Universal Chiplet Interconnect Express听(UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets.
The global Universal Chiplet Interconnect Express (Ucle) market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key companies engaged in the Universal Chiplet Interconnect Express (Ucle) industry include AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm and Samsung, etc. Among those companies, the top 3 players guaranteed % supply worldwide in 2022.
When refers to consumption region, % value of Universal Chiplet Interconnect Express (Ucle) were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Universal Chiplet Interconnect Express (Ucle) market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Universal Chiplet Interconnect Express (Ucle) market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
AMD
Arm
ASE Group
Google Cloud
Intel
Meta
Microsoft
Qualcomm
Samsung
TSMC
Synopsys
Cadence
ADI
Broadcom
Segment by Type
2.5D Package
3D Package
MCM Package
Others
Segment by Application
Advanced Packaging
Semiconductor Test
Package Test Equipment
IP/EDA
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Universal Chiplet Interconnect Express (Ucle) report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. 麻豆原创 Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: 麻豆原创 Conclusions
Chapter 13: Research Methodology and Data Source
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 2.5D Package
1.2.3 3D Package
1.2.4 MCM Package
1.2.5 Others
1.3 麻豆原创 by Application
1.3.1 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Advanced Packaging
1.3.3 Semiconductor Test
1.3.4 Package Test Equipment
1.3.5 IP/EDA
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Perspective (2018-2029)
2.2 Universal Chiplet Interconnect Express (Ucle) Growth Trends by Region
2.2.1 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Universal Chiplet Interconnect Express (Ucle) Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Universal Chiplet Interconnect Express (Ucle) Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Dynamics
2.3.1 Universal Chiplet Interconnect Express (Ucle) Industry Trends
2.3.2 Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Drivers
2.3.3 Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Challenges
2.3.4 Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Universal Chiplet Interconnect Express (Ucle) Players by Revenue
3.1.1 Global Top Universal Chiplet Interconnect Express (Ucle) Players by Revenue (2018-2023)
3.1.2 Global Universal Chiplet Interconnect Express (Ucle) Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Universal Chiplet Interconnect Express (Ucle) Revenue
3.4 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Concentration Ratio
3.4.1 Global Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Universal Chiplet Interconnect Express (Ucle) Revenue in 2022
3.5 Universal Chiplet Interconnect Express (Ucle) Key Players Head office and Area Served
3.6 Key Players Universal Chiplet Interconnect Express (Ucle) Product Solution and Service
3.7 Date of Enter into Universal Chiplet Interconnect Express (Ucle) 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Universal Chiplet Interconnect Express (Ucle) Breakdown Data by Type
4.1 Global Universal Chiplet Interconnect Express (Ucle) Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Universal Chiplet Interconnect Express (Ucle) Forecasted 麻豆原创 Size by Type (2024-2029)
5 Universal Chiplet Interconnect Express (Ucle) Breakdown Data by Application
5.1 Global Universal Chiplet Interconnect Express (Ucle) Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Universal Chiplet Interconnect Express (Ucle) Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size (2018-2029)
6.2 North America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2018-2023)
6.4 North America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size (2018-2029)
7.2 Europe Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2018-2023)
7.4 Europe Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size (2018-2029)
9.2 Latin America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Universal Chiplet Interconnect Express (Ucle) 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 AMD
11.1.1 AMD Company Detail
11.1.2 AMD Business Overview
11.1.3 AMD Universal Chiplet Interconnect Express (Ucle) Introduction
11.1.4 AMD Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.1.5 AMD Recent Development
11.2 Arm
11.2.1 Arm Company Detail
11.2.2 Arm Business Overview
11.2.3 Arm Universal Chiplet Interconnect Express (Ucle) Introduction
11.2.4 Arm Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.2.5 Arm Recent Development
11.3 ASE Group
11.3.1 ASE Group Company Detail
11.3.2 ASE Group Business Overview
11.3.3 ASE Group Universal Chiplet Interconnect Express (Ucle) Introduction
11.3.4 ASE Group Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.3.5 ASE Group Recent Development
11.4 Google Cloud
11.4.1 Google Cloud Company Detail
11.4.2 Google Cloud Business Overview
11.4.3 Google Cloud Universal Chiplet Interconnect Express (Ucle) Introduction
11.4.4 Google Cloud Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.4.5 Google Cloud Recent Development
11.5 Intel
11.5.1 Intel Company Detail
11.5.2 Intel Business Overview
11.5.3 Intel Universal Chiplet Interconnect Express (Ucle) Introduction
11.5.4 Intel Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.5.5 Intel Recent Development
11.6 Meta
11.6.1 Meta Company Detail
11.6.2 Meta Business Overview
11.6.3 Meta Universal Chiplet Interconnect Express (Ucle) Introduction
11.6.4 Meta Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.6.5 Meta Recent Development
11.7 Microsoft
11.7.1 Microsoft Company Detail
11.7.2 Microsoft Business Overview
11.7.3 Microsoft Universal Chiplet Interconnect Express (Ucle) Introduction
11.7.4 Microsoft Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.7.5 Microsoft Recent Development
11.8 Qualcomm
11.8.1 Qualcomm Company Detail
11.8.2 Qualcomm Business Overview
11.8.3 Qualcomm Universal Chiplet Interconnect Express (Ucle) Introduction
11.8.4 Qualcomm Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.8.5 Qualcomm Recent Development
11.9 Samsung
11.9.1 Samsung Company Detail
11.9.2 Samsung Business Overview
11.9.3 Samsung Universal Chiplet Interconnect Express (Ucle) Introduction
11.9.4 Samsung Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.9.5 Samsung Recent Development
11.10 TSMC
11.10.1 TSMC Company Detail
11.10.2 TSMC Business Overview
11.10.3 TSMC Universal Chiplet Interconnect Express (Ucle) Introduction
11.10.4 TSMC Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.10.5 TSMC Recent Development
11.11 Synopsys
11.11.1 Synopsys Company Detail
11.11.2 Synopsys Business Overview
11.11.3 Synopsys Universal Chiplet Interconnect Express (Ucle) Introduction
11.11.4 Synopsys Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.11.5 Synopsys Recent Development
11.12 Cadence
11.12.1 Cadence Company Detail
11.12.2 Cadence Business Overview
11.12.3 Cadence Universal Chiplet Interconnect Express (Ucle) Introduction
11.12.4 Cadence Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.12.5 Cadence Recent Development
11.13 ADI
11.13.1 ADI Company Detail
11.13.2 ADI Business Overview
11.13.3 ADI Universal Chiplet Interconnect Express (Ucle) Introduction
11.13.4 ADI Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.13.5 ADI Recent Development
11.14 Broadcom
11.14.1 Broadcom Company Detail
11.14.2 Broadcom Business Overview
11.14.3 Broadcom Universal Chiplet Interconnect Express (Ucle) Introduction
11.14.4 Broadcom Revenue in Universal Chiplet Interconnect Express (Ucle) Business (2018-2023)
11.14.5 Broadcom Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
AMD
Arm
ASE Group
Google Cloud
Intel
Meta
Microsoft
Qualcomm
Samsung
TSMC
Synopsys
Cadence
ADI
Broadcom
听
听
*If Applicable.
