UV Tape is adhesive tape for semiconductor process. It is designed for surface protection of semiconductor wafer during backgrinding process.Easily de-taped from wafer without stress after UV irradiation.
The global UV Tape for Wafer Dicing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for UV Tape for Wafer Dicing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding UV Tape for Wafer Dicing.
Report Scope
The UV Tape for Wafer Dicing market size, estimations, and forecasts are provided in terms of output/shipments (K Sq) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global UV Tape for Wafer Dicing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the UV Tape for Wafer Dicing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Furukawa Electric
Nitto
Lintec Corporation
Sumitomo Bakelite
DaehyunST
Mitsui Chemicals
AI Technology
Ultron Systems
Semiconductor Equipment Corporation
Toyo Adtec
Pantech Tape
Nippon Pulse Motor Taiwan
Minitron Electronic
Loadpoint
Segment by Type
Single-sided
Double-sided
Segment by Application
Thin Wafer
Bumped Wafer
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of UV Tape for Wafer Dicing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of UV Tape for Wafer Dicing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of UV Tape for Wafer Dicing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 UV Tape for Wafer Dicing 麻豆原创 Overview
1.1 Product Definition
1.2 UV Tape for Wafer Dicing Segment by Type
1.2.1 Global UV Tape for Wafer Dicing 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Single-sided
1.2.3 Double-sided
1.3 UV Tape for Wafer Dicing Segment by Application
1.3.1 Global UV Tape for Wafer Dicing 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Thin Wafer
1.3.3 Bumped Wafer
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global UV Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global UV Tape for Wafer Dicing Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global UV Tape for Wafer Dicing Production Estimates and Forecasts (2019-2030)
1.4.4 Global UV Tape for Wafer Dicing 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global UV Tape for Wafer Dicing Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global UV Tape for Wafer Dicing Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of UV Tape for Wafer Dicing, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global UV Tape for Wafer Dicing 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global UV Tape for Wafer Dicing Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of UV Tape for Wafer Dicing, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of UV Tape for Wafer Dicing, Product Offered and Application
2.8 Global Key Manufacturers of UV Tape for Wafer Dicing, Date of Enter into This Industry
2.9 UV Tape for Wafer Dicing 麻豆原创 Competitive Situation and Trends
2.9.1 UV Tape for Wafer Dicing 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest UV Tape for Wafer Dicing Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 UV Tape for Wafer Dicing Production by Region
3.1 Global UV Tape for Wafer Dicing Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global UV Tape for Wafer Dicing Production Value by Region (2019-2030)
3.2.1 Global UV Tape for Wafer Dicing Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of UV Tape for Wafer Dicing by Region (2025-2030)
3.3 Global UV Tape for Wafer Dicing Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global UV Tape for Wafer Dicing Production by Region (2019-2030)
3.4.1 Global UV Tape for Wafer Dicing Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of UV Tape for Wafer Dicing by Region (2025-2030)
3.5 Global UV Tape for Wafer Dicing 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global UV Tape for Wafer Dicing Production and Value, Year-over-Year Growth
3.6.1 North America UV Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe UV Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.3 China UV Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan UV Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
4 UV Tape for Wafer Dicing Consumption by Region
4.1 Global UV Tape for Wafer Dicing Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global UV Tape for Wafer Dicing Consumption by Region (2019-2030)
4.2.1 Global UV Tape for Wafer Dicing Consumption by Region (2019-2024)
4.2.2 Global UV Tape for Wafer Dicing Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America UV Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America UV Tape for Wafer Dicing Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe UV Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe UV Tape for Wafer Dicing Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific UV Tape for Wafer Dicing Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific UV Tape for Wafer Dicing Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa UV Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa UV Tape for Wafer Dicing Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global UV Tape for Wafer Dicing Production by Type (2019-2030)
5.1.1 Global UV Tape for Wafer Dicing Production by Type (2019-2024)
5.1.2 Global UV Tape for Wafer Dicing Production by Type (2025-2030)
5.1.3 Global UV Tape for Wafer Dicing Production 麻豆原创 Share by Type (2019-2030)
5.2 Global UV Tape for Wafer Dicing Production Value by Type (2019-2030)
5.2.1 Global UV Tape for Wafer Dicing Production Value by Type (2019-2024)
5.2.2 Global UV Tape for Wafer Dicing Production Value by Type (2025-2030)
5.2.3 Global UV Tape for Wafer Dicing Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global UV Tape for Wafer Dicing Price by Type (2019-2030)
6 Segment by Application
6.1 Global UV Tape for Wafer Dicing Production by Application (2019-2030)
6.1.1 Global UV Tape for Wafer Dicing Production by Application (2019-2024)
6.1.2 Global UV Tape for Wafer Dicing Production by Application (2025-2030)
6.1.3 Global UV Tape for Wafer Dicing Production 麻豆原创 Share by Application (2019-2030)
6.2 Global UV Tape for Wafer Dicing Production Value by Application (2019-2030)
6.2.1 Global UV Tape for Wafer Dicing Production Value by Application (2019-2024)
6.2.2 Global UV Tape for Wafer Dicing Production Value by Application (2025-2030)
6.2.3 Global UV Tape for Wafer Dicing Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global UV Tape for Wafer Dicing Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Furukawa Electric
7.1.1 Furukawa Electric UV Tape for Wafer Dicing Corporation Information
7.1.2 Furukawa Electric UV Tape for Wafer Dicing Product Portfolio
7.1.3 Furukawa Electric UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Furukawa Electric Main Business and 麻豆原创s Served
7.1.5 Furukawa Electric Recent Developments/Updates
7.2 Nitto
7.2.1 Nitto UV Tape for Wafer Dicing Corporation Information
7.2.2 Nitto UV Tape for Wafer Dicing Product Portfolio
7.2.3 Nitto UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Main Business and 麻豆原创s Served
7.2.5 Nitto Recent Developments/Updates
7.3 Lintec Corporation
7.3.1 Lintec Corporation UV Tape for Wafer Dicing Corporation Information
7.3.2 Lintec Corporation UV Tape for Wafer Dicing Product Portfolio
7.3.3 Lintec Corporation UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Lintec Corporation Main Business and 麻豆原创s Served
7.3.5 Lintec Corporation Recent Developments/Updates
7.4 Sumitomo Bakelite
7.4.1 Sumitomo Bakelite UV Tape for Wafer Dicing Corporation Information
7.4.2 Sumitomo Bakelite UV Tape for Wafer Dicing Product Portfolio
7.4.3 Sumitomo Bakelite UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Sumitomo Bakelite Main Business and 麻豆原创s Served
7.4.5 Sumitomo Bakelite Recent Developments/Updates
7.5 DaehyunST
7.5.1 DaehyunST UV Tape for Wafer Dicing Corporation Information
7.5.2 DaehyunST UV Tape for Wafer Dicing Product Portfolio
7.5.3 DaehyunST UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.5.4 DaehyunST Main Business and 麻豆原创s Served
7.5.5 DaehyunST Recent Developments/Updates
7.6 Mitsui Chemicals
7.6.1 Mitsui Chemicals UV Tape for Wafer Dicing Corporation Information
7.6.2 Mitsui Chemicals UV Tape for Wafer Dicing Product Portfolio
7.6.3 Mitsui Chemicals UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Mitsui Chemicals Main Business and 麻豆原创s Served
7.6.5 Mitsui Chemicals Recent Developments/Updates
7.7 AI Technology
7.7.1 AI Technology UV Tape for Wafer Dicing Corporation Information
7.7.2 AI Technology UV Tape for Wafer Dicing Product Portfolio
7.7.3 AI Technology UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.7.4 AI Technology Main Business and 麻豆原创s Served
7.7.5 AI Technology Recent Developments/Updates
7.8 Ultron Systems
7.8.1 Ultron Systems UV Tape for Wafer Dicing Corporation Information
7.8.2 Ultron Systems UV Tape for Wafer Dicing Product Portfolio
7.8.3 Ultron Systems UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Ultron Systems Main Business and 麻豆原创s Served
7.7.5 Ultron Systems Recent Developments/Updates
7.9 Semiconductor Equipment Corporation
7.9.1 Semiconductor Equipment Corporation UV Tape for Wafer Dicing Corporation Information
7.9.2 Semiconductor Equipment Corporation UV Tape for Wafer Dicing Product Portfolio
7.9.3 Semiconductor Equipment Corporation UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Semiconductor Equipment Corporation Main Business and 麻豆原创s Served
7.9.5 Semiconductor Equipment Corporation Recent Developments/Updates
7.10 Toyo Adtec
7.10.1 Toyo Adtec UV Tape for Wafer Dicing Corporation Information
7.10.2 Toyo Adtec UV Tape for Wafer Dicing Product Portfolio
7.10.3 Toyo Adtec UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Toyo Adtec Main Business and 麻豆原创s Served
7.10.5 Toyo Adtec Recent Developments/Updates
7.11 Pantech Tape
7.11.1 Pantech Tape UV Tape for Wafer Dicing Corporation Information
7.11.2 Pantech Tape UV Tape for Wafer Dicing Product Portfolio
7.11.3 Pantech Tape UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Pantech Tape Main Business and 麻豆原创s Served
7.11.5 Pantech Tape Recent Developments/Updates
7.12 Nippon Pulse Motor Taiwan
7.12.1 Nippon Pulse Motor Taiwan UV Tape for Wafer Dicing Corporation Information
7.12.2 Nippon Pulse Motor Taiwan UV Tape for Wafer Dicing Product Portfolio
7.12.3 Nippon Pulse Motor Taiwan UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Nippon Pulse Motor Taiwan Main Business and 麻豆原创s Served
7.12.5 Nippon Pulse Motor Taiwan Recent Developments/Updates
7.13 Minitron Electronic
7.13.1 Minitron Electronic UV Tape for Wafer Dicing Corporation Information
7.13.2 Minitron Electronic UV Tape for Wafer Dicing Product Portfolio
7.13.3 Minitron Electronic UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Minitron Electronic Main Business and 麻豆原创s Served
7.13.5 Minitron Electronic Recent Developments/Updates
7.14 Loadpoint
7.14.1 Loadpoint UV Tape for Wafer Dicing Corporation Information
7.14.2 Loadpoint UV Tape for Wafer Dicing Product Portfolio
7.14.3 Loadpoint UV Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Loadpoint Main Business and 麻豆原创s Served
7.14.5 Loadpoint Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 UV Tape for Wafer Dicing Industry Chain Analysis
8.2 UV Tape for Wafer Dicing Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 UV Tape for Wafer Dicing Production Mode & Process
8.4 UV Tape for Wafer Dicing Sales and 麻豆原创ing
8.4.1 UV Tape for Wafer Dicing Sales Channels
8.4.2 UV Tape for Wafer Dicing Distributors
8.5 UV Tape for Wafer Dicing Customers
9 UV Tape for Wafer Dicing 麻豆原创 Dynamics
9.1 UV Tape for Wafer Dicing Industry Trends
9.2 UV Tape for Wafer Dicing 麻豆原创 Drivers
9.3 UV Tape for Wafer Dicing 麻豆原创 Challenges
9.4 UV Tape for Wafer Dicing 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Furukawa Electric
Nitto
Lintec Corporation
Sumitomo Bakelite
DaehyunST
Mitsui Chemicals
AI Technology
Ultron Systems
Semiconductor Equipment Corporation
Toyo Adtec
Pantech Tape
Nippon Pulse Motor Taiwan
Minitron Electronic
Loadpoint
听
听
*If Applicable.
