4.5 Nitto Recent Development
7.5 Furukawa Electric
7.5.1 Furukawa Electric Company Information
7.5.2 Furukawa Electric Introduction and Business Overview
7.5.3 Furukawa Electric Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Furukawa Electric Wafer Thinning and Dicing UV Film Product Offerings
7.5.5 Furukawa Electric Recent Development
7.6 Sumitomo Bakelite
7.6.1 Sumitomo Bakelite Company Information
7.6.2 Sumitomo Bakelite Introduction and Business Overview
7.6.3 Sumitomo Bakelite Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Sumitomo Bakelite Wafer Thinning and Dicing UV Film Product Offerings
7.6.5 Sumitomo Bakelite Recent Development
7.7 D&X
7.7.1 D&X Company Information
7.7.2 D&X Introduction and Business Overview
7.7.3 D&X Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.7.4 D&X Wafer Thinning and Dicing UV Film Product Offerings
7.7.5 D&X Recent Development
7.8 AI Technology
7.8.1 AI Technology Company Information
7.8.2 AI Technology Introduction and Business Overview
7.8.3 AI Technology Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.8.4 AI Technology Wafer Thinning and Dicing UV Film Product Offerings
7.8.5 AI Technology Recent Development
7.9 ULTRON SYSTEM
7.9.1 ULTRON SYSTEM Company Information
7.9.2 ULTRON SYSTEM Introduction and Business Overview
7.9.3 ULTRON SYSTEM Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.9.4 ULTRON SYSTEM Wafer Thinning and Dicing UV Film Product Offerings
7.9.5 ULTRON SYSTEM Recent Development
7.10 maxell
7.10.1 maxell Company Information
7.10.2 maxell Introduction and Business Overview
7.10.3 maxell Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.10.4 maxell Wafer Thinning and Dicing UV Film Product Offerings
7.10.5 maxell Recent Development
7.11 NDS
7.11.1 NDS Company Information
7.11.2 NDS Introduction and Business Overview
7.11.3 NDS Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.11.4 NDS Wafer Thinning and Dicing UV Film Product Offerings
7.11.5 NDS Recent Development
7.12 KGK Chemical
7.12.1 KGK Chemical Company Information
7.12.2 KGK Chemical Introduction and Business Overview
7.12.3 KGK Chemical Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.12.4 KGK Chemical Wafer Thinning and Dicing UV Film Product Offerings
7.12.5 KGK Chemical Recent Development
7.13 NEXTECK
7.13.1 NEXTECK Company Information
7.13.2 NEXTECK Introduction and Business Overview
7.13.3 NEXTECK Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.13.4 NEXTECK Wafer Thinning and Dicing UV Film Product Offerings
7.13.5 NEXTECK Recent Development
7.14 WISE new material
7.14.1 WISE new material Company Information
7.14.2 WISE new material Introduction and Business Overview
7.14.3 WISE new material Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.14.4 WISE new material Wafer Thinning and Dicing UV Film Product Offerings
7.14.5 WISE new material Recent Development
7.15 Vistaic
7.15.1 Vistaic Company Information
7.15.2 Vistaic Introduction and Business Overview
7.15.3 Vistaic Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.15.4 Vistaic Wafer Thinning and Dicing UV Film Product Offerings
7.15.5 Vistaic Recent Development
7.16 Suzhou BoYan Jingjin Photoelectric
7.16.1 Suzhou BoYan Jingjin Photoelectric Company Information
7.16.2 Suzhou BoYan Jingjin Photoelectric Introduction and Business Overview
7.16.3 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing UV Film Sales, Revenue and Gross Margin (2019-2024)
7.16.4 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing UV Film Product Offerings
7.16.5 Suzhou BoYan Jingjin Photoelectric Recent Development
8 Industry Chain Analysis
8.1 Wafer Thinning and Dicing UV Film Industrial Chain
8.2 Wafer Thinning and Dicing UV Film Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Thinning and Dicing UV Film Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Thinning and Dicing UV Film Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
听
听
*If Applicable.
