High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
The global market for High Density Interconnect was estimated to be worth US$ 13200 million in 2023 and is forecast to a readjusted size of US$ 26120 million by 2030 with a CAGR of 10.1% during the forecast period 2024-2030
North American market for High Density Interconnect was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for High Density Interconnect was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Europe market for High Density Interconnect was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global key companies of High Density Interconnect include IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq and Unitech Printed Circuit Board Corp., etc. In 2023, the global five largest players hold a share approximately % in terms of revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for High Density Interconnect, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of High Density Interconnect by region & country, by Type, and by Application.
The High Density Interconnect market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Density Interconnect.
麻豆原创 Segmentation
By Company
IBIDEN Group
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Group
ZDT
Compeq
Unitech Printed Circuit Board Corp.
LG Innotek
Tripod Technology
TTM Technologies
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
CCTC
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Bittele Electronics
Epec
W眉rth Elektronik
NOD Electronics
San Francisco Circuits
PCBCart
Advanced Circuits
Segment by Type:
Single Panel
Double Panel
Others
Segment by Application
Automotive Electronics
Consumer Electronics
Other Electronic Products
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of High Density Interconnect manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of High Density Interconnect in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of High Density Interconnect in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 麻豆原创 Overview
1.1 High Density Interconnect Product Introduction
1.2 Global High Density Interconnect 麻豆原创 Size Forecast
1.2.1 Global High Density Interconnect Sales Value (2019-2030)
1.2.2 Global High Density Interconnect Sales Volume (2019-2030)
1.2.3 Global High Density Interconnect Sales Price (2019-2030)
1.3 High Density Interconnect 麻豆原创 Trends & Drivers
1.3.1 High Density Interconnect Industry Trends
1.3.2 High Density Interconnect 麻豆原创 Drivers & Opportunity
1.3.3 High Density Interconnect 麻豆原创 Challenges
1.3.4 High Density Interconnect 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global High Density Interconnect Players Revenue Ranking (2023)
2.2 Global High Density Interconnect Revenue by Company (2019-2024)
2.3 Global High Density Interconnect Players Sales Volume Ranking (2023)
2.4 Global High Density Interconnect Sales Volume by Company Players (2019-2024)
2.5 Global High Density Interconnect Average Price by Company (2019-2024)
2.6 Key Manufacturers High Density Interconnect Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers High Density Interconnect Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of High Density Interconnect
2.9 High Density Interconnect 麻豆原创 Competitive Analysis
2.9.1 High Density Interconnect 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by High Density Interconnect Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in High Density Interconnect as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Single Panel
3.1.2 Double Panel
3.1.3 Others
3.2 Global High Density Interconnect Sales Value by Type
3.2.1 Global High Density Interconnect Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global High Density Interconnect Sales Value, by Type (2019-2030)
3.2.3 Global High Density Interconnect Sales Value, by Type (%) (2019-2030)
3.3 Global High Density Interconnect Sales Volume by Type
3.3.1 Global High Density Interconnect Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global High Density Interconnect Sales Volume, by Type (2019-2030)
3.3.3 Global High Density Interconnect Sales Volume, by Type (%) (2019-2030)
3.4 Global High Density Interconnect Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Automotive Electronics
4.1.2 Consumer Electronics
4.1.3 Other Electronic Products
4.2 Global High Density Interconnect Sales Value by Application
4.2.1 Global High Density Interconnect Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global High Density Interconnect Sales Value, by Application (2019-2030)
4.2.3 Global High Density Interconnect Sales Value, by Application (%) (2019-2030)
4.3 Global High Density Interconnect Sales Volume by Application
4.3.1 Global High Density Interconnect Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global High Density Interconnect Sales Volume, by Application (2019-2030)
4.3.3 Global High Density Interconnect Sales Volume, by Application (%) (2019-2030)
4.4 Global High Density Interconnect Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global High Density Interconnect Sales Value by Region
5.1.1 Global High Density Interconnect Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global High Density Interconnect Sales Value by Region (2019-2024)
5.1.3 Global High Density Interconnect Sales Value by Region (2025-2030)
5.1.4 Global High Density Interconnect Sales Value by Region (%), (2019-2030)
5.2 Global High Density Interconnect Sales Volume by Region
5.2.1 Global High Density Interconnect Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global High Density Interconnect Sales Volume by Region (2019-2024)
5.2.3 Global High Density Interconnect Sales Volume by Region (2025-2030)
5.2.4 Global High Density Interconnect Sales Volume by Region (%), (2019-2030)
5.3 Global High Density Interconnect Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America High Density Interconnect Sales Value, 2019-2030
5.4.2 North America High Density Interconnect Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe High Density Interconnect Sales Value, 2019-2030
5.5.2 Europe High Density Interconnect Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific High Density Interconnect Sales Value, 2019-2030
5.6.2 Asia Pacific High Density Interconnect Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America High Density Interconnect Sales Value, 2019-2030
5.7.2 South America High Density Interconnect Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa High Density Interconnect Sales Value, 2019-2030
5.8.2 Middle East & Africa High Density Interconnect Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions High Density Interconnect Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions High Density Interconnect Sales Value
6.2.1 Key Countries/Regions High Density Interconnect Sales Value, 2019-2030
6.2.2 Key Countries/Regions High Density Interconnect Sales Volume, 2019-2030
6.3 United States
6.3.1 United States High Density Interconnect Sales Value, 2019-2030
6.3.2 United States High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.3.3 United States High Density Interconnect Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe High Density Interconnect Sales Value, 2019-2030
6.4.2 Europe High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe High Density Interconnect Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China High Density Interconnect Sales Value, 2019-2030
6.5.2 China High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.5.3 China High Density Interconnect Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan High Density Interconnect Sales Value, 2019-2030
6.6.2 Japan High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan High Density Interconnect Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea High Density Interconnect Sales Value, 2019-2030
6.7.2 South Korea High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea High Density Interconnect Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia High Density Interconnect Sales Value, 2019-2030
6.8.2 Southeast Asia High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia High Density Interconnect Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India High Density Interconnect Sales Value, 2019-2030
6.9.2 India High Density Interconnect Sales Value by Type (%), 2023 VS 2030
6.9.3 India High Density Interconnect Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 IBIDEN Group
7.1.1 IBIDEN Group Company Information
7.1.2 IBIDEN Group Introduction and Business Overview
7.1.3 IBIDEN Group High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.1.4 IBIDEN Group High Density Interconnect Product Offerings
7.1.5 IBIDEN Group Recent Development
7.2 Unimicron
7.2.1 Unimicron Company Information
7.2.2 Unimicron Introduction and Business Overview
7.2.3 Unimicron High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Unimicron High Density Interconnect Product Offerings
7.2.5 Unimicron Recent Development
7.3 AT&S
7.3.1 AT&S Company Information
7.3.2 AT&S Introduction and Business Overview
7.3.3 AT&S High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.3.4 AT&S High Density Interconnect Product Offerings
7.3.5 AT&S Recent Development
7.4 SEMCO
7.4.1 SEMCO Company Information
7.4.2 SEMCO Introduction and Business Overview
7.4.3 SEMCO High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.4.4 SEMCO High Density Interconnect Product Offerings
7.4.5 SEMCO Recent Development
7.5 NCAB Group
7.5.1 NCAB Group Company Information
7.5.2 NCAB Group Introduction and Business Overview
7.5.3 NCAB Group High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.5.4 NCAB Group High Density Interconnect Product Offerings
7.5.5 NCAB Group Recent Development
7.6 Young Poong Group
7.6.1 Young Poong Group Company Information
7.6.2 Young Poong Group Introduction and Business Overview
7.6.3 Young Poong Group High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Young Poong Group High Density Interconnect Product Offerings
7.6.5 Young Poong Group Recent Development
7.7 ZDT
7.7.1 ZDT Company Information
7.7.2 ZDT Introduction and Business Overview
7.7.3 ZDT High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.7.4 ZDT High Density Interconnect Product Offerings
7.7.5 ZDT Recent Development
7.8 Compeq
7.8.1 Compeq Company Information
7.8.2 Compeq Introduction and Business Overview
7.8.3 Compeq High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Compeq High Density Interconnect Product Offerings
7.8.5 Compeq Recent Development
7.9 Unitech Printed Circuit Board Corp.
7.9.1 Unitech Printed Circuit Board Corp. Company Information
7.9.2 Unitech Printed Circuit Board Corp. Introduction and Business Overview
7.9.3 Unitech Printed Circuit Board Corp. High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Unitech Printed Circuit Board Corp. High Density Interconnect Product Offerings
7.9.5 Unitech Printed Circuit Board Corp. Recent Development
7.10 LG Innotek
7.10.1 LG Innotek Company Information
7.10.2 LG Innotek Introduction and Business Overview
7.10.3 LG Innotek High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.10.4 LG Innotek High Density Interconnect Product Offerings
7.10.5 LG Innotek Recent Development
7.11 Tripod Technology
7.11.1 Tripod Technology Company Information
7.11.2 Tripod Technology Introduction and Business Overview
7.11.3 Tripod Technology High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Tripod Technology High Density Interconnect Product Offerings
7.11.5 Tripod Technology Recent Development
7.12 TTM Technologies
7.12.1 TTM Technologies Company Information
7.12.2 TTM Technologies Introduction and Business Overview
7.12.3 TTM Technologies High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.12.4 TTM Technologies High Density Interconnect Product Offerings
7.12.5 TTM Technologies Recent Development
7.13 Daeduck
7.13.1 Daeduck Company Information
7.13.2 Daeduck Introduction and Business Overview
7.13.3 Daeduck High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Daeduck High Density Interconnect Product Offerings
7.13.5 Daeduck Recent Development
7.14 HannStar Board
7.14.1 HannStar Board Company Information
7.14.2 HannStar Board Introduction and Business Overview
7.14.3 HannStar Board High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.14.4 HannStar Board High Density Interconnect Product Offerings
7.14.5 HannStar Board Recent Development
7.15 Nan Ya PCB
7.15.1 Nan Ya PCB Company Information
7.15.2 Nan Ya PCB Introduction and Business Overview
7.15.3 Nan Ya PCB High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.15.4 Nan Ya PCB High Density Interconnect Product Offerings
7.15.5 Nan Ya PCB Recent Development
7.16 CMK Corporation
7.16.1 CMK Corporation Company Information
7.16.2 CMK Corporation Introduction and Business Overview
7.16.3 CMK Corporation High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.16.4 CMK Corporation High Density Interconnect Product Offerings
7.16.5 CMK Corporation Recent Development
7.17 Kingboard
7.17.1 Kingboard Company Information
7.17.2 Kingboard Introduction and Business Overview
7.17.3 Kingboard High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.17.4 Kingboard High Density Interconnect Product Offerings
7.17.5 Kingboard Recent Development
7.18 Ellington
7.18.1 Ellington Company Information
7.18.2 Ellington Introduction and Business Overview
7.18.3 Ellington High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.18.4 Ellington High Density Interconnect Product Offerings
7.18.5 Ellington Recent Development
7.19 CCTC
7.19.1 CCTC Company Information
7.19.2 CCTC Introduction and Business Overview
7.19.3 CCTC High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.19.4 CCTC High Density Interconnect Product Offerings
7.19.5 CCTC Recent Development
7.20 Wuzhu Technology
7.20.1 Wuzhu Technology Company Information
7.20.2 Wuzhu Technology Introduction and Business Overview
7.20.3 Wuzhu Technology High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.20.4 Wuzhu Technology High Density Interconnect Product Offerings
7.20.5 Wuzhu Technology Recent Development
7.21 Kinwong
7.21.1 Kinwong Company Information
7.21.2 Kinwong Introduction and Business Overview
7.21.3 Kinwong High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.21.4 Kinwong High Density Interconnect Product Offerings
7.21.5 Kinwong Recent Development
7.22 Aoshikang
7.22.1 Aoshikang Company Information
7.22.2 Aoshikang Introduction and Business Overview
7.22.3 Aoshikang High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.22.4 Aoshikang High Density Interconnect Product Offerings
7.22.5 Aoshikang Recent Development
7.23 Sierra Circuits
7.23.1 Sierra Circuits Company Information
7.23.2 Sierra Circuits Introduction and Business Overview
7.23.3 Sierra Circuits High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.23.4 Sierra Circuits High Density Interconnect Product Offerings
7.23.5 Sierra Circuits Recent Development
7.24 Bittele Electronics
7.24.1 Bittele Electronics Company Information
7.24.2 Bittele Electronics Introduction and Business Overview
7.24.3 Bittele Electronics High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.24.4 Bittele Electronics High Density Interconnect Product Offerings
7.24.5 Bittele Electronics Recent Development
7.25 Epec
7.25.1 Epec Company Information
7.25.2 Epec Introduction and Business Overview
7.25.3 Epec High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.25.4 Epec High Density Interconnect Product Offerings
7.25.5 Epec Recent Development
7.26 W眉rth Elektronik
7.26.1 W眉rth Elektronik Company Information
7.26.2 W眉rth Elektronik Introduction and Business Overview
7.26.3 W眉rth Elektronik High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.26.4 W眉rth Elektronik High Density Interconnect Product Offerings
7.26.5 W眉rth Elektronik Recent Development
7.27 NOD Electronics
7.27.1 NOD Electronics Company Information
7.27.2 NOD Electronics Introduction and Business Overview
7.27.3 NOD Electronics High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.27.4 NOD Electronics High Density Interconnect Product Offerings
7.27.5 NOD Electronics Recent Development
7.28 San Francisco Circuits
7.28.1 San Francisco Circuits Company Information
7.28.2 San Francisco Circuits Introduction and Business Overview
7.28.3 San Francisco Circuits High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.28.4 San Francisco Circuits High Density Interconnect Product Offerings
7.28.5 San Francisco Circuits Recent Development
7.29 PCBCart
7.29.1 PCBCart Company Information
7.29.2 PCBCart Introduction and Business Overview
7.29.3 PCBCart High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.29.4 PCBCart High Density Interconnect Product Offerings
7.29.5 PCBCart Recent Development
7.30 Advanced Circuits
7.30.1 Advanced Circuits Company Information
7.30.2 Advanced Circuits Introduction and Business Overview
7.30.3 Advanced Circuits High Density Interconnect Sales, Revenue and Gross Margin (2019-2024)
7.30.4 Advanced Circuits High Density Interconnect Product Offerings
7.30.5 Advanced Circuits Recent Development
8 Industry Chain Analysis
8.1 High Density Interconnect Industrial Chain
8.2 High Density Interconnect Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 High Density Interconnect Sales Model
8.5.2 Sales Channel
8.5.3 High Density Interconnect Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
IBIDEN Group
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Group
ZDT
Compeq
Unitech Printed Circuit Board Corp.
LG Innotek
Tripod Technology
TTM Technologies
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
CCTC
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Bittele Electronics
Epec
W眉rth Elektronik
NOD Electronics
San Francisco Circuits
PCBCart
Advanced Circuits
听
听
*If Applicable.
