Wafer backgrinding tape and dicing tapes are specialized adhesive tapes used in the semiconductor industry for various stages of wafer processing. These tapes play crucial roles in the fabrication of integrated circuits (ICs) by providing temporary bonding, protection, and support during wafer thinning, dicing, and handling processes.
The global Wafer Backgrinding Tape and Dicing Tapes market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Wafer Backgrinding Tape and Dicing Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, LG Chem, Maxell, D&X, AI Technology, Suzhou Boyan Jingjin Photoelectric, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Wafer Backgrinding Tape and Dicing Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Backgrinding Tape and Dicing Tapes.
The Wafer Backgrinding Tape and Dicing Tapes market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Backgrinding Tape and Dicing Tapes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Backgrinding Tape and Dicing Tapes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
by Type
Backgrinding Tape
Dicing Tape
by Application
Front-End Process
Back-End Process
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Backgrinding Tape and Dicing Tapes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Sales, revenue of Wafer Backgrinding Tape and Dicing Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 8: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 9: The main points and conclusions of the report.
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1 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Overview
1.1 Product Definition
1.2 Wafer Backgrinding Tape and Dicing Tapes by Type
1.2.1 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Value Comparison by Type (2024-2030)
1.2.2 Backgrinding Tape
1.2.3 Dicing Tape
1.3 Wafer Backgrinding Tape and Dicing Tapes by Application
1.3.1 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Value by Application (2024-2030)
1.3.2 Front-End Process
1.3.3 Back-End Process
1.4 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size Estimates and Forecasts
1.4.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue 2019-2030
1.4.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales 2019-2030
1.4.3 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Average Price (2019-2030)
1.5 Assumptions and Limitations
2 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Competition by Manufacturers
2.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Wafer Backgrinding Tape and Dicing Tapes Average Price by Manufacturers (2019-2024)
2.4 Global Key Players of Wafer Backgrinding Tape and Dicing Tapes, Industry Ranking, 2022 VS 2023 VS 2024
2.5 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Manufacturing Sites & Headquarters
2.6 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Product Type & Application
2.7 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Date of Enter into This Industry
2.8 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Competitive Situation and Trends
2.8.1 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Concentration Rate
2.8.2 The Global 5 and 10 Largest Wafer Backgrinding Tape and Dicing Tapes Players 麻豆原创 Share by Revenue
2.8.3 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.9 Manufacturers Mergers & Acquisitions, Expansion Plans
3 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Scenario by Region
3.1 Global Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Region: 2019 Versus 2023 Versus 2030
3.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2019-2030
3.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2019-2024
3.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2025-2030
3.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2019-2030
3.3.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2019-2024
3.3.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2025-2030
3.4 North America Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Facts & Figures by Country
3.4.1 North America Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
3.4.2 North America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.4.3 North America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2030)
3.4.4 United States
3.4.5 Canada
3.5 Europe Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Facts & Figures by Country
3.5.1 Europe Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
3.5.2 Europe Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.5.3 Europe Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2030)
3.5.4 Germany
3.5.5 France
3.5.6 U.K.
3.5.7 Italy
3.5.8 Russia
3.6 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Facts & Figures by Region
3.6.1 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
3.6.2 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2019-2030)
3.6.3 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2019-2030)
3.6.4 China
3.6.5 Japan
3.6.6 South Korea
3.6.7 India
3.6.8 Australia
3.6.9 China Taiwan
3.6.10 Southeast Asia
3.7 Latin America Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Facts & Figures by Country
3.7.1 Latin America Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
3.7.2 Latin America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.7.3 Latin America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country
3.7.4 Mexico
3.7.5 Brazil
3.7.6 Argentina
3.7.7 Colombia
3.8 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Facts & Figures by Country
3.8.1 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
3.8.2 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.8.3 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue by Country
3.8.4 Turkey
3.8.5 Saudi Arabia
3.8.6 UAE
4 Segment by Type
4.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2019-2030)
4.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2019-2024)
4.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2025-2030)
4.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Sales 麻豆原创 Share by Type (2019-2030)
4.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2019-2030)
4.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2019-2024)
4.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2025-2030)
4.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue 麻豆原创 Share by Type (2019-2030)
4.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Type (2019-2030)
5 Segment by Application
5.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2019-2030)
5.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2019-2024)
5.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2025-2030)
5.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Sales 麻豆原创 Share by Application (2019-2030)
5.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2019-2030)
5.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2019-2024)
5.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2025-2030)
5.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue 麻豆原创 Share by Application (2019-2030)
5.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Application (2019-2030)
6 Key Companies Profiled
6.1 Mitsui Chemicals Tohcello
6.1.1 Mitsui Chemicals Tohcello Company Information
6.1.2 Mitsui Chemicals Tohcello Description and Business Overview
6.1.3 Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.1.4 Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
6.2 Nitto
6.2.1 Nitto Company Information
6.2.2 Nitto Description and Business Overview
6.2.3 Nitto Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.2.4 Nitto Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.2.5 Nitto Recent Developments/Updates
6.3 LINTEC
6.3.1 LINTEC Company Information
6.3.2 LINTEC Description and Business Overview
6.3.3 LINTEC Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.3.4 LINTEC Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.3.5 LINTEC Recent Developments/Updates
6.4 Furukawa Electric
6.4.1 Furukawa Electric Company Information
6.4.2 Furukawa Electric Description and Business Overview
6.4.3 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.4.4 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.4.5 Furukawa Electric Recent Developments/Updates
6.5 Denka
6.5.1 Denka Company Information
6.5.2 Denka Description and Business Overview
6.5.3 Denka Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.5.4 Denka Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.5.5 Denka Recent Developments/Updates
6.6 LG Chem
6.6.1 LG Chem Company Information
6.6.2 LG Chem Description and Business Overview
6.6.3 LG Chem Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.6.4 LG Chem Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.6.5 LG Chem Recent Developments/Updates
6.7 Maxell
6.7.1 Maxell Company Information
6.7.2 Maxell Description and Business Overview
6.7.3 Maxell Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.7.4 Maxell Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.7.5 Maxell Recent Developments/Updates
6.8 D&X
6.8.1 D&X Company Information
6.8.2 D&X Description and Business Overview
6.8.3 D&X Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.8.4 D&X Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.8.5 D&X Recent Developments/Updates
6.9 AI Technology
6.9.1 AI Technology Company Information
6.9.2 AI Technology Description and Business Overview
6.9.3 AI Technology Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.9.4 AI Technology Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.9.5 AI Technology Recent Developments/Updates
6.10 Suzhou Boyan Jingjin Photoelectric
6.10.1 Suzhou Boyan Jingjin Photoelectric Company Information
6.10.2 Suzhou Boyan Jingjin Photoelectric Description and Business Overview
6.10.3 Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.10.4 Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.10.5 Suzhou Boyan Jingjin Photoelectric Recent Developments/Updates
6.11 Shanghai Guke Adhesive Tape
6.11.1 Shanghai Guke Adhesive Tape Company Information
6.11.2 Shanghai Guke Adhesive Tape Description and Business Overview
6.11.3 Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.11.4 Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.11.5 Shanghai Guke Adhesive Tape Recent Developments/Updates
6.12 WISE New Material
6.12.1 WISE New Material Company Information
6.12.2 WISE New Material Description and Business Overview
6.12.3 WISE New Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.12.4 WISE New Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.12.5 WISE New Material Recent Developments/Updates
6.13 Taicang Zhanxin Adhesive Material
6.13.1 Taicang Zhanxin Adhesive Material Company Information
6.13.2 Taicang Zhanxin Adhesive Material Description and Business Overview
6.13.3 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.13.4 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.13.5 Taicang Zhanxin Adhesive Material Recent Developments/Updates
6.14 Shanghai Plusco Tech
6.14.1 Shanghai Plusco Tech Company Information
6.14.2 Shanghai Plusco Tech Description and Business Overview
6.14.3 Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.14.4 Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.14.5 Shanghai Plusco Tech Recent Developments/Updates
6.15 Kunshan BYE Science Macromolecule Material
6.15.1 Kunshan BYE Science Macromolecule Material Company Information
6.15.2 Kunshan BYE Science Macromolecule Material Description and Business Overview
6.15.3 Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.15.4 Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.15.5 Kunshan BYE Science Macromolecule Material Recent Developments/Updates
6.16 Cybrid Technologies
6.16.1 Cybrid Technologies Company Information
6.16.2 Cybrid Technologies Description and Business Overview
6.16.3 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.16.4 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.16.5 Cybrid Technologies Recent Developments/Updates
7 Industry Chain and Sales Channels Analysis
7.1 Wafer Backgrinding Tape and Dicing Tapes Industry Chain Analysis
7.2 Wafer Backgrinding Tape and Dicing Tapes Key Raw Materials
7.2.1 Key Raw Materials
7.2.2 Raw Materials Key Suppliers
7.3 Wafer Backgrinding Tape and Dicing Tapes Production Mode & Process
7.4 Wafer Backgrinding Tape and Dicing Tapes Sales and 麻豆原创ing
7.4.1 Wafer Backgrinding Tape and Dicing Tapes Sales Channels
7.4.2 Wafer Backgrinding Tape and Dicing Tapes Distributors
7.5 Wafer Backgrinding Tape and Dicing Tapes Customers
8 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Dynamics
8.1 Wafer Backgrinding Tape and Dicing Tapes Industry Trends
8.2 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Drivers
8.3 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Challenges
8.4 Wafer Backgrinding Tape and Dicing Tapes 麻豆原创 Restraints
9 Research Findings and Conclusion
10 Methodology and Data Source
10.1 Methodology/Research Approach
10.1.1 Research Programs/Design
10.1.2 麻豆原创 Size Estimation
10.1.3 麻豆原创 Breakdown and Data Triangulation
10.2 Data Source
10.2.1 Secondary Sources
10.2.2 Primary Sources
10.3 Author List
10.4 Disclaimer
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
听
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*If Applicable.