Microelectronics Packaging Materials - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511244603

Publication Date:

November 21, 2024

Pages:

142

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Microelectronics packaging materials play a crucial role in protecting and enhancing the performance of microelectronic devices.
The global market for Microelectronics Packaging Materials was estimated to be worth US$ 6450 million in 2023 and is forecast to a readjusted size of US$ 10960 million by 2030 with a CAGR of 7.6% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Microelectronics Packaging Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Microelectronics Packaging Materials by region & country, by Type, and by Application.
The Microelectronics Packaging Materials market size, estimations, and forecasts are provided in terms of sales volume (Kiloton) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Microelectronics Packaging Materials.
麻豆原创 Segmentation
By Company
Materion
AMETEK
Shin-Etsu Chemical
Kyocera
Hermetic Solutions Group
DuPont
Henkel
Sumitomo Bakelite
Proterial
TANAKA Precious Metals
Hebei Sinopack Electronic
Ningbo Kangqiang Electronics
Changsha Saneway Electronic Materials
Tianjin Kaihua Insulation Material
Zhejiang Gpilot Technology
Segment by Type:
Plastic
Ceramics
Metal
Other
Segment by Application
Semiconductor Packaging
MEMS Packaging
Optoelectronic Packaging
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Microelectronics Packaging Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Microelectronics Packaging Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Microelectronics Packaging Materials in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 麻豆原创 Overview
1.1 Microelectronics Packaging Materials Product Introduction
1.2 Global Microelectronics Packaging Materials 麻豆原创 Size Forecast
1.2.1 Global Microelectronics Packaging Materials Sales Value (2019-2030)
1.2.2 Global Microelectronics Packaging Materials Sales Volume (2019-2030)
1.2.3 Global Microelectronics Packaging Materials Sales Price (2019-2030)
1.3 Microelectronics Packaging Materials 麻豆原创 Trends & Drivers
1.3.1 Microelectronics Packaging Materials Industry Trends
1.3.2 Microelectronics Packaging Materials 麻豆原创 Drivers & Opportunity
1.3.3 Microelectronics Packaging Materials 麻豆原创 Challenges
1.3.4 Microelectronics Packaging Materials 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Microelectronics Packaging Materials Players Revenue Ranking (2023)
2.2 Global Microelectronics Packaging Materials Revenue by Company (2019-2024)
2.3 Global Microelectronics Packaging Materials Players Sales Volume Ranking (2023)
2.4 Global Microelectronics Packaging Materials Sales Volume by Company Players (2019-2024)
2.5 Global Microelectronics Packaging Materials Average Price by Company (2019-2024)
2.6 Key Manufacturers Microelectronics Packaging Materials Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Microelectronics Packaging Materials Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Microelectronics Packaging Materials
2.9 Microelectronics Packaging Materials 麻豆原创 Competitive Analysis
2.9.1 Microelectronics Packaging Materials 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Microelectronics Packaging Materials Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Microelectronics Packaging Materials as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Plastic
3.1.2 Ceramics
3.1.3 Metal
3.1.4 Other
3.2 Global Microelectronics Packaging Materials Sales Value by Type
3.2.1 Global Microelectronics Packaging Materials Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Microelectronics Packaging Materials Sales Value, by Type (2019-2030)
3.2.3 Global Microelectronics Packaging Materials Sales Value, by Type (%) (2019-2030)
3.3 Global Microelectronics Packaging Materials Sales Volume by Type
3.3.1 Global Microelectronics Packaging Materials Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Microelectronics Packaging Materials Sales Volume, by Type (2019-2030)
3.3.3 Global Microelectronics Packaging Materials Sales Volume, by Type (%) (2019-2030)
3.4 Global Microelectronics Packaging Materials Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Semiconductor Packaging
4.1.2 MEMS Packaging
4.1.3 Optoelectronic Packaging
4.1.4 Other
4.2 Global Microelectronics Packaging Materials Sales Value by Application
4.2.1 Global Microelectronics Packaging Materials Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Microelectronics Packaging Materials Sales Value, by Application (2019-2030)
4.2.3 Global Microelectronics Packaging Materials Sales Value, by Application (%) (2019-2030)
4.3 Global Microelectronics Packaging Materials Sales Volume by Application
4.3.1 Global Microelectronics Packaging Materials Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Microelectronics Packaging Materials Sales Volume, by Application (2019-2030)
4.3.3 Global Microelectronics Packaging Materials Sales Volume, by Application (%) (2019-2030)
4.4 Global Microelectronics Packaging Materials Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Microelectronics Packaging Materials Sales Value by Region
5.1.1 Global Microelectronics Packaging Materials Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Microelectronics Packaging Materials Sales Value by Region (2019-2024)
5.1.3 Global Microelectronics Packaging Materials Sales Value by Region (2025-2030)
5.1.4 Global Microelectronics Packaging Materials Sales Value by Region (%), (2019-2030)
5.2 Global Microelectronics Packaging Materials Sales Volume by Region
5.2.1 Global Microelectronics Packaging Materials Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Microelectronics Packaging Materials Sales Volume by Region (2019-2024)
5.2.3 Global Microelectronics Packaging Materials Sales Volume by Region (2025-2030)
5.2.4 Global Microelectronics Packaging Materials Sales Volume by Region (%), (2019-2030)
5.3 Global Microelectronics Packaging Materials Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Microelectronics Packaging Materials Sales Value, 2019-2030
5.4.2 North America Microelectronics Packaging Materials Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Microelectronics Packaging Materials Sales Value, 2019-2030
5.5.2 Europe Microelectronics Packaging Materials Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Microelectronics Packaging Materials Sales Value, 2019-2030
5.6.2 Asia Pacific Microelectronics Packaging Materials Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Microelectronics Packaging Materials Sales Value, 2019-2030
5.7.2 South America Microelectronics Packaging Materials Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Microelectronics Packaging Materials Sales Value, 2019-2030
5.8.2 Middle East & Africa Microelectronics Packaging Materials Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Microelectronics Packaging Materials Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Microelectronics Packaging Materials Sales Value
6.2.1 Key Countries/Regions Microelectronics Packaging Materials Sales Value, 2019-2030
6.2.2 Key Countries/Regions Microelectronics Packaging Materials Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Microelectronics Packaging Materials Sales Value, 2019-2030
6.3.2 United States Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Microelectronics Packaging Materials Sales Value, 2019-2030
6.4.2 Europe Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Microelectronics Packaging Materials Sales Value, 2019-2030
6.5.2 China Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.5.3 China Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Microelectronics Packaging Materials Sales Value, 2019-2030
6.6.2 Japan Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Microelectronics Packaging Materials Sales Value, 2019-2030
6.7.2 South Korea Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Microelectronics Packaging Materials Sales Value, 2019-2030
6.8.2 Southeast Asia Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Microelectronics Packaging Materials Sales Value, 2019-2030
6.9.2 India Microelectronics Packaging Materials Sales Value by Type (%), 2023 VS 2030
6.9.3 India Microelectronics Packaging Materials Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Materion
7.1.1 Materion Company Information
7.1.2 Materion Introduction and Business Overview
7.1.3 Materion Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Materion Microelectronics Packaging Materials Product Offerings
7.1.5 Materion Recent Development
7.2 AMETEK
7.2.1 AMETEK Company Information
7.2.2 AMETEK Introduction and Business Overview
7.2.3 AMETEK Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.2.4 AMETEK Microelectronics Packaging Materials Product Offerings
7.2.5 AMETEK Recent Development
7.3 Shin-Etsu Chemical
7.3.1 Shin-Etsu Chemical Company Information
7.3.2 Shin-Etsu Chemical Introduction and Business Overview
7.3.3 Shin-Etsu Chemical Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Shin-Etsu Chemical Microelectronics Packaging Materials Product Offerings
7.3.5 Shin-Etsu Chemical Recent Development
7.4 Kyocera
7.4.1 Kyocera Company Information
7.4.2 Kyocera Introduction and Business Overview
7.4.3 Kyocera Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Kyocera Microelectronics Packaging Materials Product Offerings
7.4.5 Kyocera Recent Development
7.5 Hermetic Solutions Group
7.5.1 Hermetic Solutions Group Company Information
7.5.2 Hermetic Solutions Group Introduction and Business Overview
7.5.3 Hermetic Solutions Group Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Hermetic Solutions Group Microelectronics Packaging Materials Product Offerings
7.5.5 Hermetic Solutions Group Recent Development
7.6 DuPont
7.6.1 DuPont Company Information
7.6.2 DuPont Introduction and Business Overview
7.6.3 DuPont Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.6.4 DuPont Microelectronics Packaging Materials Product Offerings
7.6.5 DuPont Recent Development
7.7 Henkel
7.7.1 Henkel Company Information
7.7.2 Henkel Introduction and Business Overview
7.7.3 Henkel Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Henkel Microelectronics Packaging Materials Product Offerings
7.7.5 Henkel Recent Development
7.8 Sumitomo Bakelite
7.8.1 Sumitomo Bakelite Company Information
7.8.2 Sumitomo Bakelite Introduction and Business Overview
7.8.3 Sumitomo Bakelite Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Sumitomo Bakelite Microelectronics Packaging Materials Product Offerings
7.8.5 Sumitomo Bakelite Recent Development
7.9 Proterial
7.9.1 Proterial Company Information
7.9.2 Proterial Introduction and Business Overview
7.9.3 Proterial Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Proterial Microelectronics Packaging Materials Product Offerings
7.9.5 Proterial Recent Development
7.10 TANAKA Precious Metals
7.10.1 TANAKA Precious Metals Company Information
7.10.2 TANAKA Precious Metals Introduction and Business Overview
7.10.3 TANAKA Precious Metals Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.10.4 TANAKA Precious Metals Microelectronics Packaging Materials Product Offerings
7.10.5 TANAKA Precious Metals Recent Development
7.11 Hebei Sinopack Electronic
7.11.1 Hebei Sinopack Electronic Company Information
7.11.2 Hebei Sinopack Electronic Introduction and Business Overview
7.11.3 Hebei Sinopack Electronic Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Hebei Sinopack Electronic Microelectronics Packaging Materials Product Offerings
7.11.5 Hebei Sinopack Electronic Recent Development
7.12 Ningbo Kangqiang Electronics
7.12.1 Ningbo Kangqiang Electronics Company Information
7.12.2 Ningbo Kangqiang Electronics Introduction and Business Overview
7.12.3 Ningbo Kangqiang Electronics Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Ningbo Kangqiang Electronics Microelectronics Packaging Materials Product Offerings
7.12.5 Ningbo Kangqiang Electronics Recent Development
7.13 Changsha Saneway Electronic Materials
7.13.1 Changsha Saneway Electronic Materials Company Information
7.13.2 Changsha Saneway Electronic Materials Introduction and Business Overview
7.13.3 Changsha Saneway Electronic Materials Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Changsha Saneway Electronic Materials Microelectronics Packaging Materials Product Offerings
7.13.5 Changsha Saneway Electronic Materials Recent Development
7.14 Tianjin Kaihua Insulation Material
7.14.1 Tianjin Kaihua Insulation Material Company Information
7.14.2 Tianjin Kaihua Insulation Material Introduction and Business Overview
7.14.3 Tianjin Kaihua Insulation Material Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Tianjin Kaihua Insulation Material Microelectronics Packaging Materials Product Offerings
7.14.5 Tianjin Kaihua Insulation Material Recent Development
7.15 Zhejiang Gpilot Technology
7.15.1 Zhejiang Gpilot Technology Company Information
7.15.2 Zhejiang Gpilot Technology Introduction and Business Overview
7.15.3 Zhejiang Gpilot Technology Microelectronics Packaging Materials Sales, Revenue and Gross Margin (2019-2024)
7.15.4 Zhejiang Gpilot Technology Microelectronics Packaging Materials Product Offerings
7.15.5 Zhejiang Gpilot Technology Recent Development
8 Industry Chain Analysis
8.1 Microelectronics Packaging Materials Industrial Chain
8.2 Microelectronics Packaging Materials Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Microelectronics Packaging Materials Sales Model
8.5.2 Sales Channel
8.5.3 Microelectronics Packaging Materials Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Materion
AMETEK
Shin-Etsu Chemical
Kyocera
Hermetic Solutions Group
DuPont
Henkel
Sumitomo Bakelite
Proterial
TANAKA Precious Metals
Hebei Sinopack Electronic
Ningbo Kangqiang Electronics
Changsha Saneway Electronic Materials
Tianjin Kaihua Insulation Material
Zhejiang Gpilot Technology

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