Small Outline Integrated Circuit (SOIC) Package - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB509247703

Publication Date:

September 5, 2024

Pages:

137

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

A听small outline integrated circuit听(SOIC) is a听surface-mounted听integrated circuit听(IC) package which occupies an area about 30鈥�50% less than an equivalent听dual in-line package听(DIP), with a typical thickness being 70% less. They are generally available in the same听pin-outs听as their counterpart DIP ICs. The convention for naming the package is听SOIC听or听SO听followed by the number of pins.
The global market for Small Outline Integrated Circuit (SOIC) Package was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Small Outline Integrated Circuit (SOIC) Package, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Small Outline Integrated Circuit (SOIC) Package by region & country, by Type, and by Application.
The Small Outline Integrated Circuit (SOIC) Package market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Small Outline Integrated Circuit (SOIC) Package.
麻豆原创 Segmentation
By Company
3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Johnstech International
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
Socionext America Inc
WinWay Technology Co
ChipMOS Technologies Inc
Yamaichi Electronics
Segment by Type:
Mini-SOIC
Small Outline J-Lead Package
Others
Segment by Application
Industrial
Consumer Electronics
Automotive
Medical Devices
Military and Defense
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Small Outline Integrated Circuit (SOIC) Package manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Small Outline Integrated Circuit (SOIC) Package in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Small Outline Integrated Circuit (SOIC) Package in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 麻豆原创 Overview
1.1 Small Outline Integrated Circuit (SOIC) Package Product Introduction
1.2 Global Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Size Forecast
1.2.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Value (2019-2030)
1.2.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume (2019-2030)
1.2.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Price (2019-2030)
1.3 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Trends & Drivers
1.3.1 Small Outline Integrated Circuit (SOIC) Package Industry Trends
1.3.2 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Drivers & Opportunity
1.3.3 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Challenges
1.3.4 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Small Outline Integrated Circuit (SOIC) Package Players Revenue Ranking (2023)
2.2 Global Small Outline Integrated Circuit (SOIC) Package Revenue by Company (2019-2024)
2.3 Global Small Outline Integrated Circuit (SOIC) Package Players Sales Volume Ranking (2023)
2.4 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Company Players (2019-2024)
2.5 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Company (2019-2024)
2.6 Key Manufacturers Small Outline Integrated Circuit (SOIC) Package Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Small Outline Integrated Circuit (SOIC) Package Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Small Outline Integrated Circuit (SOIC) Package
2.9 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Competitive Analysis
2.9.1 Small Outline Integrated Circuit (SOIC) Package 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Small Outline Integrated Circuit (SOIC) Package Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Small Outline Integrated Circuit (SOIC) Package as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Mini-SOIC
3.1.2 Small Outline J-Lead Package
3.1.3 Others
3.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Type
3.2.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Value, by Type (2019-2030)
3.2.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Value, by Type (%) (2019-2030)
3.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Type
3.3.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume, by Type (2019-2030)
3.3.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume, by Type (%) (2019-2030)
3.4 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Industrial
4.1.2 Consumer Electronics
4.1.3 Automotive
4.1.4 Medical Devices
4.1.5 Military and Defense
4.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Application
4.2.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Value, by Application (2019-2030)
4.2.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Value, by Application (%) (2019-2030)
4.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Application
4.3.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume, by Application (2019-2030)
4.3.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume, by Application (%) (2019-2030)
4.4 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Region
5.1.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Region (2019-2024)
5.1.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Region (2025-2030)
5.1.4 Global Small Outline Integrated Circuit (SOIC) Package Sales Value by Region (%), (2019-2030)
5.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Region
5.2.1 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Region (2019-2024)
5.2.3 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Region (2025-2030)
5.2.4 Global Small Outline Integrated Circuit (SOIC) Package Sales Volume by Region (%), (2019-2030)
5.3 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
5.4.2 North America Small Outline Integrated Circuit (SOIC) Package Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
5.5.2 Europe Small Outline Integrated Circuit (SOIC) Package Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
5.6.2 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
5.7.2 South America Small Outline Integrated Circuit (SOIC) Package Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
5.8.2 Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Small Outline Integrated Circuit (SOIC) Package Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Small Outline Integrated Circuit (SOIC) Package Sales Value
6.2.1 Key Countries/Regions Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.2.2 Key Countries/Regions Small Outline Integrated Circuit (SOIC) Package Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.3.2 United States Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.4.2 Europe Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.5.2 China Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.5.3 China Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.6.2 Japan Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.7.2 South Korea Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.8.2 Southeast Asia Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Small Outline Integrated Circuit (SOIC) Package Sales Value, 2019-2030
6.9.2 India Small Outline Integrated Circuit (SOIC) Package Sales Value by Type (%), 2023 VS 2030
6.9.3 India Small Outline Integrated Circuit (SOIC) Package Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 3M
7.1.1 3M Company Information
7.1.2 3M Introduction and Business Overview
7.1.3 3M Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.1.4 3M Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.1.5 3M Recent Development
7.2 Enplas Corporation
7.2.1 Enplas Corporation Company Information
7.2.2 Enplas Corporation Introduction and Business Overview
7.2.3 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.2.5 Enplas Corporation Recent Development
7.3 Toshiba Electronic Devices and Storage Corporation
7.3.1 Toshiba Electronic Devices and Storage Corporation Company Information
7.3.2 Toshiba Electronic Devices and Storage Corporation Introduction and Business Overview
7.3.3 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.3.5 Toshiba Electronic Devices and Storage Corporation Recent Development
7.4 Intel Corporation
7.4.1 Intel Corporation Company Information
7.4.2 Intel Corporation Introduction and Business Overview
7.4.3 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.4.5 Intel Corporation Recent Development
7.5 Loranger International Corporation
7.5.1 Loranger International Corporation Company Information
7.5.2 Loranger International Corporation Introduction and Business Overview
7.5.3 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.5.5 Loranger International Corporation Recent Development
7.6 Komachine
7.6.1 Komachine Company Information
7.6.2 Komachine Introduction and Business Overview
7.6.3 Komachine Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Komachine Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.6.5 Komachine Recent Development
7.7 Aries Electronics Inc
7.7.1 Aries Electronics Inc Company Information
7.7.2 Aries Electronics Inc Introduction and Business Overview
7.7.3 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.7.5 Aries Electronics Inc Recent Development
7.8 Johnstech International
7.8.1 Johnstech International Company Information
7.8.2 Johnstech International Introduction and Business Overview
7.8.3 Johnstech International Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Johnstech International Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.8.5 Johnstech International Recent Development
7.9 Mill-Max Manufacturing Corporation
7.9.1 Mill-Max Manufacturing Corporation Company Information
7.9.2 Mill-Max Manufacturing Corporation Introduction and Business Overview
7.9.3 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.9.5 Mill-Max Manufacturing Corporation Recent Development
7.10 Molex
7.10.1 Molex Company Information
7.10.2 Molex Introduction and Business Overview
7.10.3 Molex Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Molex Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.10.5 Molex Recent Development
7.11 Foxconn
7.11.1 Foxconn Company Information
7.11.2 Foxconn Introduction and Business Overview
7.11.3 Foxconn Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Foxconn Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.11.5 Foxconn Recent Development
7.12 Sensata Technologies
7.12.1 Sensata Technologies Company Information
7.12.2 Sensata Technologies Introduction and Business Overview
7.12.3 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.12.5 Sensata Technologies Recent Development
7.13 Plastronics
7.13.1 Plastronics Company Information
7.13.2 Plastronics Introduction and Business Overview
7.13.3 Plastronics Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Plastronics Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.13.5 Plastronics Recent Development
7.14 TE Connectivity
7.14.1 TE Connectivity Company Information
7.14.2 TE Connectivity Introduction and Business Overview
7.14.3 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.14.4 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.14.5 TE Connectivity Recent Development
7.15 Socionext America Inc
7.15.1 Socionext America Inc Company Information
7.15.2 Socionext America Inc Introduction and Business Overview
7.15.3 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.15.4 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.15.5 Socionext America Inc Recent Development
7.16 WinWay Technology Co
7.16.1 WinWay Technology Co Company Information
7.16.2 WinWay Technology Co Introduction and Business Overview
7.16.3 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.16.4 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.16.5 WinWay Technology Co Recent Development
7.17 ChipMOS Technologies Inc
7.17.1 ChipMOS Technologies Inc Company Information
7.17.2 ChipMOS Technologies Inc Introduction and Business Overview
7.17.3 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.17.4 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.17.5 ChipMOS Technologies Inc Recent Development
7.18 Yamaichi Electronics
7.18.1 Yamaichi Electronics Company Information
7.18.2 Yamaichi Electronics Introduction and Business Overview
7.18.3 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Sales, Revenue and Gross Margin (2019-2024)
7.18.4 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Product Offerings
7.18.5 Yamaichi Electronics Recent Development
8 Industry Chain Analysis
8.1 Small Outline Integrated Circuit (SOIC) Package Industrial Chain
8.2 Small Outline Integrated Circuit (SOIC) Package Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Small Outline Integrated Circuit (SOIC) Package Sales Model
8.5.2 Sales Channel
8.5.3 Small Outline Integrated Circuit (SOIC) Package Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Johnstech International
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
Socionext America Inc
WinWay Technology Co
ChipMOS Technologies Inc
Yamaichi Electronics

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