Global Wafer Thinning and Dicing UV Film 麻豆原创 Research Report 2023

Publication ID:

PB511231759

Publication Date:

November 7, 2023

Pages:

101

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip on the front of the wafer, so that the grinding machine can grind the silicon wafer on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 渭m. After grinding, the thickness of the wafer becomes 200 渭m, or even reaches the level of 120 渭m. It depends on the customer鈥檚 requirements and the application environment of the chip, that is, the wafer thinning process. Wafer will stick a layer of film on the back of Wafer before slicing. The function of this film is to stick the chip on the film, which can keep the grain intact during the cutting process and reduce the chipping during the cutting process. Ensure that the die will not be displaced and dropped during the normal transfer process, that is, the scribing process in the post-chip packaging and testing process. A film used to fix Wafer and chip is used in chip thinning and dicing process. In the actual production process, this kind of film generally uses UV film
The global Wafer Thinning and Dicing UV Film market is projected to reach US$ 1216.6 million in 2029, increasing from US$ 981 million in 2022, with the CAGR of 3.1% during the period of 2023 to 2029.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Thinning and Dicing UV Film market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Segment by Type
Back Grinding UV Film
Wafer Dicing UV Film
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Wafer Thinning and Dicing UV Film report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers鈥� Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers鈥� Outline
Chapter 8: Industry Chain, 麻豆原创 Channel and Customer Analysis
Chapter 9: 麻豆原创 Opportunities and Challenges
Chapter 10: 麻豆原创 Conclusions
Chapter 11: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Wafer Thinning and Dicing UV Film 麻豆原创 Overview
1.1 Product Definition
1.2 Wafer Thinning and Dicing UV Film Segment by Type
1.2.1 Global Wafer Thinning and Dicing UV Film 麻豆原创 Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Back Grinding UV Film
1.2.3 Wafer Dicing UV Film
1.3 Wafer Thinning and Dicing UV Film Segment by Application
1.3.1 Global Wafer Thinning and Dicing UV Film 麻豆原创 Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 IDMs
1.3.3 OSAT
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Thinning and Dicing UV Film Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Thinning and Dicing UV Film Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Thinning and Dicing UV Film 麻豆原创 Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Wafer Thinning and Dicing UV Film Production 麻豆原创 Share by Manufacturers (2018-2023)
2.2 Global Wafer Thinning and Dicing UV Film Production Value 麻豆原创 Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Thinning and Dicing UV Film, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Thinning and Dicing UV Film 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Thinning and Dicing UV Film Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Thinning and Dicing UV Film, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Thinning and Dicing UV Film, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Thinning and Dicing UV Film, Date of Enter into This Industry
2.9 Wafer Thinning and Dicing UV Film 麻豆原创 Competitive Situation and Trends
2.9.1 Wafer Thinning and Dicing UV Film 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Thinning and Dicing UV Film Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Thinning and Dicing UV Film Production by Region
3.1 Global Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Thinning and Dicing UV Film Production Value by Region (2018-2029)
3.2.1 Global Wafer Thinning and Dicing UV Film Production Value 麻豆原创 Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Thinning and Dicing UV Film by Region (2024-2029)
3.3 Global Wafer Thinning and Dicing UV Film Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Thinning and Dicing UV Film Production by Region (2018-2029)
3.4.1 Global Wafer Thinning and Dicing UV Film Production 麻豆原创 Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Thinning and Dicing UV Film by Region (2024-2029)
3.5 Global Wafer Thinning and Dicing UV Film 麻豆原创 Price Analysis by Region (2018-2023)
3.6 Global Wafer Thinning and Dicing UV Film Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Thinning and Dicing UV Film Production Value Estimates and Forecasts (2018-2029)
4 Wafer Thinning and Dicing UV Film Consumption by Region
4.1 Global Wafer Thinning and Dicing UV Film Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Thinning and Dicing UV Film Consumption by Region (2018-2029)
4.2.1 Global Wafer Thinning and Dicing UV Film Consumption by Region (2018-2023)
4.2.2 Global Wafer Thinning and Dicing UV Film Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Thinning and Dicing UV Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Thinning and Dicing UV Film Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Thinning and Dicing UV Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Thinning and Dicing UV Film Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Thinning and Dicing UV Film Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Thinning and Dicing UV Film Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Thinning and Dicing UV Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Thinning and Dicing UV Film Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Thinning and Dicing UV Film Production by Type (2018-2029)
5.1.1 Global Wafer Thinning and Dicing UV Film Production by Type (2018-2023)
5.1.2 Global Wafer Thinning and Dicing UV Film Production by Type (2024-2029)
5.1.3 Global Wafer Thinning and Dicing UV Film Production 麻豆原创 Share by Type (2018-2029)
5.2 Global Wafer Thinning and Dicing UV Film Production Value by Type (2018-2029)
5.2.1 Global Wafer Thinning and Dicing UV Film Production Value by Type (2018-2023)
5.2.2 Global Wafer Thinning and Dicing UV Film Production Value by Type (2024-2029)
5.2.3 Global Wafer Thinning and Dicing UV Film Production Value 麻豆原创 Share by Type (2018-2029)
5.3 Global Wafer Thinning and Dicing UV Film Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Thinning and Dicing UV Film Production by Application (2018-2029)
6.1.1 Global Wafer Thinning and Dicing UV Film Production by Application (2018-2023)
6.1.2 Global Wafer Thinning and Dicing UV Film Production by Application (2024-2029)
6.1.3 Global Wafer Thinning and Dicing UV Film Production 麻豆原创 Share by Application (2018-2029)
6.2 Global Wafer Thinning and Dicing UV Film Production Value by Application (2018-2029)
6.2.1 Global Wafer Thinning and Dicing UV Film Production Value by Application (2018-2023)
6.2.2 Global Wafer Thinning and Dicing UV Film Production Value by Application (2024-2029)
6.2.3 Global Wafer Thinning and Dicing UV Film Production Value 麻豆原创 Share by Application (2018-2029)
6.3 Global Wafer Thinning and Dicing UV Film Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Mitsui Chemicals Tohcello
7.1.1 Mitsui Chemicals Tohcello Wafer Thinning and Dicing UV Film Corporation Information
7.1.2 Mitsui Chemicals Tohcello Wafer Thinning and Dicing UV Film Product Portfolio
7.1.3 Mitsui Chemicals Tohcello Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Mitsui Chemicals Tohcello Main Business and 麻豆原创s Served
7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
7.2 LINTEC
7.2.1 LINTEC Wafer Thinning and Dicing UV Film Corporation Information
7.2.2 LINTEC Wafer Thinning and Dicing UV Film Product Portfolio
7.2.3 LINTEC Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.2.4 LINTEC Main Business and 麻豆原创s Served
7.2.5 LINTEC Recent Developments/Updates
7.3 Denka
7.3.1 Denka Wafer Thinning and Dicing UV Film Corporation Information
7.3.2 Denka Wafer Thinning and Dicing UV Film Product Portfolio
7.3.3 Denka Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Denka Main Business and 麻豆原创s Served
7.3.5 Denka Recent Developments/Updates
7.4 Nitto
7.4.1 Nitto Wafer Thinning and Dicing UV Film Corporation Information
7.4.2 Nitto Wafer Thinning and Dicing UV Film Product Portfolio
7.4.3 Nitto Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Nitto Main Business and 麻豆原创s Served
7.4.5 Nitto Recent Developments/Updates
7.5 Furukawa Electric
7.5.1 Furukawa Electric Wafer Thinning and Dicing UV Film Corporation Information
7.5.2 Furukawa Electric Wafer Thinning and Dicing UV Film Product Portfolio
7.5.3 Furukawa Electric Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Furukawa Electric Main Business and 麻豆原创s Served
7.5.5 Furukawa Electric Recent Developments/Updates
7.6 Sumitomo Bakelite
7.6.1 Sumitomo Bakelite Wafer Thinning and Dicing UV Film Corporation Information
7.6.2 Sumitomo Bakelite Wafer Thinning and Dicing UV Film Product Portfolio
7.6.3 Sumitomo Bakelite Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Sumitomo Bakelite Main Business and 麻豆原创s Served
7.6.5 Sumitomo Bakelite Recent Developments/Updates
7.7 D&X
7.7.1 D&X Wafer Thinning and Dicing UV Film Corporation Information
7.7.2 D&X Wafer Thinning and Dicing UV Film Product Portfolio
7.7.3 D&X Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.7.4 D&X Main Business and 麻豆原创s Served
7.7.5 D&X Recent Developments/Updates
7.8 AI Technology
7.8.1 AI Technology Wafer Thinning and Dicing UV Film Corporation Information
7.8.2 AI Technology Wafer Thinning and Dicing UV Film Product Portfolio
7.8.3 AI Technology Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.8.4 AI Technology Main Business and 麻豆原创s Served
7.7.5 AI Technology Recent Developments/Updates
7.9 ULTRON SYSTEM
7.9.1 ULTRON SYSTEM Wafer Thinning and Dicing UV Film Corporation Information
7.9.2 ULTRON SYSTEM Wafer Thinning and Dicing UV Film Product Portfolio
7.9.3 ULTRON SYSTEM Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.9.4 ULTRON SYSTEM Main Business and 麻豆原创s Served
7.9.5 ULTRON SYSTEM Recent Developments/Updates
7.10 maxell
7.10.1 maxell Wafer Thinning and Dicing UV Film Corporation Information
7.10.2 maxell Wafer Thinning and Dicing UV Film Product Portfolio
7.10.3 maxell Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.10.4 maxell Main Business and 麻豆原创s Served
7.10.5 maxell Recent Developments/Updates
7.11 NDS
7.11.1 NDS Wafer Thinning and Dicing UV Film Corporation Information
7.11.2 NDS Wafer Thinning and Dicing UV Film Product Portfolio
7.11.3 NDS Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.11.4 NDS Main Business and 麻豆原创s Served
7.11.5 NDS Recent Developments/Updates
7.12 KGK Chemical
7.12.1 KGK Chemical Wafer Thinning and Dicing UV Film Corporation Information
7.12.2 KGK Chemical Wafer Thinning and Dicing UV Film Product Portfolio
7.12.3 KGK Chemical Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.12.4 KGK Chemical Main Business and 麻豆原创s Served
7.12.5 KGK Chemical Recent Developments/Updates
7.13 NEXTECK
7.13.1 NEXTECK Wafer Thinning and Dicing UV Film Corporation Information
7.13.2 NEXTECK Wafer Thinning and Dicing UV Film Product Portfolio
7.13.3 NEXTECK Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.13.4 NEXTECK Main Business and 麻豆原创s Served
7.13.5 NEXTECK Recent Developments/Updates
7.14 WISE new material
7.14.1 WISE new material Wafer Thinning and Dicing UV Film Corporation Information
7.14.2 WISE new material Wafer Thinning and Dicing UV Film Product Portfolio
7.14.3 WISE new material Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.14.4 WISE new material Main Business and 麻豆原创s Served
7.14.5 WISE new material Recent Developments/Updates
7.15 Vistaic
7.15.1 Vistaic Wafer Thinning and Dicing UV Film Corporation Information
7.15.2 Vistaic Wafer Thinning and Dicing UV Film Product Portfolio
7.15.3 Vistaic Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Vistaic Main Business and 麻豆原创s Served
7.15.5 Vistaic Recent Developments/Updates
7.16 Suzhou BoYan Jingjin Photoelectric
7.16.1 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing UV Film Corporation Information
7.16.2 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing UV Film Product Portfolio
7.16.3 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing UV Film Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Suzhou BoYan Jingjin Photoelectric Main Business and 麻豆原创s Served
7.16.5 Suzhou BoYan Jingjin Photoelectric Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Thinning and Dicing UV Film Industry Chain Analysis
8.2 Wafer Thinning and Dicing UV Film Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Thinning and Dicing UV Film Production Mode & Process
8.4 Wafer Thinning and Dicing UV Film Sales and 麻豆原创ing
8.4.1 Wafer Thinning and Dicing UV Film Sales Channels
8.4.2 Wafer Thinning and Dicing UV Film Distributors
8.5 Wafer Thinning and Dicing UV Film Customers
9 Wafer Thinning and Dicing UV Film 麻豆原创 Dynamics
9.1 Wafer Thinning and Dicing UV Film Industry Trends
9.2 Wafer Thinning and Dicing UV Film 麻豆原创 Drivers
9.3 Wafer Thinning and Dicing UV Film 麻豆原创 Challenges
9.4 Wafer Thinning and Dicing UV Film 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric

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