Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
The global Wafer Backgrinding Tape market is projected to grow from US$ 253 million in 2024 to US$ 333.3 million by 2030, at a Compound Annual Growth Rate (CAGR) of 4.7% during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
In terms of production side, this report researches the Wafer Backgrinding Tape production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Wafer Backgrinding Tape by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for Wafer Backgrinding Tape, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Wafer Backgrinding Tape, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Backgrinding Tape, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Wafer Backgrinding Tape sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Wafer Backgrinding Tape market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Wafer Backgrinding Tape sales, projected growth trends, production technology, application and end-user industry.
麻豆原创 Segmentation
By Company
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Segment by Type
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Wafer Backgrinding Tape production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Wafer Backgrinding Tape in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Wafer Backgrinding Tape manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Backgrinding Tape sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Wafer Backgrinding Tape Product Introduction
1.2 麻豆原创 by Type
1.2.1 Global Wafer Backgrinding Tape 麻豆原创 Size by Type, 2019 VS 2023 VS 2030
1.2.2 Polyolefin (PO)
1.2.3 Polyvinyl Chloride (PVC)
1.2.4 Polyethylene Terephthalate (PET)
1.2.5 Other
1.3 麻豆原创 by Application
1.3.1 Global Wafer Backgrinding Tape 麻豆原创 Size by Application, 2019 VS 2023 VS 2030
1.3.2 IDMs
1.3.3 OSAT
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Wafer Backgrinding Tape Production
2.1 Global Wafer Backgrinding Tape Production Capacity (2019-2030)
2.2 Global Wafer Backgrinding Tape Production by Region: 2019 VS 2023 VS 2030
2.3 Global Wafer Backgrinding Tape Production by Region
2.3.1 Global Wafer Backgrinding Tape Historic Production by Region (2019-2024)
2.3.2 Global Wafer Backgrinding Tape Forecasted Production by Region (2025-2030)
2.3.3 Global Wafer Backgrinding Tape Production 麻豆原创 Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Executive Summary
3.1 Global Wafer Backgrinding Tape Revenue Estimates and Forecasts 2019-2030
3.2 Global Wafer Backgrinding Tape Revenue by Region
3.2.1 Global Wafer Backgrinding Tape Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global Wafer Backgrinding Tape Revenue by Region (2019-2024)
3.2.3 Global Wafer Backgrinding Tape Revenue by Region (2025-2030)
3.2.4 Global Wafer Backgrinding Tape Revenue 麻豆原创 Share by Region (2019-2030)
3.3 Global Wafer Backgrinding Tape Sales Estimates and Forecasts 2019-2030
3.4 Global Wafer Backgrinding Tape Sales by Region
3.4.1 Global Wafer Backgrinding Tape Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global Wafer Backgrinding Tape Sales by Region (2019-2024)
3.4.3 Global Wafer Backgrinding Tape Sales by Region (2025-2030)
3.4.4 Global Wafer Backgrinding Tape Sales 麻豆原创 Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Wafer Backgrinding Tape Sales by Manufacturers
4.1.1 Global Wafer Backgrinding Tape Sales by Manufacturers (2019-2024)
4.1.2 Global Wafer Backgrinding Tape Sales 麻豆原创 Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Wafer Backgrinding Tape in 2023
4.2 Global Wafer Backgrinding Tape Revenue by Manufacturers
4.2.1 Global Wafer Backgrinding Tape Revenue by Manufacturers (2019-2024)
4.2.2 Global Wafer Backgrinding Tape Revenue 麻豆原创 Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Wafer Backgrinding Tape Revenue in 2023
4.3 Global Wafer Backgrinding Tape Sales Price by Manufacturers
4.4 Global Key Players of Wafer Backgrinding Tape, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers 麻豆原创 Concentration Ratio (CR5 and HHI)
4.5.2 Global Wafer Backgrinding Tape 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Wafer Backgrinding Tape, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Wafer Backgrinding Tape, Product Offered and Application
4.8 Global Key Manufacturers of Wafer Backgrinding Tape, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 麻豆原创 Size by Type
5.1 Global Wafer Backgrinding Tape Sales by Type
5.1.1 Global Wafer Backgrinding Tape Historical Sales by Type (2019-2024)
5.1.2 Global Wafer Backgrinding Tape Forecasted Sales by Type (2025-2030)
5.1.3 Global Wafer Backgrinding Tape Sales 麻豆原创 Share by Type (2019-2030)
5.2 Global Wafer Backgrinding Tape Revenue by Type
5.2.1 Global Wafer Backgrinding Tape Historical Revenue by Type (2019-2024)
5.2.2 Global Wafer Backgrinding Tape Forecasted Revenue by Type (2025-2030)
5.2.3 Global Wafer Backgrinding Tape Revenue 麻豆原创 Share by Type (2019-2030)
5.3 Global Wafer Backgrinding Tape Price by Type
5.3.1 Global Wafer Backgrinding Tape Price by Type (2019-2024)
5.3.2 Global Wafer Backgrinding Tape Price Forecast by Type (2025-2030)
6 麻豆原创 Size by Application
6.1 Global Wafer Backgrinding Tape Sales by Application
6.1.1 Global Wafer Backgrinding Tape Historical Sales by Application (2019-2024)
6.1.2 Global Wafer Backgrinding Tape Forecasted Sales by Application (2025-2030)
6.1.3 Global Wafer Backgrinding Tape Sales 麻豆原创 Share by Application (2019-2030)
6.2 Global Wafer Backgrinding Tape Revenue by Application
6.2.1 Global Wafer Backgrinding Tape Historical Revenue by Application (2019-2024)
6.2.2 Global Wafer Backgrinding Tape Forecasted Revenue by Application (2025-2030)
6.2.3 Global Wafer Backgrinding Tape Revenue 麻豆原创 Share by Application (2019-2030)
6.3 Global Wafer Backgrinding Tape Price by Application
6.3.1 Global Wafer Backgrinding Tape Price by Application (2019-2024)
6.3.2 Global Wafer Backgrinding Tape Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada Wafer Backgrinding Tape 麻豆原创 Size by Type
7.1.1 US & Canada Wafer Backgrinding Tape Sales by Type (2019-2030)
7.1.2 US & Canada Wafer Backgrinding Tape Revenue by Type (2019-2030)
7.2 US & Canada Wafer Backgrinding Tape 麻豆原创 Size by Application
7.2.1 US & Canada Wafer Backgrinding Tape Sales by Application (2019-2030)
7.2.2 US & Canada Wafer Backgrinding Tape Revenue by Application (2019-2030)
7.3 US & Canada Wafer Backgrinding Tape Sales by Country
7.3.1 US & Canada Wafer Backgrinding Tape Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada Wafer Backgrinding Tape Sales by Country (2019-2030)
7.3.3 US & Canada Wafer Backgrinding Tape Revenue by Country (2019-2030)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe Wafer Backgrinding Tape 麻豆原创 Size by Type
8.1.1 Europe Wafer Backgrinding Tape Sales by Type (2019-2030)
8.1.2 Europe Wafer Backgrinding Tape Revenue by Type (2019-2030)
8.2 Europe Wafer Backgrinding Tape 麻豆原创 Size by Application
8.2.1 Europe Wafer Backgrinding Tape Sales by Application (2019-2030)
8.2.2 Europe Wafer Backgrinding Tape Revenue by Application (2019-2030)
8.3 Europe Wafer Backgrinding Tape Sales by Country
8.3.1 Europe Wafer Backgrinding Tape Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe Wafer Backgrinding Tape Sales by Country (2019-2030)
8.3.3 Europe Wafer Backgrinding Tape Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Wafer Backgrinding Tape 麻豆原创 Size by Type
9.1.1 China Wafer Backgrinding Tape Sales by Type (2019-2030)
9.1.2 China Wafer Backgrinding Tape Revenue by Type (2019-2030)
9.2 China Wafer Backgrinding Tape 麻豆原创 Size by Application
9.2.1 China Wafer Backgrinding Tape Sales by Application (2019-2030)
9.2.2 China Wafer Backgrinding Tape Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia Wafer Backgrinding Tape 麻豆原创 Size by Type
10.1.1 Asia Wafer Backgrinding Tape Sales by Type (2019-2030)
10.1.2 Asia Wafer Backgrinding Tape Revenue by Type (2019-2030)
10.2 Asia Wafer Backgrinding Tape 麻豆原创 Size by Application
10.2.1 Asia Wafer Backgrinding Tape Sales by Application (2019-2030)
10.2.2 Asia Wafer Backgrinding Tape Revenue by Application (2019-2030)
10.3 Asia Wafer Backgrinding Tape Sales by Region
10.3.1 Asia Wafer Backgrinding Tape Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia Wafer Backgrinding Tape Revenue by Region (2019-2030)
10.3.3 Asia Wafer Backgrinding Tape Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Wafer Backgrinding Tape 麻豆原创 Size by Type
11.1.1 Middle East, Africa and Latin America Wafer Backgrinding Tape Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America Wafer Backgrinding Tape Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America Wafer Backgrinding Tape 麻豆原创 Size by Application
11.2.1 Middle East, Africa and Latin America Wafer Backgrinding Tape Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America Wafer Backgrinding Tape Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America Wafer Backgrinding Tape Sales by Country
11.3.1 Middle East, Africa and Latin America Wafer Backgrinding Tape Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America Wafer Backgrinding Tape Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America Wafer Backgrinding Tape Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Furukawa
12.1.1 Furukawa Company Information
12.1.2 Furukawa Overview
12.1.3 Furukawa Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 Furukawa Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Furukawa Recent Developments
12.2 Nitto Denko
12.2.1 Nitto Denko Company Information
12.2.2 Nitto Denko Overview
12.2.3 Nitto Denko Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 Nitto Denko Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Nitto Denko Recent Developments
12.3 Mitsui Corporation
12.3.1 Mitsui Corporation Company Information
12.3.2 Mitsui Corporation Overview
12.3.3 Mitsui Corporation Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Mitsui Corporation Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Mitsui Corporation Recent Developments
12.4 Lintec Corporation
12.4.1 Lintec Corporation Company Information
12.4.2 Lintec Corporation Overview
12.4.3 Lintec Corporation Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 Lintec Corporation Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Lintec Corporation Recent Developments
12.5 Sumitomo Bakelite
12.5.1 Sumitomo Bakelite Company Information
12.5.2 Sumitomo Bakelite Overview
12.5.3 Sumitomo Bakelite Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 Sumitomo Bakelite Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Sumitomo Bakelite Recent Developments
12.6 Denka Company
12.6.1 Denka Company Company Information
12.6.2 Denka Company Overview
12.6.3 Denka Company Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 Denka Company Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Denka Company Recent Developments
12.7 Pantech Tape
12.7.1 Pantech Tape Company Information
12.7.2 Pantech Tape Overview
12.7.3 Pantech Tape Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Pantech Tape Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Pantech Tape Recent Developments
12.8 Ultron Systems
12.8.1 Ultron Systems Company Information
12.8.2 Ultron Systems Overview
12.8.3 Ultron Systems Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 Ultron Systems Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Ultron Systems Recent Developments
12.9 NEPTCO
12.9.1 NEPTCO Company Information
12.9.2 NEPTCO Overview
12.9.3 NEPTCO Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 NEPTCO Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 NEPTCO Recent Developments
12.10 Nippon Pulse Motor
12.10.1 Nippon Pulse Motor Company Information
12.10.2 Nippon Pulse Motor Overview
12.10.3 Nippon Pulse Motor Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 Nippon Pulse Motor Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Nippon Pulse Motor Recent Developments
12.11 Loadpoint Limited
12.11.1 Loadpoint Limited Company Information
12.11.2 Loadpoint Limited Overview
12.11.3 Loadpoint Limited Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.11.4 Loadpoint Limited Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Loadpoint Limited Recent Developments
12.12 AI Technology
12.12.1 AI Technology Company Information
12.12.2 AI Technology Overview
12.12.3 AI Technology Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.12.4 AI Technology Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 AI Technology Recent Developments
12.13 Minitron Electronic
12.13.1 Minitron Electronic Company Information
12.13.2 Minitron Electronic Overview
12.13.3 Minitron Electronic Wafer Backgrinding Tape Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.13.4 Minitron Electronic Wafer Backgrinding Tape Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Minitron Electronic Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Wafer Backgrinding Tape Industry Chain Analysis
13.2 Wafer Backgrinding Tape Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Wafer Backgrinding Tape Production Mode & Process
13.4 Wafer Backgrinding Tape Sales and 麻豆原创ing
13.4.1 Wafer Backgrinding Tape Sales Channels
13.4.2 Wafer Backgrinding Tape Distributors
13.5 Wafer Backgrinding Tape Customers
14 Wafer Backgrinding Tape 麻豆原创 Dynamics
14.1 Wafer Backgrinding Tape Industry Trends
14.2 Wafer Backgrinding Tape 麻豆原创 Drivers
14.3 Wafer Backgrinding Tape 麻豆原创 Challenges
14.4 Wafer Backgrinding Tape 麻豆原创 Restraints
15 Key Finding in The Global Wafer Backgrinding Tape Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
听
听
*If Applicable.
