The global market for Underfills for Semiconductor was valued at US$ 276 million in the year 2024 and is projected to reach a revised size of US$ 460 million by 2031, growing at a CAGR of 7.1% during the forecast period.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Underfills for Semiconductor competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.
From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.
In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Underfills for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Underfills for Semiconductor.
The Underfills for Semiconductor market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Underfills for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Underfills for Semiconductor manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Company
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller
Segment by Type
PLP Underfill
WLP Underfill
Segment by Application
Consumer Electronics
Automotive
Telecom & Infrastructure
Medical
Industrial
Aerospace & Defense
Others
Production by Region
Japan
USA
China
Europe
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Middle East and Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Underfills for Semiconductor manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Underfills for Semiconductor by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Underfills for Semiconductor in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Underfills for Semiconductor 麻豆原创 Overview
1.1 Product Definition
1.2 Underfills for Semiconductor by Type
1.2.1 Global Underfills for Semiconductor 麻豆原创 Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 PLP Underfill
1.2.3 WLP Underfill
1.3 Underfills for Semiconductor by Application
1.3.1 Global Underfills for Semiconductor 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Telecom & Infrastructure
1.3.5 Medical
1.3.6 Industrial
1.3.7 Aerospace & Defense
1.3.8 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Underfills for Semiconductor Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Underfills for Semiconductor Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Underfills for Semiconductor Production Estimates and Forecasts (2020-2031)
1.4.4 Global Underfills for Semiconductor 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Underfills for Semiconductor Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global Underfills for Semiconductor Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of Underfills for Semiconductor, Industry Ranking, 2023 VS 2024
2.4 Global Underfills for Semiconductor Company Type and 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Underfills for Semiconductor Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Underfills for Semiconductor, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Underfills for Semiconductor, Product Offered and Application
2.8 Global Key Manufacturers of Underfills for Semiconductor, Date of Enter into This Industry
2.9 Underfills for Semiconductor 麻豆原创 Competitive Situation and Trends
2.9.1 Underfills for Semiconductor 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Underfills for Semiconductor Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Underfills for Semiconductor Production by Region
3.1 Global Underfills for Semiconductor Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Underfills for Semiconductor Production Value by Region (2020-2031)
3.2.1 Global Underfills for Semiconductor Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Underfills for Semiconductor by Region (2026-2031)
3.3 Global Underfills for Semiconductor Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Underfills for Semiconductor Production Volume by Region (2020-2031)
3.4.1 Global Underfills for Semiconductor Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Underfills for Semiconductor by Region (2026-2031)
3.5 Global Underfills for Semiconductor 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global Underfills for Semiconductor Production and Value, Year-over-Year Growth
3.6.1 Japan Underfills for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.2 USA Underfills for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Underfills for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.4 Europe Underfills for Semiconductor Production Value Estimates and Forecasts (2020-2031)
4 Underfills for Semiconductor Consumption by Region
4.1 Global Underfills for Semiconductor Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Underfills for Semiconductor Consumption by Region (2020-2031)
4.2.1 Global Underfills for Semiconductor Consumption by Region (2020-2025)
4.2.2 Global Underfills for Semiconductor Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Underfills for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Underfills for Semiconductor Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Underfills for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Underfills for Semiconductor Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Underfills for Semiconductor Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Underfills for Semiconductor Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Underfills for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Underfills for Semiconductor Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Underfills for Semiconductor Production by Type (2020-2031)
5.1.1 Global Underfills for Semiconductor Production by Type (2020-2025)
5.1.2 Global Underfills for Semiconductor Production by Type (2026-2031)
5.1.3 Global Underfills for Semiconductor Production 麻豆原创 Share by Type (2020-2031)
5.2 Global Underfills for Semiconductor Production Value by Type (2020-2031)
5.2.1 Global Underfills for Semiconductor Production Value by Type (2020-2025)
5.2.2 Global Underfills for Semiconductor Production Value by Type (2026-2031)
5.2.3 Global Underfills for Semiconductor Production Value 麻豆原创 Share by Type (2020-2031)
5.3 Global Underfills for Semiconductor Price by Type (2020-2031)
6 Segment by Application
6.1 Global Underfills for Semiconductor Production by Application (2020-2031)
6.1.1 Global Underfills for Semiconductor Production by Application (2020-2025)
6.1.2 Global Underfills for Semiconductor Production by Application (2026-2031)
6.1.3 Global Underfills for Semiconductor Production 麻豆原创 Share by Application (2020-2031)
6.2 Global Underfills for Semiconductor Production Value by Application (2020-2031)
6.2.1 Global Underfills for Semiconductor Production Value by Application (2020-2025)
6.2.2 Global Underfills for Semiconductor Production Value by Application (2026-2031)
6.2.3 Global Underfills for Semiconductor Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global Underfills for Semiconductor Price by Application (2020-2031)
7 Key Companies Profiled
7.1 NAMICS
7.1.1 NAMICS Underfills for Semiconductor Company Information
7.1.2 NAMICS Underfills for Semiconductor Product Portfolio
7.1.3 NAMICS Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.1.4 NAMICS Main Business and 麻豆原创s Served
7.1.5 NAMICS Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Underfills for Semiconductor Company Information
7.2.2 Henkel Underfills for Semiconductor Product Portfolio
7.2.3 Henkel Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Henkel Main Business and 麻豆原创s Served
7.2.5 Henkel Recent Developments/Updates
7.3 RESONAC
7.3.1 RESONAC Underfills for Semiconductor Company Information
7.3.2 RESONAC Underfills for Semiconductor Product Portfolio
7.3.3 RESONAC Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.3.4 RESONAC Main Business and 麻豆原创s Served
7.3.5 RESONAC Recent Developments/Updates
7.4 Nagase ChemteX Corporation
7.4.1 Nagase ChemteX Corporation Underfills for Semiconductor Company Information
7.4.2 Nagase ChemteX Corporation Underfills for Semiconductor Product Portfolio
7.4.3 Nagase ChemteX Corporation Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Nagase ChemteX Corporation Main Business and 麻豆原创s Served
7.4.5 Nagase ChemteX Corporation Recent Developments/Updates
7.5 Shin-Etsu Chemical
7.5.1 Shin-Etsu Chemical Underfills for Semiconductor Company Information
7.5.2 Shin-Etsu Chemical Underfills for Semiconductor Product Portfolio
7.5.3 Shin-Etsu Chemical Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Shin-Etsu Chemical Main Business and 麻豆原创s Served
7.5.5 Shin-Etsu Chemical Recent Developments/Updates
7.6 Panasonic
7.6.1 Panasonic Underfills for Semiconductor Company Information
7.6.2 Panasonic Underfills for Semiconductor Product Portfolio
7.6.3 Panasonic Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Panasonic Main Business and 麻豆原创s Served
7.6.5 Panasonic Recent Developments/Updates
7.7 MacDermid Alpha
7.7.1 MacDermid Alpha Underfills for Semiconductor Company Information
7.7.2 MacDermid Alpha Underfills for Semiconductor Product Portfolio
7.7.3 MacDermid Alpha Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.7.4 MacDermid Alpha Main Business and 麻豆原创s Served
7.7.5 MacDermid Alpha Recent Developments/Updates
7.8 Sunstar
7.8.1 Sunstar Underfills for Semiconductor Company Information
7.8.2 Sunstar Underfills for Semiconductor Product Portfolio
7.8.3 Sunstar Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Sunstar Main Business and 麻豆原创s Served
7.8.5 Sunstar Recent Developments/Updates
7.9 Fuji Chemical
7.9.1 Fuji Chemical Underfills for Semiconductor Company Information
7.9.2 Fuji Chemical Underfills for Semiconductor Product Portfolio
7.9.3 Fuji Chemical Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Fuji Chemical Main Business and 麻豆原创s Served
7.9.5 Fuji Chemical Recent Developments/Updates
7.10 Zymet
7.10.1 Zymet Underfills for Semiconductor Company Information
7.10.2 Zymet Underfills for Semiconductor Product Portfolio
7.10.3 Zymet Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Zymet Main Business and 麻豆原创s Served
7.10.5 Zymet Recent Developments/Updates
7.11 Shenzhen Dover
7.11.1 Shenzhen Dover Underfills for Semiconductor Company Information
7.11.2 Shenzhen Dover Underfills for Semiconductor Product Portfolio
7.11.3 Shenzhen Dover Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Shenzhen Dover Main Business and 麻豆原创s Served
7.11.5 Shenzhen Dover Recent Developments/Updates
7.12 Threebond
7.12.1 Threebond Underfills for Semiconductor Company Information
7.12.2 Threebond Underfills for Semiconductor Product Portfolio
7.12.3 Threebond Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Threebond Main Business and 麻豆原创s Served
7.12.5 Threebond Recent Developments/Updates
7.13 AIM Solder
7.13.1 AIM Solder Underfills for Semiconductor Company Information
7.13.2 AIM Solder Underfills for Semiconductor Product Portfolio
7.13.3 AIM Solder Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.13.4 AIM Solder Main Business and 麻豆原创s Served
7.13.5 AIM Solder Recent Developments/Updates
7.14 Darbond
7.14.1 Darbond Underfills for Semiconductor Company Information
7.14.2 Darbond Underfills for Semiconductor Product Portfolio
7.14.3 Darbond Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Darbond Main Business and 麻豆原创s Served
7.14.5 Darbond Recent Developments/Updates
7.15 Master Bond
7.15.1 Master Bond Underfills for Semiconductor Company Information
7.15.2 Master Bond Underfills for Semiconductor Product Portfolio
7.15.3 Master Bond Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Master Bond Main Business and 麻豆原创s Served
7.15.5 Master Bond Recent Developments/Updates
7.16 Jiangsu HHCK Advanced Materials Co.,Ltd
7.16.1 Jiangsu HHCK Advanced Materials Co.,Ltd Underfills for Semiconductor Company Information
7.16.2 Jiangsu HHCK Advanced Materials Co.,Ltd Underfills for Semiconductor Product Portfolio
7.16.3 Jiangsu HHCK Advanced Materials Co.,Ltd Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Jiangsu HHCK Advanced Materials Co.,Ltd Main Business and 麻豆原创s Served
7.16.5 Jiangsu HHCK Advanced Materials Co.,Ltd Recent Developments/Updates
7.17 Parker Hannifin
7.17.1 Parker Hannifin Underfills for Semiconductor Company Information
7.17.2 Parker Hannifin Underfills for Semiconductor Product Portfolio
7.17.3 Parker Hannifin Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Parker Hannifin Main Business and 麻豆原创s Served
7.17.5 Parker Hannifin Recent Developments/Updates
7.18 Asec Co., Ltd.
7.18.1 Asec Co., Ltd. Underfills for Semiconductor Company Information
7.18.2 Asec Co., Ltd. Underfills for Semiconductor Product Portfolio
7.18.3 Asec Co., Ltd. Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Asec Co., Ltd. Main Business and 麻豆原创s Served
7.18.5 Asec Co., Ltd. Recent Developments/Updates
7.19 Panacol-Elosol
7.19.1 Panacol-Elosol Underfills for Semiconductor Company Information
7.19.2 Panacol-Elosol Underfills for Semiconductor Product Portfolio
7.19.3 Panacol-Elosol Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Panacol-Elosol Main Business and 麻豆原创s Served
7.19.5 Panacol-Elosol Recent Developments/Updates
7.20 United Adhesives
7.20.1 United Adhesives Underfills for Semiconductor Company Information
7.20.2 United Adhesives Underfills for Semiconductor Product Portfolio
7.20.3 United Adhesives Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.20.4 United Adhesives Main Business and 麻豆原创s Served
7.20.5 United Adhesives Recent Developments/Updates
7.21 Henan Siny Optic-com Co., Ltd
7.21.1 Henan Siny Optic-com Co., Ltd Underfills for Semiconductor Company Information
7.21.2 Henan Siny Optic-com Co., Ltd Underfills for Semiconductor Product Portfolio
7.21.3 Henan Siny Optic-com Co., Ltd Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.21.4 Henan Siny Optic-com Co., Ltd Main Business and 麻豆原创s Served
7.21.5 Henan Siny Optic-com Co., Ltd Recent Developments/Updates
7.22 Dongguan Hanstars
7.22.1 Dongguan Hanstars Underfills for Semiconductor Company Information
7.22.2 Dongguan Hanstars Underfills for Semiconductor Product Portfolio
7.22.3 Dongguan Hanstars Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.22.4 Dongguan Hanstars Main Business and 麻豆原创s Served
7.22.5 Dongguan Hanstars Recent Developments/Updates
7.23 GTA Material
7.23.1 GTA Material Underfills for Semiconductor Company Information
7.23.2 GTA Material Underfills for Semiconductor Product Portfolio
7.23.3 GTA Material Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.23.4 GTA Material Main Business and 麻豆原创s Served
7.23.5 GTA Material Recent Developments/Updates
7.24 H.B.Fuller
7.24.1 H.B.Fuller Underfills for Semiconductor Company Information
7.24.2 H.B.Fuller Underfills for Semiconductor Product Portfolio
7.24.3 H.B.Fuller Underfills for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.24.4 H.B.Fuller Main Business and 麻豆原创s Served
7.24.5 H.B.Fuller Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Underfills for Semiconductor Industry Chain Analysis
8.2 Underfills for Semiconductor Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Underfills for Semiconductor Production Mode & Process Analysis
8.4 Underfills for Semiconductor Sales and 麻豆原创ing
8.4.1 Underfills for Semiconductor Sales Channels
8.4.2 Underfills for Semiconductor Distributors
8.5 Underfills for Semiconductor Customer Analysis
9 Underfills for Semiconductor 麻豆原创 Dynamics
9.1 Underfills for Semiconductor Industry Trends
9.2 Underfills for Semiconductor 麻豆原创 Drivers
9.3 Underfills for Semiconductor 麻豆原创 Challenges
9.4 Underfills for Semiconductor 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller
听
听
*If Applicable.
