Global Through Glass Via (TGV) Wafer 麻豆原创 Research Report 2023

Publication ID:

PB501242238

Publication Date:

January 6, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

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Semiconductors [2]

Computing & Electronics [3]

Description:

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
Highlights
The global Through Glass Via (TGV) Wafer market was valued at US$ 77 million in 2022 and is anticipated to reach US$ 501.8 million by 2029, witnessing a CAGR of 36.7% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Wafer.
The Through Glass Via (TGV) Wafer market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Through Glass Via (TGV) Wafer market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Through Glass Via (TGV) Wafer companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Segment by Type
300 mm
200 mm
Below150 mm
Segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Through Glass Via (TGV) Wafer companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

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Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 300 mm
1.2.3 200 mm
1.2.4 Below150 mm
1.3 麻豆原创 by Application
1.3.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Biotechnology/Medical
1.3.3 Consumer Electronics
1.3.4 Automotive
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Perspective (2018-2029)
2.2 Through Glass Via (TGV) Wafer Growth Trends by Region
2.2.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Through Glass Via (TGV) Wafer Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Through Glass Via (TGV) Wafer Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Through Glass Via (TGV) Wafer 麻豆原创 Dynamics
2.3.1 Through Glass Via (TGV) Wafer Industry Trends
2.3.2 Through Glass Via (TGV) Wafer 麻豆原创 Drivers
2.3.3 Through Glass Via (TGV) Wafer 麻豆原创 Challenges
2.3.4 Through Glass Via (TGV) Wafer 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Through Glass Via (TGV) Wafer Players by Revenue
3.1.1 Global Top Through Glass Via (TGV) Wafer Players by Revenue (2018-2023)
3.1.2 Global Through Glass Via (TGV) Wafer Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Through Glass Via (TGV) Wafer 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Through Glass Via (TGV) Wafer Revenue
3.4 Global Through Glass Via (TGV) Wafer 麻豆原创 Concentration Ratio
3.4.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Through Glass Via (TGV) Wafer Revenue in 2022
3.5 Through Glass Via (TGV) Wafer Key Players Head office and Area Served
3.6 Key Players Through Glass Via (TGV) Wafer Product Solution and Service
3.7 Date of Enter into Through Glass Via (TGV) Wafer 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Through Glass Via (TGV) Wafer Breakdown Data by Type
4.1 Global Through Glass Via (TGV) Wafer Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Through Glass Via (TGV) Wafer Forecasted 麻豆原创 Size by Type (2024-2029)
5 Through Glass Via (TGV) Wafer Breakdown Data by Application
5.1 Global Through Glass Via (TGV) Wafer Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Through Glass Via (TGV) Wafer Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Through Glass Via (TGV) Wafer 麻豆原创 Size (2018-2029)
6.2 North America Through Glass Via (TGV) Wafer 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2018-2023)
6.4 North America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size (2018-2029)
7.2 Europe Through Glass Via (TGV) Wafer 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2018-2023)
7.4 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Through Glass Via (TGV) Wafer 麻豆原创 Size (2018-2029)
9.2 Latin America Through Glass Via (TGV) Wafer 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Corning
11.1.1 Corning Company Detail
11.1.2 Corning Business Overview
11.1.3 Corning Through Glass Via (TGV) Wafer Introduction
11.1.4 Corning Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.1.5 Corning Recent Development
11.2 LPKF
11.2.1 LPKF Company Detail
11.2.2 LPKF Business Overview
11.2.3 LPKF Through Glass Via (TGV) Wafer Introduction
11.2.4 LPKF Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.2.5 LPKF Recent Development
11.3 Samtec
11.3.1 Samtec Company Detail
11.3.2 Samtec Business Overview
11.3.3 Samtec Through Glass Via (TGV) Wafer Introduction
11.3.4 Samtec Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.3.5 Samtec Recent Development
11.4 Kiso Micro Co.LTD
11.4.1 Kiso Micro Co.LTD Company Detail
11.4.2 Kiso Micro Co.LTD Business Overview
11.4.3 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Introduction
11.4.4 Kiso Micro Co.LTD Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.4.5 Kiso Micro Co.LTD Recent Development
11.5 Tecnisco
11.5.1 Tecnisco Company Detail
11.5.2 Tecnisco Business Overview
11.5.3 Tecnisco Through Glass Via (TGV) Wafer Introduction
11.5.4 Tecnisco Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.5.5 Tecnisco Recent Development
11.6 Microplex
11.6.1 Microplex Company Detail
11.6.2 Microplex Business Overview
11.6.3 Microplex Through Glass Via (TGV) Wafer Introduction
11.6.4 Microplex Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.6.5 Microplex Recent Development
11.7 Plan Optik
11.7.1 Plan Optik Company Detail
11.7.2 Plan Optik Business Overview
11.7.3 Plan Optik Through Glass Via (TGV) Wafer Introduction
11.7.4 Plan Optik Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.7.5 Plan Optik Recent Development
11.8 NSG Group
11.8.1 NSG Group Company Detail
11.8.2 NSG Group Business Overview
11.8.3 NSG Group Through Glass Via (TGV) Wafer Introduction
11.8.4 NSG Group Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.8.5 NSG Group Recent Development
11.9 Allvia
11.9.1 Allvia Company Detail
11.9.2 Allvia Business Overview
11.9.3 Allvia Through Glass Via (TGV) Wafer Introduction
11.9.4 Allvia Revenue in Through Glass Via (TGV) Wafer Business (2018-2023)
11.9.5 Allvia Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

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