Semiconductor FOUP and FOSB - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB504240927

Publication Date:

April 30, 2024

Pages:

100

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Semiconductor FOUP and FOSB are the containers to transfer the wafers safely. The Semiconductor FOUP and FOSB can be opened and closed with the help of robot to support the existing automation in the wafer transport and shipping. The Semiconductor FOUP and FOSB must comply with the semiconductor industry standards such as M31, E15.1, E57, E62 and others. The wafer transport box is so designed that it increases the wafer position accuracy along with its operability. The wafer transport box offers removable gasket that provides protection for external contamination. The wafer shipping boxes, or wafer transport box are packaged in horizontal wafer shippers and vertical wafer shippers. The advanced Semiconductor FOUP and FOSB offer benefits over the traditional mid-range and low range wafer carriers. Some of them include precise wafer access, reliable equipment operation with automated handling systems and secured wafer protection against damage and contamination.
The global market for Semiconductor FOUP and FOSB was estimated to be worth US$ 724.6 million in 2023 and is forecast to a readjusted size of US$ 1152.8 million by 2030 with a CAGR of 7.1% during the forecast period 2024-2030
The major manufacturers of global semiconductor FOUP and FOSB wafer cassettes are Entegris, Shin-Etsu Polymer, Miraial, Chuang King Enterprise, Gudeng Precision, 3S Korea, Dainichi Shoji, etc. The top three manufacturers together occupy more than 85% of the market share, of which the largest producer is Entegris, with a market share of 54.08%. Global semiconductor FOUP and FOSB wafer box production regions are mainly located in North America, Japan and Taiwan (China), etc. The top three regions occupy more than 95% of the market share. In terms of their product categories, In-process wafer transport boxes(FOUP) have a higher market share of 73.55%, while shipment wafer transport boxe(FOSB) account for a lower share. In terms of its applications, 300mm wafers are its top application area with a 97.91% market share, while 200mm wafers account for a lower share.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor FOUP and FOSB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor FOUP and FOSB by region & country, by Type, and by Wafer Size.
The Semiconductor FOUP and FOSB market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor FOUP and FOSB.
麻豆原创 Segmentation
By Company
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
Segment by Type:
FOUP
FOSB
Segment by Wafer Size
300 mm Wafer
200 mm Wafer
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor FOUP and FOSB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor FOUP and FOSB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor FOUP and FOSB in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 麻豆原创 Overview
1.1 Semiconductor FOUP and FOSB Product Introduction
1.2 Global Semiconductor FOUP and FOSB 麻豆原创 Size Forecast
1.2.1 Global Semiconductor FOUP and FOSB Sales Value (2019-2030)
1.2.2 Global Semiconductor FOUP and FOSB Sales Volume (2019-2030)
1.2.3 Global Semiconductor FOUP and FOSB Sales Price (2019-2030)
1.3 Semiconductor FOUP and FOSB 麻豆原创 Trends & Drivers
1.3.1 Semiconductor FOUP and FOSB Industry Trends
1.3.2 Semiconductor FOUP and FOSB 麻豆原创 Drivers & Opportunity
1.3.3 Semiconductor FOUP and FOSB 麻豆原创 Challenges
1.3.4 Semiconductor FOUP and FOSB 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Semiconductor FOUP and FOSB Players Revenue Ranking (2023)
2.2 Global Semiconductor FOUP and FOSB Revenue by Company (2019-2024)
2.3 Global Semiconductor FOUP and FOSB Players Sales Volume Ranking (2023)
2.4 Global Semiconductor FOUP and FOSB Sales Volume by Company Players (2019-2024)
2.5 Global Semiconductor FOUP and FOSB Average Price by Company (2019-2024)
2.6 Key Manufacturers Semiconductor FOUP and FOSB Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Semiconductor FOUP and FOSB Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor FOUP and FOSB
2.9 Semiconductor FOUP and FOSB 麻豆原创 Competitive Analysis
2.9.1 Semiconductor FOUP and FOSB 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor FOUP and FOSB Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor FOUP and FOSB as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 FOUP
3.1.2 FOSB
3.2 Global Semiconductor FOUP and FOSB Sales Value by Type
3.2.1 Global Semiconductor FOUP and FOSB Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Semiconductor FOUP and FOSB Sales Value, by Type (2019-2030)
3.2.3 Global Semiconductor FOUP and FOSB Sales Value, by Type (%) (2019-2030)
3.3 Global Semiconductor FOUP and FOSB Sales Volume by Type
3.3.1 Global Semiconductor FOUP and FOSB Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Semiconductor FOUP and FOSB Sales Volume, by Type (2019-2030)
3.3.3 Global Semiconductor FOUP and FOSB Sales Volume, by Type (%) (2019-2030)
3.4 Global Semiconductor FOUP and FOSB Average Price by Type (2019-2030)
4 Segmentation by Wafer Size
4.1 Introduction by Wafer Size
4.1.1 300 mm Wafer
4.1.2 200 mm Wafer
4.2 Global Semiconductor FOUP and FOSB Sales Value by Wafer Size
4.2.1 Global Semiconductor FOUP and FOSB Sales Value by Wafer Size (2019 VS 2023 VS 2030)
4.2.2 Global Semiconductor FOUP and FOSB Sales Value, by Wafer Size (2019-2030)
4.2.3 Global Semiconductor FOUP and FOSB Sales Value, by Wafer Size (%) (2019-2030)
4.3 Global Semiconductor FOUP and FOSB Sales Volume by Wafer Size
4.3.1 Global Semiconductor FOUP and FOSB Sales Volume by Wafer Size (2019 VS 2023 VS 2030)
4.3.2 Global Semiconductor FOUP and FOSB Sales Volume, by Wafer Size (2019-2030)
4.3.3 Global Semiconductor FOUP and FOSB Sales Volume, by Wafer Size (%) (2019-2030)
4.4 Global Semiconductor FOUP and FOSB Average Price by Wafer Size (2019-2030)
5 Segmentation by Region
5.1 Global Semiconductor FOUP and FOSB Sales Value by Region
5.1.1 Global Semiconductor FOUP and FOSB Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Semiconductor FOUP and FOSB Sales Value by Region (2019-2024)
5.1.3 Global Semiconductor FOUP and FOSB Sales Value by Region (2025-2030)
5.1.4 Global Semiconductor FOUP and FOSB Sales Value by Region (%), (2019-2030)
5.2 Global Semiconductor FOUP and FOSB Sales Volume by Region
5.2.1 Global Semiconductor FOUP and FOSB Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Semiconductor FOUP and FOSB Sales Volume by Region (2019-2024)
5.2.3 Global Semiconductor FOUP and FOSB Sales Volume by Region (2025-2030)
5.2.4 Global Semiconductor FOUP and FOSB Sales Volume by Region (%), (2019-2030)
5.3 Global Semiconductor FOUP and FOSB Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Semiconductor FOUP and FOSB Sales Value, 2019-2030
5.4.2 North America Semiconductor FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Semiconductor FOUP and FOSB Sales Value, 2019-2030
5.5.2 Europe Semiconductor FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Semiconductor FOUP and FOSB Sales Value, 2019-2030
5.6.2 Asia Pacific Semiconductor FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Semiconductor FOUP and FOSB Sales Value, 2019-2030
5.7.2 South America Semiconductor FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Semiconductor FOUP and FOSB Sales Value, 2019-2030
5.8.2 Middle East & Africa Semiconductor FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Semiconductor FOUP and FOSB Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Semiconductor FOUP and FOSB Sales Value
6.2.1 Key Countries/Regions Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.2.2 Key Countries/Regions Semiconductor FOUP and FOSB Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.3.2 United States Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.4 Europe
6.4.1 Europe Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.4.2 Europe Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.5 China
6.5.1 China Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.5.2 China Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.5.3 China Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.6 Japan
6.6.1 Japan Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.6.2 Japan Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.7.2 South Korea Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.8.2 Southeast Asia Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
6.9 India
6.9.1 India Semiconductor FOUP and FOSB Sales Value, 2019-2030
6.9.2 India Semiconductor FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.9.3 India Semiconductor FOUP and FOSB Sales Value by Wafer Size, 2023 VS 2030
7 Company Profiles
7.1 Entegris
7.1.1 Entegris Company Information
7.1.2 Entegris Introduction and Business Overview
7.1.3 Entegris Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Entegris Semiconductor FOUP and FOSB Product Offerings
7.1.5 Entegris Recent Development
7.2 Shin-Etsu Polymer
7.2.1 Shin-Etsu Polymer Company Information
7.2.2 Shin-Etsu Polymer Introduction and Business Overview
7.2.3 Shin-Etsu Polymer Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Shin-Etsu Polymer Semiconductor FOUP and FOSB Product Offerings
7.2.5 Shin-Etsu Polymer Recent Development
7.3 Miraial
7.3.1 Miraial Company Information
7.3.2 Miraial Introduction and Business Overview
7.3.3 Miraial Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Miraial Semiconductor FOUP and FOSB Product Offerings
7.3.5 Miraial Recent Development
7.4 Chuang King Enterprise
7.4.1 Chuang King Enterprise Company Information
7.4.2 Chuang King Enterprise Introduction and Business Overview
7.4.3 Chuang King Enterprise Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Chuang King Enterprise Semiconductor FOUP and FOSB Product Offerings
7.4.5 Chuang King Enterprise Recent Development
7.5 Gudeng Precision
7.5.1 Gudeng Precision Company Information
7.5.2 Gudeng Precision Introduction and Business Overview
7.5.3 Gudeng Precision Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Gudeng Precision Semiconductor FOUP and FOSB Product Offerings
7.5.5 Gudeng Precision Recent Development
7.6 3S Korea
7.6.1 3S Korea Company Information
7.6.2 3S Korea Introduction and Business Overview
7.6.3 3S Korea Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.6.4 3S Korea Semiconductor FOUP and FOSB Product Offerings
7.6.5 3S Korea Recent Development
7.7 Dainichi Shoji
7.7.1 Dainichi Shoji Company Information
7.7.2 Dainichi Shoji Introduction and Business Overview
7.7.3 Dainichi Shoji Semiconductor FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Dainichi Shoji Semiconductor FOUP and FOSB Product Offerings
7.7.5 Dainichi Shoji Recent Development
8 Industry Chain Analysis
8.1 Semiconductor FOUP and FOSB Industrial Chain
8.2 Semiconductor FOUP and FOSB Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Semiconductor FOUP and FOSB Sales Model
8.5.2 Sales Channel
8.5.3 Semiconductor FOUP and FOSB Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji

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