A plasma etch system is a type of manufacturing technology that is used to etch or remove specific layers of material from a semiconductor wafer during the manufacturing process. It is a critical process in the semiconductor industry for creating microelectronic devices with high precision.
The plasma etch process involves using a reactive gas plasma to remove material from the wafer's surface selectively. The plasma is created by introducing a gas, such as oxygen or chlorine, into a vacuum chamber and ionizing it using a radio-frequency (RF) power source. The resulting plasma contains a mix of ions, electrons, and reactive species that can react with the material on the surface of the wafer and etch it away.
The plasma etch system typically consists of several components: the vacuum chamber, gas delivery system, RF power source, and control software. The vacuum chamber provides a low-pressure environment for the plasma to form, while the gas delivery system introduces the reactive gas into the chamber. The RF power source provides the energy needed to ionize the gas and create the plasma. At the same time, the control software regulates the process parameters, such as gas flow rate, RF power, and pressure, to achieve the desired etch rate and selectivity.
Plasma etching can be used to etch a wide range of materials, including silicon, oxide, nitride, and metal layers, with high selectivity and precision. It is an essential technology for creating advanced microelectronic devices, such as microprocessors, memory chips, and sensors, with sub-micron features and high aspect ratios.
Highlights
The global Plasma Etch System for Wafer Processing market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Plasma Etch System for Wafer Processing is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Plasma Etch System for Wafer Processing is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Plasma Etch System for Wafer Processing include Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO, Applied Materials, Sentech and SPTS Technologies (an Orbotech Company), etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Plasma Etch System for Wafer Processing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plasma Etch System for Wafer Processing.
The Plasma Etch System for Wafer Processing market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Plasma Etch System for Wafer Processing market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Plasma Etch System for Wafer Processing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Segment by Type
Segment by Application
Production by Region
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Plasma Etch System for Wafer Processing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Plasma Etch System for Wafer Processing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Plasma Etch System for Wafer Processing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 Plasma Etch System for Wafer Processing 麻豆原创 Overview
1.1 Product Definition
1.2 Plasma Etch System for Wafer Processing Segment by Type
1.2.1 Global Plasma Etch System for Wafer Processing 麻豆原创 Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Inductively Coupled Plasma (ICP)
1.2.3 Reactive Ion Etching (RIE)
1.2.4 Deep Reactive Ion Etching (DRIE)
1.3 Plasma Etch System for Wafer Processing Segment by Application
1.3.1 Global Plasma Etch System for Wafer Processing 麻豆原创 Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor
1.3.3 Electronics and Microelectronics
1.3.4 Other
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Plasma Etch System for Wafer Processing Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Plasma Etch System for Wafer Processing Production Estimates and Forecasts (2018-2029)
1.4.4 Global Plasma Etch System for Wafer Processing 麻豆原创 Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Plasma Etch System for Wafer Processing Production 麻豆原创 Share by Manufacturers (2018-2023)
2.2 Global Plasma Etch System for Wafer Processing Production Value 麻豆原创 Share by Manufacturers (2018-2023)
2.3 Global Key Players of Plasma Etch System for Wafer Processing, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Plasma Etch System for Wafer Processing 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Plasma Etch System for Wafer Processing Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Plasma Etch System for Wafer Processing, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Plasma Etch System for Wafer Processing, Product Offered and Application
2.8 Global Key Manufacturers of Plasma Etch System for Wafer Processing, Date of Enter into This Industry
2.9 Plasma Etch System for Wafer Processing 麻豆原创 Competitive Situation and Trends
2.9.1 Plasma Etch System for Wafer Processing 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Plasma Etch System for Wafer Processing Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Plasma Etch System for Wafer Processing Production by Region
3.1 Global Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Plasma Etch System for Wafer Processing Production Value by Region (2018-2029)
3.2.1 Global Plasma Etch System for Wafer Processing Production Value 麻豆原创 Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Plasma Etch System for Wafer Processing by Region (2024-2029)
3.3 Global Plasma Etch System for Wafer Processing Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Plasma Etch System for Wafer Processing Production by Region (2018-2029)
3.4.1 Global Plasma Etch System for Wafer Processing Production 麻豆原创 Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Plasma Etch System for Wafer Processing by Region (2024-2029)
3.5 Global Plasma Etch System for Wafer Processing 麻豆原创 Price Analysis by Region (2018-2023)
3.6 Global Plasma Etch System for Wafer Processing Production and Value, Year-over-Year Growth
3.6.1 North America Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Plasma Etch System for Wafer Processing Production Value Estimates and Forecasts (2018-2029)
4 Plasma Etch System for Wafer Processing Consumption by Region
4.1 Global Plasma Etch System for Wafer Processing Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Plasma Etch System for Wafer Processing Consumption by Region (2018-2029)
4.2.1 Global Plasma Etch System for Wafer Processing Consumption by Region (2018-2023)
4.2.2 Global Plasma Etch System for Wafer Processing Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Plasma Etch System for Wafer Processing Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Plasma Etch System for Wafer Processing Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Plasma Etch System for Wafer Processing Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Plasma Etch System for Wafer Processing Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Plasma Etch System for Wafer Processing Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Plasma Etch System for Wafer Processing Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Plasma Etch System for Wafer Processing Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Plasma Etch System for Wafer Processing Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Plasma Etch System for Wafer Processing Production by Type (2018-2029)
5.1.1 Global Plasma Etch System for Wafer Processing Production by Type (2018-2023)
5.1.2 Global Plasma Etch System for Wafer Processing Production by Type (2024-2029)
5.1.3 Global Plasma Etch System for Wafer Processing Production 麻豆原创 Share by Type (2018-2029)
5.2 Global Plasma Etch System for Wafer Processing Production Value by Type (2018-2029)
5.2.1 Global Plasma Etch System for Wafer Processing Production Value by Type (2018-2023)
5.2.2 Global Plasma Etch System for Wafer Processing Production Value by Type (2024-2029)
5.2.3 Global Plasma Etch System for Wafer Processing Production Value 麻豆原创 Share by Type (2018-2029)
5.3 Global Plasma Etch System for Wafer Processing Price by Type (2018-2029)
6 Segment by Application
6.1 Global Plasma Etch System for Wafer Processing Production by Application (2018-2029)
6.1.1 Global Plasma Etch System for Wafer Processing Production by Application (2018-2023)
6.1.2 Global Plasma Etch System for Wafer Processing Production by Application (2024-2029)
6.1.3 Global Plasma Etch System for Wafer Processing Production 麻豆原创 Share by Application (2018-2029)
6.2 Global Plasma Etch System for Wafer Processing Production Value by Application (2018-2029)
6.2.1 Global Plasma Etch System for Wafer Processing Production Value by Application (2018-2023)
6.2.2 Global Plasma Etch System for Wafer Processing Production Value by Application (2024-2029)
6.2.3 Global Plasma Etch System for Wafer Processing Production Value 麻豆原创 Share by Application (2018-2029)
6.3 Global Plasma Etch System for Wafer Processing Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Oxford Instruments
7.1.1 Oxford Instruments Plasma Etch System for Wafer Processing Corporation Information
7.1.2 Oxford Instruments Plasma Etch System for Wafer Processing Product Portfolio
7.1.3 Oxford Instruments Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Oxford Instruments Main Business and 麻豆原创s Served
7.1.5 Oxford Instruments Recent Developments/Updates
7.2 ULVAC
7.2.1 ULVAC Plasma Etch System for Wafer Processing Corporation Information
7.2.2 ULVAC Plasma Etch System for Wafer Processing Product Portfolio
7.2.3 ULVAC Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.2.4 ULVAC Main Business and 麻豆原创s Served
7.2.5 ULVAC Recent Developments/Updates
7.3 Lam Research
7.3.1 Lam Research Plasma Etch System for Wafer Processing Corporation Information
7.3.2 Lam Research Plasma Etch System for Wafer Processing Product Portfolio
7.3.3 Lam Research Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Lam Research Main Business and 麻豆原创s Served
7.3.5 Lam Research Recent Developments/Updates
7.4 AMEC
7.4.1 AMEC Plasma Etch System for Wafer Processing Corporation Information
7.4.2 AMEC Plasma Etch System for Wafer Processing Product Portfolio
7.4.3 AMEC Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.4.4 AMEC Main Business and 麻豆原创s Served
7.4.5 AMEC Recent Developments/Updates
7.5 PlasmaTherm
7.5.1 PlasmaTherm Plasma Etch System for Wafer Processing Corporation Information
7.5.2 PlasmaTherm Plasma Etch System for Wafer Processing Product Portfolio
7.5.3 PlasmaTherm Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.5.4 PlasmaTherm Main Business and 麻豆原创s Served
7.5.5 PlasmaTherm Recent Developments/Updates
7.6 SAMCO
7.6.1 SAMCO Plasma Etch System for Wafer Processing Corporation Information
7.6.2 SAMCO Plasma Etch System for Wafer Processing Product Portfolio
7.6.3 SAMCO Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.6.4 SAMCO Main Business and 麻豆原创s Served
7.6.5 SAMCO Recent Developments/Updates
7.7 Applied Materials
7.7.1 Applied Materials Plasma Etch System for Wafer Processing Corporation Information
7.7.2 Applied Materials Plasma Etch System for Wafer Processing Product Portfolio
7.7.3 Applied Materials Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Applied Materials Main Business and 麻豆原创s Served
7.7.5 Applied Materials Recent Developments/Updates
7.8 Sentech
7.8.1 Sentech Plasma Etch System for Wafer Processing Corporation Information
7.8.2 Sentech Plasma Etch System for Wafer Processing Product Portfolio
7.8.3 Sentech Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Sentech Main Business and 麻豆原创s Served
7.7.5 Sentech Recent Developments/Updates
7.9 SPTS Technologies (an Orbotech Company)
7.9.1 SPTS Technologies (an Orbotech Company) Plasma Etch System for Wafer Processing Corporation Information
7.9.2 SPTS Technologies (an Orbotech Company) Plasma Etch System for Wafer Processing Product Portfolio
7.9.3 SPTS Technologies (an Orbotech Company) Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.9.4 SPTS Technologies (an Orbotech Company) Main Business and 麻豆原创s Served
7.9.5 SPTS Technologies (an Orbotech Company) Recent Developments/Updates
7.10 GigaLane
7.10.1 GigaLane Plasma Etch System for Wafer Processing Corporation Information
7.10.2 GigaLane Plasma Etch System for Wafer Processing Product Portfolio
7.10.3 GigaLane Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.10.4 GigaLane Main Business and 麻豆原创s Served
7.10.5 GigaLane Recent Developments/Updates
7.11 CORIAL
7.11.1 CORIAL Plasma Etch System for Wafer Processing Corporation Information
7.11.2 CORIAL Plasma Etch System for Wafer Processing Product Portfolio
7.11.3 CORIAL Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.11.4 CORIAL Main Business and 麻豆原创s Served
7.11.5 CORIAL Recent Developments/Updates
7.12 Trion Technology
7.12.1 Trion Technology Plasma Etch System for Wafer Processing Corporation Information
7.12.2 Trion Technology Plasma Etch System for Wafer Processing Product Portfolio
7.12.3 Trion Technology Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Trion Technology Main Business and 麻豆原创s Served
7.12.5 Trion Technology Recent Developments/Updates
7.13 NAURA
7.13.1 NAURA Plasma Etch System for Wafer Processing Corporation Information
7.13.2 NAURA Plasma Etch System for Wafer Processing Product Portfolio
7.13.3 NAURA Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.13.4 NAURA Main Business and 麻豆原创s Served
7.13.5 NAURA Recent Developments/Updates
7.14 Plasma Etch, Inc.
7.14.1 Plasma Etch, Inc. Plasma Etch System for Wafer Processing Corporation Information
7.14.2 Plasma Etch, Inc. Plasma Etch System for Wafer Processing Product Portfolio
7.14.3 Plasma Etch, Inc. Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Plasma Etch, Inc. Main Business and 麻豆原创s Served
7.14.5 Plasma Etch, Inc. Recent Developments/Updates
7.15 Tokyo Electron Limited
7.15.1 Tokyo Electron Limited Plasma Etch System for Wafer Processing Corporation Information
7.15.2 Tokyo Electron Limited Plasma Etch System for Wafer Processing Product Portfolio
7.15.3 Tokyo Electron Limited Plasma Etch System for Wafer Processing Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Tokyo Electron Limited Main Business and 麻豆原创s Served
7.15.5 Tokyo Electron Limited Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Plasma Etch System for Wafer Processing Industry Chain Analysis
8.2 Plasma Etch System for Wafer Processing Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Plasma Etch System for Wafer Processing Production Mode & Process
8.4 Plasma Etch System for Wafer Processing Sales and 麻豆原创ing
8.4.1 Plasma Etch System for Wafer Processing Sales Channels
8.4.2 Plasma Etch System for Wafer Processing Distributors
8.5 Plasma Etch System for Wafer Processing Customers
9 Plasma Etch System for Wafer Processing 麻豆原创 Dynamics
9.1 Plasma Etch System for Wafer Processing Industry Trends
9.2 Plasma Etch System for Wafer Processing 麻豆原创 Drivers
9.3 Plasma Etch System for Wafer Processing 麻豆原创 Challenges
9.4 Plasma Etch System for Wafer Processing 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
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*If Applicable.