Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
The global market for Multilayer Printed-wiring Board was estimated to be worth US$ 29480 million in 2023 and is forecast to a readjusted size of US$ 36350 million by 2030 with a CAGR of 3.0% during the forecast period 2024-2030
Global Multilayer Printed-wiring Board main players include Tripod, Nippon Mektron, Zhen Ding Technology, Unimicron, Shennan, TPT, etc., totally accounting for about 11% of market. China is the largest market of Multilayer Printed-wiring Board, with a share over 60%. As for the types of products, it can be divided into Layer 4-6, Layer 8-10 and Layer 10+. The most common product is Layer 4-6, with a share over 64%. In terms of applications, it is widely used in consumer electronics, communications, computer related industry, automotive industry and others. The most application is communications, with a share over 31%.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multilayer Printed-wiring Board, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Multilayer Printed-wiring Board by region & country, by Type, and by Application.
The Multilayer Printed-wiring Board market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multilayer Printed-wiring Board.
麻豆原创 Segmentation
By Company
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
SEMCO
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
WUS
TPT
Chin-Poon
Shennan
Segment by Type:
Layer 4-6
Layer 8-10
Layer 10+
Segment by Application
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Multilayer Printed-wiring Board manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Multilayer Printed-wiring Board in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Multilayer Printed-wiring Board in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 麻豆原创 Overview
1.1 Multilayer Printed-wiring Board Product Introduction
1.2 Global Multilayer Printed-wiring Board 麻豆原创 Size Forecast
1.2.1 Global Multilayer Printed-wiring Board Sales Value (2019-2030)
1.2.2 Global Multilayer Printed-wiring Board Sales Volume (2019-2030)
1.2.3 Global Multilayer Printed-wiring Board Sales Price (2019-2030)
1.3 Multilayer Printed-wiring Board 麻豆原创 Trends & Drivers
1.3.1 Multilayer Printed-wiring Board Industry Trends
1.3.2 Multilayer Printed-wiring Board 麻豆原创 Drivers & Opportunity
1.3.3 Multilayer Printed-wiring Board 麻豆原创 Challenges
1.3.4 Multilayer Printed-wiring Board 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Multilayer Printed-wiring Board Players Revenue Ranking (2023)
2.2 Global Multilayer Printed-wiring Board Revenue by Company (2019-2024)
2.3 Global Multilayer Printed-wiring Board Players Sales Volume Ranking (2023)
2.4 Global Multilayer Printed-wiring Board Sales Volume by Company Players (2019-2024)
2.5 Global Multilayer Printed-wiring Board Average Price by Company (2019-2024)
2.6 Key Manufacturers Multilayer Printed-wiring Board Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Multilayer Printed-wiring Board Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Multilayer Printed-wiring Board
2.9 Multilayer Printed-wiring Board 麻豆原创 Competitive Analysis
2.9.1 Multilayer Printed-wiring Board 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Multilayer Printed-wiring Board Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Multilayer Printed-wiring Board as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Layer 4-6
3.1.2 Layer 8-10
3.1.3 Layer 10+
3.2 Global Multilayer Printed-wiring Board Sales Value by Type
3.2.1 Global Multilayer Printed-wiring Board Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Multilayer Printed-wiring Board Sales Value, by Type (2019-2030)
3.2.3 Global Multilayer Printed-wiring Board Sales Value, by Type (%) (2019-2030)
3.3 Global Multilayer Printed-wiring Board Sales Volume by Type
3.3.1 Global Multilayer Printed-wiring Board Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Multilayer Printed-wiring Board Sales Volume, by Type (2019-2030)
3.3.3 Global Multilayer Printed-wiring Board Sales Volume, by Type (%) (2019-2030)
3.4 Global Multilayer Printed-wiring Board Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Communications
4.1.3 Computer Related Industry
4.1.4 Automotive Industry
4.1.5 Others
4.2 Global Multilayer Printed-wiring Board Sales Value by Application
4.2.1 Global Multilayer Printed-wiring Board Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Multilayer Printed-wiring Board Sales Value, by Application (2019-2030)
4.2.3 Global Multilayer Printed-wiring Board Sales Value, by Application (%) (2019-2030)
4.3 Global Multilayer Printed-wiring Board Sales Volume by Application
4.3.1 Global Multilayer Printed-wiring Board Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Multilayer Printed-wiring Board Sales Volume, by Application (2019-2030)
4.3.3 Global Multilayer Printed-wiring Board Sales Volume, by Application (%) (2019-2030)
4.4 Global Multilayer Printed-wiring Board Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Multilayer Printed-wiring Board Sales Value by Region
5.1.1 Global Multilayer Printed-wiring Board Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Multilayer Printed-wiring Board Sales Value by Region (2019-2024)
5.1.3 Global Multilayer Printed-wiring Board Sales Value by Region (2025-2030)
5.1.4 Global Multilayer Printed-wiring Board Sales Value by Region (%), (2019-2030)
5.2 Global Multilayer Printed-wiring Board Sales Volume by Region
5.2.1 Global Multilayer Printed-wiring Board Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Multilayer Printed-wiring Board Sales Volume by Region (2019-2024)
5.2.3 Global Multilayer Printed-wiring Board Sales Volume by Region (2025-2030)
5.2.4 Global Multilayer Printed-wiring Board Sales Volume by Region (%), (2019-2030)
5.3 Global Multilayer Printed-wiring Board Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Multilayer Printed-wiring Board Sales Value, 2019-2030
5.4.2 North America Multilayer Printed-wiring Board Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Multilayer Printed-wiring Board Sales Value, 2019-2030
5.5.2 Europe Multilayer Printed-wiring Board Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Multilayer Printed-wiring Board Sales Value, 2019-2030
5.6.2 Asia Pacific Multilayer Printed-wiring Board Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Multilayer Printed-wiring Board Sales Value, 2019-2030
5.7.2 South America Multilayer Printed-wiring Board Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Multilayer Printed-wiring Board Sales Value, 2019-2030
5.8.2 Middle East & Africa Multilayer Printed-wiring Board Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Multilayer Printed-wiring Board Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Multilayer Printed-wiring Board Sales Value
6.2.1 Key Countries/Regions Multilayer Printed-wiring Board Sales Value, 2019-2030
6.2.2 Key Countries/Regions Multilayer Printed-wiring Board Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Multilayer Printed-wiring Board Sales Value, 2019-2030
6.3.2 United States Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Multilayer Printed-wiring Board Sales Value, 2019-2030
6.4.2 Europe Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Multilayer Printed-wiring Board Sales Value, 2019-2030
6.5.2 China Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.5.3 China Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Multilayer Printed-wiring Board Sales Value, 2019-2030
6.6.2 Japan Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Multilayer Printed-wiring Board Sales Value, 2019-2030
6.7.2 South Korea Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Multilayer Printed-wiring Board Sales Value, 2019-2030
6.8.2 Southeast Asia Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Multilayer Printed-wiring Board Sales Value, 2019-2030
6.9.2 India Multilayer Printed-wiring Board Sales Value by Type (%), 2023 VS 2030
6.9.3 India Multilayer Printed-wiring Board Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Nippon Mektron
7.1.1 Nippon Mektron Company Information
7.1.2 Nippon Mektron Introduction and Business Overview
7.1.3 Nippon Mektron Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Nippon Mektron Multilayer Printed-wiring Board Product Offerings
7.1.5 Nippon Mektron Recent Development
7.2 Zhen Ding Technology
7.2.1 Zhen Ding Technology Company Information
7.2.2 Zhen Ding Technology Introduction and Business Overview
7.2.3 Zhen Ding Technology Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Zhen Ding Technology Multilayer Printed-wiring Board Product Offerings
7.2.5 Zhen Ding Technology Recent Development
7.3 Unimicron
7.3.1 Unimicron Company Information
7.3.2 Unimicron Introduction and Business Overview
7.3.3 Unimicron Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Unimicron Multilayer Printed-wiring Board Product Offerings
7.3.5 Unimicron Recent Development
7.4 Young Poong Group
7.4.1 Young Poong Group Company Information
7.4.2 Young Poong Group Introduction and Business Overview
7.4.3 Young Poong Group Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Young Poong Group Multilayer Printed-wiring Board Product Offerings
7.4.5 Young Poong Group Recent Development
7.5 SEMCO
7.5.1 SEMCO Company Information
7.5.2 SEMCO Introduction and Business Overview
7.5.3 SEMCO Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.5.4 SEMCO Multilayer Printed-wiring Board Product Offerings
7.5.5 SEMCO Recent Development
7.6 Ibiden
7.6.1 Ibiden Company Information
7.6.2 Ibiden Introduction and Business Overview
7.6.3 Ibiden Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Ibiden Multilayer Printed-wiring Board Product Offerings
7.6.5 Ibiden Recent Development
7.7 Tripod
7.7.1 Tripod Company Information
7.7.2 Tripod Introduction and Business Overview
7.7.3 Tripod Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Tripod Multilayer Printed-wiring Board Product Offerings
7.7.5 Tripod Recent Development
7.8 TTM Technologies
7.8.1 TTM Technologies Company Information
7.8.2 TTM Technologies Introduction and Business Overview
7.8.3 TTM Technologies Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.8.4 TTM Technologies Multilayer Printed-wiring Board Product Offerings
7.8.5 TTM Technologies Recent Development
7.9 Sumitomo Electric SEI
7.9.1 Sumitomo Electric SEI Company Information
7.9.2 Sumitomo Electric SEI Introduction and Business Overview
7.9.3 Sumitomo Electric SEI Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Sumitomo Electric SEI Multilayer Printed-wiring Board Product Offerings
7.9.5 Sumitomo Electric SEI Recent Development
7.10 Daeduck Group
7.10.1 Daeduck Group Company Information
7.10.2 Daeduck Group Introduction and Business Overview
7.10.3 Daeduck Group Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Daeduck Group Multilayer Printed-wiring Board Product Offerings
7.10.5 Daeduck Group Recent Development
7.11 Nan Ya PCB
7.11.1 Nan Ya PCB Company Information
7.11.2 Nan Ya PCB Introduction and Business Overview
7.11.3 Nan Ya PCB Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Nan Ya PCB Multilayer Printed-wiring Board Product Offerings
7.11.5 Nan Ya PCB Recent Development
7.12 Compeq
7.12.1 Compeq Company Information
7.12.2 Compeq Introduction and Business Overview
7.12.3 Compeq Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Compeq Multilayer Printed-wiring Board Product Offerings
7.12.5 Compeq Recent Development
7.13 HannStar Board
7.13.1 HannStar Board Company Information
7.13.2 HannStar Board Introduction and Business Overview
7.13.3 HannStar Board Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.13.4 HannStar Board Multilayer Printed-wiring Board Product Offerings
7.13.5 HannStar Board Recent Development
7.14 LG Innotek
7.14.1 LG Innotek Company Information
7.14.2 LG Innotek Introduction and Business Overview
7.14.3 LG Innotek Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.14.4 LG Innotek Multilayer Printed-wiring Board Product Offerings
7.14.5 LG Innotek Recent Development
7.15 AT&S
7.15.1 AT&S Company Information
7.15.2 AT&S Introduction and Business Overview
7.15.3 AT&S Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.15.4 AT&S Multilayer Printed-wiring Board Product Offerings
7.15.5 AT&S Recent Development
7.16 Meiko
7.16.1 Meiko Company Information
7.16.2 Meiko Introduction and Business Overview
7.16.3 Meiko Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.16.4 Meiko Multilayer Printed-wiring Board Product Offerings
7.16.5 Meiko Recent Development
7.17 WUS
7.17.1 WUS Company Information
7.17.2 WUS Introduction and Business Overview
7.17.3 WUS Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.17.4 WUS Multilayer Printed-wiring Board Product Offerings
7.17.5 WUS Recent Development
7.18 TPT
7.18.1 TPT Company Information
7.18.2 TPT Introduction and Business Overview
7.18.3 TPT Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.18.4 TPT Multilayer Printed-wiring Board Product Offerings
7.18.5 TPT Recent Development
7.19 Chin-Poon
7.19.1 Chin-Poon Company Information
7.19.2 Chin-Poon Introduction and Business Overview
7.19.3 Chin-Poon Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.19.4 Chin-Poon Multilayer Printed-wiring Board Product Offerings
7.19.5 Chin-Poon Recent Development
7.20 Shennan
7.20.1 Shennan Company Information
7.20.2 Shennan Introduction and Business Overview
7.20.3 Shennan Multilayer Printed-wiring Board Sales, Revenue and Gross Margin (2019-2024)
7.20.4 Shennan Multilayer Printed-wiring Board Product Offerings
7.20.5 Shennan Recent Development
8 Industry Chain Analysis
8.1 Multilayer Printed-wiring Board Industrial Chain
8.2 Multilayer Printed-wiring Board Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Multilayer Printed-wiring Board Sales Model
8.5.2 Sales Channel
8.5.3 Multilayer Printed-wiring Board Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
SEMCO
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
WUS
TPT
Chin-Poon
Shennan
听
听
*If Applicable.
