Through Glass Via (TGV) Wafer - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB504246637

Publication Date:

April 7, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
The global market for Through Glass Via (TGV) Wafer was estimated to be worth US$ 55 million in 2023 and is forecast to a readjusted size of US$ 501.8 million by 2030 with a CAGR of 36.7% during the forecast period 2024-2030
United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Wafer, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Through Glass Via (TGV) Wafer by region & country, by Type, and by Application.
The Through Glass Via (TGV) Wafer market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Wafer.
麻豆原创 Segmentation
By Company
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Segment by Type:
300 mm
200 mm
Below150 mm
Segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Through Glass Via (TGV) Wafer manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Through Glass Via (TGV) Wafer in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Through Glass Via (TGV) Wafer in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 麻豆原创 Overview
1.1 Through Glass Via (TGV) Wafer Product Introduction
1.2 Global Through Glass Via (TGV) Wafer 麻豆原创 Size Forecast
1.3 Through Glass Via (TGV) Wafer 麻豆原创 Trends & Drivers
1.3.1 Through Glass Via (TGV) Wafer Industry Trends
1.3.2 Through Glass Via (TGV) Wafer 麻豆原创 Drivers & Opportunity
1.3.3 Through Glass Via (TGV) Wafer 麻豆原创 Challenges
1.3.4 Through Glass Via (TGV) Wafer 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Through Glass Via (TGV) Wafer Players Revenue Ranking (2023)
2.2 Global Through Glass Via (TGV) Wafer Revenue by Company (2019-2024)
2.3 Key Companies Through Glass Via (TGV) Wafer Manufacturing Base Distribution and Headquarters
2.4 Key Companies Through Glass Via (TGV) Wafer Product Offered
2.5 Key Companies Time to Begin Mass Production of Through Glass Via (TGV) Wafer
2.6 Through Glass Via (TGV) Wafer 麻豆原创 Competitive Analysis
2.6.1 Through Glass Via (TGV) Wafer 麻豆原创 Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Through Glass Via (TGV) Wafer Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Wafer as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 300 mm
3.1.2 200 mm
3.1.3 Below150 mm
3.2 Global Through Glass Via (TGV) Wafer Sales Value by Type
3.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Type (2019-2030)
3.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Biotechnology/Medical
4.1.2 Consumer Electronics
4.1.3 Automotive
4.1.4 Others
4.2 Global Through Glass Via (TGV) Wafer Sales Value by Application
4.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Application (2019-2030)
4.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Through Glass Via (TGV) Wafer Sales Value by Region
5.1.1 Global Through Glass Via (TGV) Wafer Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Through Glass Via (TGV) Wafer Sales Value by Region (2019-2024)
5.1.3 Global Through Glass Via (TGV) Wafer Sales Value by Region (2025-2030)
5.1.4 Global Through Glass Via (TGV) Wafer Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Through Glass Via (TGV) Wafer Sales Value, 2019-2030
5.2.2 North America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2019-2030
5.3.2 Europe Through Glass Via (TGV) Wafer Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Through Glass Via (TGV) Wafer Sales Value, 2019-2030
5.4.2 Asia Pacific Through Glass Via (TGV) Wafer Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Through Glass Via (TGV) Wafer Sales Value, 2019-2030
5.5.2 South America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value, 2019-2030
5.6.2 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value
6.3 United States
6.3.1 United States Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.3.2 United States Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.4.2 Europe Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.5.2 China Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.5.3 China Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.6.2 Japan Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.7.2 South Korea Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.8.2 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Through Glass Via (TGV) Wafer Sales Value, 2019-2030
6.9.2 India Through Glass Via (TGV) Wafer Sales Value by Type (%), 2023 VS 2030
6.9.3 India Through Glass Via (TGV) Wafer Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Corning
7.1.1 Corning Profile
7.1.2 Corning Main Business
7.1.3 Corning Through Glass Via (TGV) Wafer Products, Services and Solutions
7.1.4 Corning Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.1.5 Corning Recent Developments
7.2 LPKF
7.2.1 LPKF Profile
7.2.2 LPKF Main Business
7.2.3 LPKF Through Glass Via (TGV) Wafer Products, Services and Solutions
7.2.4 LPKF Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.2.5 LPKF Recent Developments
7.3 Samtec
7.3.1 Samtec Profile
7.3.2 Samtec Main Business
7.3.3 Samtec Through Glass Via (TGV) Wafer Products, Services and Solutions
7.3.4 Samtec Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.3.5 Kiso Micro Co.LTD Recent Developments
7.4 Kiso Micro Co.LTD
7.4.1 Kiso Micro Co.LTD Profile
7.4.2 Kiso Micro Co.LTD Main Business
7.4.3 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Products, Services and Solutions
7.4.4 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.4.5 Kiso Micro Co.LTD Recent Developments
7.5 Tecnisco
7.5.1 Tecnisco Profile
7.5.2 Tecnisco Main Business
7.5.3 Tecnisco Through Glass Via (TGV) Wafer Products, Services and Solutions
7.5.4 Tecnisco Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.5.5 Tecnisco Recent Developments
7.6 Microplex
7.6.1 Microplex Profile
7.6.2 Microplex Main Business
7.6.3 Microplex Through Glass Via (TGV) Wafer Products, Services and Solutions
7.6.4 Microplex Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.6.5 Microplex Recent Developments
7.7 Plan Optik
7.7.1 Plan Optik Profile
7.7.2 Plan Optik Main Business
7.7.3 Plan Optik Through Glass Via (TGV) Wafer Products, Services and Solutions
7.7.4 Plan Optik Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.7.5 Plan Optik Recent Developments
7.8 NSG Group
7.8.1 NSG Group Profile
7.8.2 NSG Group Main Business
7.8.3 NSG Group Through Glass Via (TGV) Wafer Products, Services and Solutions
7.8.4 NSG Group Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.8.5 NSG Group Recent Developments
7.9 Allvia
7.9.1 Allvia Profile
7.9.2 Allvia Main Business
7.9.3 Allvia Through Glass Via (TGV) Wafer Products, Services and Solutions
7.9.4 Allvia Through Glass Via (TGV) Wafer Revenue (US$ Million) & (2019-2024)
7.9.5 Allvia Recent Developments
8 Industry Chain Analysis
8.1 Through Glass Via (TGV) Wafer Industrial Chain
8.2 Through Glass Via (TGV) Wafer Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Through Glass Via (TGV) Wafer Sales Model
8.5.2 Sales Channel
8.5.3 Through Glass Via (TGV) Wafer Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

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