Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; 鈶� has good heat conduction and heat dissipation; 鈶� good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; 鈶� Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
The global market for Metal Shell for Microelectronic Packages was estimated to be worth US$ 1994.2 million in 2023 and is forecast to a readjusted size of US$ 1980.1 million by 2030 with a CAGR of -0.1% during the forecast period 2024-2030
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Metal Shell for Microelectronic Packages, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Metal Shell for Microelectronic Packages by region & country, by Type, and by Application.
The Metal Shell for Microelectronic Packages market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Metal Shell for Microelectronic Packages.
麻豆原创 Segmentation
By Company
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Segment by Type:
TO Shell
Flat Shell
Segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Metal Shell for Microelectronic Packages manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Metal Shell for Microelectronic Packages in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Metal Shell for Microelectronic Packages in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 麻豆原创 Overview
1.1 Metal Shell for Microelectronic Packages Product Introduction
1.2 Global Metal Shell for Microelectronic Packages 麻豆原创 Size Forecast
1.2.1 Global Metal Shell for Microelectronic Packages Sales Value (2019-2030)
1.2.2 Global Metal Shell for Microelectronic Packages Sales Volume (2019-2030)
1.2.3 Global Metal Shell for Microelectronic Packages Sales Price (2019-2030)
1.3 Metal Shell for Microelectronic Packages 麻豆原创 Trends & Drivers
1.3.1 Metal Shell for Microelectronic Packages Industry Trends
1.3.2 Metal Shell for Microelectronic Packages 麻豆原创 Drivers & Opportunity
1.3.3 Metal Shell for Microelectronic Packages 麻豆原创 Challenges
1.3.4 Metal Shell for Microelectronic Packages 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Metal Shell for Microelectronic Packages Players Revenue Ranking (2023)
2.2 Global Metal Shell for Microelectronic Packages Revenue by Company (2019-2024)
2.3 Global Metal Shell for Microelectronic Packages Players Sales Volume Ranking (2023)
2.4 Global Metal Shell for Microelectronic Packages Sales Volume by Company Players (2019-2024)
2.5 Global Metal Shell for Microelectronic Packages Average Price by Company (2019-2024)
2.6 Key Manufacturers Metal Shell for Microelectronic Packages Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Metal Shell for Microelectronic Packages Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Metal Shell for Microelectronic Packages
2.9 Metal Shell for Microelectronic Packages 麻豆原创 Competitive Analysis
2.9.1 Metal Shell for Microelectronic Packages 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Metal Shell for Microelectronic Packages Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Metal Shell for Microelectronic Packages as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 TO Shell
3.1.2 Flat Shell
3.2 Global Metal Shell for Microelectronic Packages Sales Value by Type
3.2.1 Global Metal Shell for Microelectronic Packages Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Metal Shell for Microelectronic Packages Sales Value, by Type (2019-2030)
3.2.3 Global Metal Shell for Microelectronic Packages Sales Value, by Type (%) (2019-2030)
3.3 Global Metal Shell for Microelectronic Packages Sales Volume by Type
3.3.1 Global Metal Shell for Microelectronic Packages Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Metal Shell for Microelectronic Packages Sales Volume, by Type (2019-2030)
3.3.3 Global Metal Shell for Microelectronic Packages Sales Volume, by Type (%) (2019-2030)
3.4 Global Metal Shell for Microelectronic Packages Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Aeronautics and Astronautics
4.1.2 Petrochemical Industry
4.1.3 Automobile
4.1.4 Optical Communication
4.1.5 Other
4.2 Global Metal Shell for Microelectronic Packages Sales Value by Application
4.2.1 Global Metal Shell for Microelectronic Packages Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Metal Shell for Microelectronic Packages Sales Value, by Application (2019-2030)
4.2.3 Global Metal Shell for Microelectronic Packages Sales Value, by Application (%) (2019-2030)
4.3 Global Metal Shell for Microelectronic Packages Sales Volume by Application
4.3.1 Global Metal Shell for Microelectronic Packages Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Metal Shell for Microelectronic Packages Sales Volume, by Application (2019-2030)
4.3.3 Global Metal Shell for Microelectronic Packages Sales Volume, by Application (%) (2019-2030)
4.4 Global Metal Shell for Microelectronic Packages Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Metal Shell for Microelectronic Packages Sales Value by Region
5.1.1 Global Metal Shell for Microelectronic Packages Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Metal Shell for Microelectronic Packages Sales Value by Region (2019-2024)
5.1.3 Global Metal Shell for Microelectronic Packages Sales Value by Region (2025-2030)
5.1.4 Global Metal Shell for Microelectronic Packages Sales Value by Region (%), (2019-2030)
5.2 Global Metal Shell for Microelectronic Packages Sales Volume by Region
5.2.1 Global Metal Shell for Microelectronic Packages Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Metal Shell for Microelectronic Packages Sales Volume by Region (2019-2024)
5.2.3 Global Metal Shell for Microelectronic Packages Sales Volume by Region (2025-2030)
5.2.4 Global Metal Shell for Microelectronic Packages Sales Volume by Region (%), (2019-2030)
5.3 Global Metal Shell for Microelectronic Packages Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Metal Shell for Microelectronic Packages Sales Value, 2019-2030
5.4.2 North America Metal Shell for Microelectronic Packages Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Metal Shell for Microelectronic Packages Sales Value, 2019-2030
5.5.2 Europe Metal Shell for Microelectronic Packages Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Metal Shell for Microelectronic Packages Sales Value, 2019-2030
5.6.2 Asia Pacific Metal Shell for Microelectronic Packages Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Metal Shell for Microelectronic Packages Sales Value, 2019-2030
5.7.2 South America Metal Shell for Microelectronic Packages Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Metal Shell for Microelectronic Packages Sales Value, 2019-2030
5.8.2 Middle East & Africa Metal Shell for Microelectronic Packages Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Metal Shell for Microelectronic Packages Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Metal Shell for Microelectronic Packages Sales Value
6.2.1 Key Countries/Regions Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.2.2 Key Countries/Regions Metal Shell for Microelectronic Packages Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.3.2 United States Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.4.2 Europe Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.5.2 China Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.5.3 China Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.6.2 Japan Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.7.2 South Korea Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.8.2 Southeast Asia Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Metal Shell for Microelectronic Packages Sales Value, 2019-2030
6.9.2 India Metal Shell for Microelectronic Packages Sales Value by Type (%), 2023 VS 2030
6.9.3 India Metal Shell for Microelectronic Packages Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 AMETEK(GSP)
7.1.1 AMETEK(GSP) Company Information
7.1.2 AMETEK(GSP) Introduction and Business Overview
7.1.3 AMETEK(GSP) Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.1.4 AMETEK(GSP) Metal Shell for Microelectronic Packages Product Offerings
7.1.5 AMETEK(GSP) Recent Development
7.2 SCHOTT
7.2.1 SCHOTT Company Information
7.2.2 SCHOTT Introduction and Business Overview
7.2.3 SCHOTT Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.2.4 SCHOTT Metal Shell for Microelectronic Packages Product Offerings
7.2.5 SCHOTT Recent Development
7.3 Complete Hermetics
7.3.1 Complete Hermetics Company Information
7.3.2 Complete Hermetics Introduction and Business Overview
7.3.3 Complete Hermetics Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Complete Hermetics Metal Shell for Microelectronic Packages Product Offerings
7.3.5 Complete Hermetics Recent Development
7.4 KOTO
7.4.1 KOTO Company Information
7.4.2 KOTO Introduction and Business Overview
7.4.3 KOTO Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.4.4 KOTO Metal Shell for Microelectronic Packages Product Offerings
7.4.5 KOTO Recent Development
7.5 Kyocera
7.5.1 Kyocera Company Information
7.5.2 Kyocera Introduction and Business Overview
7.5.3 Kyocera Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Kyocera Metal Shell for Microelectronic Packages Product Offerings
7.5.5 Kyocera Recent Development
7.6 SGA Technologies
7.6.1 SGA Technologies Company Information
7.6.2 SGA Technologies Introduction and Business Overview
7.6.3 SGA Technologies Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.6.4 SGA Technologies Metal Shell for Microelectronic Packages Product Offerings
7.6.5 SGA Technologies Recent Development
7.7 Century Seals
7.7.1 Century Seals Company Information
7.7.2 Century Seals Introduction and Business Overview
7.7.3 Century Seals Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Century Seals Metal Shell for Microelectronic Packages Product Offerings
7.7.5 Century Seals Recent Development
7.8 KaiRui
7.8.1 KaiRui Company Information
7.8.2 KaiRui Introduction and Business Overview
7.8.3 KaiRui Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.8.4 KaiRui Metal Shell for Microelectronic Packages Product Offerings
7.8.5 KaiRui Recent Development
7.9 Jiangsu Dongguang Micro-electronics
7.9.1 Jiangsu Dongguang Micro-electronics Company Information
7.9.2 Jiangsu Dongguang Micro-electronics Introduction and Business Overview
7.9.3 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Product Offerings
7.9.5 Jiangsu Dongguang Micro-electronics Recent Development
7.10 Taizhou Hangyu Electric Appliance
7.10.1 Taizhou Hangyu Electric Appliance Company Information
7.10.2 Taizhou Hangyu Electric Appliance Introduction and Business Overview
7.10.3 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Product Offerings
7.10.5 Taizhou Hangyu Electric Appliance Recent Development
7.11 CETC40
7.11.1 CETC40 Company Information
7.11.2 CETC40 Introduction and Business Overview
7.11.3 CETC40 Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.11.4 CETC40 Metal Shell for Microelectronic Packages Product Offerings
7.11.5 CETC40 Recent Development
7.12 BOJING ELECTRONICS
7.12.1 BOJING ELECTRONICS Company Information
7.12.2 BOJING ELECTRONICS Introduction and Business Overview
7.12.3 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.12.4 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Product Offerings
7.12.5 BOJING ELECTRONICS Recent Development
7.13 CETC43
7.13.1 CETC43 Company Information
7.13.2 CETC43 Introduction and Business Overview
7.13.3 CETC43 Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.13.4 CETC43 Metal Shell for Microelectronic Packages Product Offerings
7.13.5 CETC43 Recent Development
7.14 SINOPIONEER
7.14.1 SINOPIONEER Company Information
7.14.2 SINOPIONEER Introduction and Business Overview
7.14.3 SINOPIONEER Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.14.4 SINOPIONEER Metal Shell for Microelectronic Packages Product Offerings
7.14.5 SINOPIONEER Recent Development
7.15 CCTC
7.15.1 CCTC Company Information
7.15.2 CCTC Introduction and Business Overview
7.15.3 CCTC Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.15.4 CCTC Metal Shell for Microelectronic Packages Product Offerings
7.15.5 CCTC Recent Development
7.16 XingChuang
7.16.1 XingChuang Company Information
7.16.2 XingChuang Introduction and Business Overview
7.16.3 XingChuang Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.16.4 XingChuang Metal Shell for Microelectronic Packages Product Offerings
7.16.5 XingChuang Recent Development
7.17 Rizhao Xuri Electronics Co., Ltd.
7.17.1 Rizhao Xuri Electronics Co., Ltd. Company Information
7.17.2 Rizhao Xuri Electronics Co., Ltd. Introduction and Business Overview
7.17.3 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.17.4 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Product Offerings
7.17.5 Rizhao Xuri Electronics Co., Ltd. Recent Development
7.18 ShengDa Technology
7.18.1 ShengDa Technology Company Information
7.18.2 ShengDa Technology Introduction and Business Overview
7.18.3 ShengDa Technology Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2019-2024)
7.18.4 ShengDa Technology Metal Shell for Microelectronic Packages Product Offerings
7.18.5 ShengDa Technology Recent Development
8 Industry Chain Analysis
8.1 Metal Shell for Microelectronic Packages Industrial Chain
8.2 Metal Shell for Microelectronic Packages Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Metal Shell for Microelectronic Packages Sales Model
8.5.2 Sales Channel
8.5.3 Metal Shell for Microelectronic Packages Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
听
听
*If Applicable.
