Global System in Package (SiP) Technology 麻豆原创 Research Report 2023

Publication ID:

PB502238863

Publication Date:

February 8, 2023

Pages:

112

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Highlights
The global System in Package (SiP) Technology market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for System in Package (SiP) Technology is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for System in Package (SiP) Technology is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for System in Package (SiP) Technology in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of System in Package (SiP) Technology include NXP, Amkor Technology, ASE, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries (SPIL), United Test and Assembly Center (UTAC), Hana Micron, Hella and IMEC, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for System in Package (SiP) Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System in Package (SiP) Technology.
The System in Package (SiP) Technology market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global System in Package (SiP) Technology market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the System in Package (SiP) Technology companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
NXP
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Hana Micron
Hella
IMEC
Inari Berhad
Infineon
ams
Apple
ARM
Fitbit
Fujitsu
GaN Systems
Huawei
Qualcomm
SONY
Segment by Type
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging
Segment by Application
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace & Defense
Others (Traction & Medical)
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of System in Package (SiP) Technology companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global System in Package (SiP) Technology 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 2-D IC Packaging
1.2.3 2.5-D IC Packaging
1.2.4 3-D IC Packaging
1.3 麻豆原创 by Application
1.3.1 Global System in Package (SiP) Technology 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Telecommunication
1.3.5 Industrial System
1.3.6 Aerospace & Defense
1.3.7 Others (Traction & Medical)
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global System in Package (SiP) Technology 麻豆原创 Perspective (2018-2029)
2.2 System in Package (SiP) Technology Growth Trends by Region
2.2.1 Global System in Package (SiP) Technology 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 System in Package (SiP) Technology Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 System in Package (SiP) Technology Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 System in Package (SiP) Technology 麻豆原创 Dynamics
2.3.1 System in Package (SiP) Technology Industry Trends
2.3.2 System in Package (SiP) Technology 麻豆原创 Drivers
2.3.3 System in Package (SiP) Technology 麻豆原创 Challenges
2.3.4 System in Package (SiP) Technology 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top System in Package (SiP) Technology Players by Revenue
3.1.1 Global Top System in Package (SiP) Technology Players by Revenue (2018-2023)
3.1.2 Global System in Package (SiP) Technology Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global System in Package (SiP) Technology 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by System in Package (SiP) Technology Revenue
3.4 Global System in Package (SiP) Technology 麻豆原创 Concentration Ratio
3.4.1 Global System in Package (SiP) Technology 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by System in Package (SiP) Technology Revenue in 2022
3.5 System in Package (SiP) Technology Key Players Head office and Area Served
3.6 Key Players System in Package (SiP) Technology Product Solution and Service
3.7 Date of Enter into System in Package (SiP) Technology 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 System in Package (SiP) Technology Breakdown Data by Type
4.1 Global System in Package (SiP) Technology Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global System in Package (SiP) Technology Forecasted 麻豆原创 Size by Type (2024-2029)
5 System in Package (SiP) Technology Breakdown Data by Application
5.1 Global System in Package (SiP) Technology Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global System in Package (SiP) Technology Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America System in Package (SiP) Technology 麻豆原创 Size (2018-2029)
6.2 North America System in Package (SiP) Technology 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America System in Package (SiP) Technology 麻豆原创 Size by Country (2018-2023)
6.4 North America System in Package (SiP) Technology 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe System in Package (SiP) Technology 麻豆原创 Size (2018-2029)
7.2 Europe System in Package (SiP) Technology 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe System in Package (SiP) Technology 麻豆原创 Size by Country (2018-2023)
7.4 Europe System in Package (SiP) Technology 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific System in Package (SiP) Technology 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific System in Package (SiP) Technology 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific System in Package (SiP) Technology 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific System in Package (SiP) Technology 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America System in Package (SiP) Technology 麻豆原创 Size (2018-2029)
9.2 Latin America System in Package (SiP) Technology 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America System in Package (SiP) Technology 麻豆原创 Size by Country (2018-2023)
9.4 Latin America System in Package (SiP) Technology 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa System in Package (SiP) Technology 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa System in Package (SiP) Technology 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa System in Package (SiP) Technology 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa System in Package (SiP) Technology 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP System in Package (SiP) Technology Introduction
11.1.4 NXP Revenue in System in Package (SiP) Technology Business (2018-2023)
11.1.5 NXP Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology System in Package (SiP) Technology Introduction
11.2.4 Amkor Technology Revenue in System in Package (SiP) Technology Business (2018-2023)
11.2.5 Amkor Technology Recent Development
11.3 ASE
11.3.1 ASE Company Detail
11.3.2 ASE Business Overview
11.3.3 ASE System in Package (SiP) Technology Introduction
11.3.4 ASE Revenue in System in Package (SiP) Technology Business (2018-2023)
11.3.5 ASE Recent Development
11.4 Jiangsu Changjiang Electronics Technology (JCET)
11.4.1 Jiangsu Changjiang Electronics Technology (JCET) Company Detail
11.4.2 Jiangsu Changjiang Electronics Technology (JCET) Business Overview
11.4.3 Jiangsu Changjiang Electronics Technology (JCET) System in Package (SiP) Technology Introduction
11.4.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in System in Package (SiP) Technology Business (2018-2023)
11.4.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Development
11.5 Siliconware Precision Industries (SPIL)
11.5.1 Siliconware Precision Industries (SPIL) Company Detail
11.5.2 Siliconware Precision Industries (SPIL) Business Overview
11.5.3 Siliconware Precision Industries (SPIL) System in Package (SiP) Technology Introduction
11.5.4 Siliconware Precision Industries (SPIL) Revenue in System in Package (SiP) Technology Business (2018-2023)
11.5.5 Siliconware Precision Industries (SPIL) Recent Development
11.6 United Test and Assembly Center (UTAC)
11.6.1 United Test and Assembly Center (UTAC) Company Detail
11.6.2 United Test and Assembly Center (UTAC) Business Overview
11.6.3 United Test and Assembly Center (UTAC) System in Package (SiP) Technology Introduction
11.6.4 United Test and Assembly Center (UTAC) Revenue in System in Package (SiP) Technology Business (2018-2023)
11.6.5 United Test and Assembly Center (UTAC) Recent Development
11.7 Hana Micron
11.7.1 Hana Micron Company Detail
11.7.2 Hana Micron Business Overview
11.7.3 Hana Micron System in Package (SiP) Technology Introduction
11.7.4 Hana Micron Revenue in System in Package (SiP) Technology Business (2018-2023)
11.7.5 Hana Micron Recent Development
11.8 Hella
11.8.1 Hella Company Detail
11.8.2 Hella Business Overview
11.8.3 Hella System in Package (SiP) Technology Introduction
11.8.4 Hella Revenue in System in Package (SiP) Technology Business (2018-2023)
11.8.5 Hella Recent Development
11.9 IMEC
11.9.1 IMEC Company Detail
11.9.2 IMEC Business Overview
11.9.3 IMEC System in Package (SiP) Technology Introduction
11.9.4 IMEC Revenue in System in Package (SiP) Technology Business (2018-2023)
11.9.5 IMEC Recent Development
11.10 Inari Berhad
11.10.1 Inari Berhad Company Detail
11.10.2 Inari Berhad Business Overview
11.10.3 Inari Berhad System in Package (SiP) Technology Introduction
11.10.4 Inari Berhad Revenue in System in Package (SiP) Technology Business (2018-2023)
11.10.5 Inari Berhad Recent Development
11.11 Infineon
11.11.1 Infineon Company Detail
11.11.2 Infineon Business Overview
11.11.3 Infineon System in Package (SiP) Technology Introduction
11.11.4 Infineon Revenue in System in Package (SiP) Technology Business (2018-2023)
11.11.5 Infineon Recent Development
11.12 ams
11.12.1 ams Company Detail
11.12.2 ams Business Overview
11.12.3 ams System in Package (SiP) Technology Introduction
11.12.4 ams Revenue in System in Package (SiP) Technology Business (2018-2023)
11.12.5 ams Recent Development
11.13 Apple
11.13.1 Apple Company Detail
11.13.2 Apple Business Overview
11.13.3 Apple System in Package (SiP) Technology Introduction
11.13.4 Apple Revenue in System in Package (SiP) Technology Business (2018-2023)
11.13.5 Apple Recent Development
11.14 ARM
11.14.1 ARM Company Detail
11.14.2 ARM Business Overview
11.14.3 ARM System in Package (SiP) Technology Introduction
11.14.4 ARM Revenue in System in Package (SiP) Technology Business (2018-2023)
11.14.5 ARM Recent Development
11.15 Fitbit
11.15.1 Fitbit Company Detail
11.15.2 Fitbit Business Overview
11.15.3 Fitbit System in Package (SiP) Technology Introduction
11.15.4 Fitbit Revenue in System in Package (SiP) Technology Business (2018-2023)
11.15.5 Fitbit Recent Development
11.16 Fujitsu
11.16.1 Fujitsu Company Detail
11.16.2 Fujitsu Business Overview
11.16.3 Fujitsu System in Package (SiP) Technology Introduction
11.16.4 Fujitsu Revenue in System in Package (SiP) Technology Business (2018-2023)
11.16.5 Fujitsu Recent Development
11.17 GaN Systems
11.17.1 GaN Systems Company Detail
11.17.2 GaN Systems Business Overview
11.17.3 GaN Systems System in Package (SiP) Technology Introduction
11.17.4 GaN Systems Revenue in System in Package (SiP) Technology Business (2018-2023)
11.17.5 GaN Systems Recent Development
11.18 Huawei
11.18.1 Huawei Company Detail
11.18.2 Huawei Business Overview
11.18.3 Huawei System in Package (SiP) Technology Introduction
11.18.4 Huawei Revenue in System in Package (SiP) Technology Business (2018-2023)
11.18.5 Huawei Recent Development
11.19 Qualcomm
11.19.1 Qualcomm Company Detail
11.19.2 Qualcomm Business Overview
11.19.3 Qualcomm System in Package (SiP) Technology Introduction
11.19.4 Qualcomm Revenue in System in Package (SiP) Technology Business (2018-2023)
11.19.5 Qualcomm Recent Development
11.20 SONY
11.20.1 SONY Company Detail
11.20.2 SONY Business Overview
11.20.3 SONY System in Package (SiP) Technology Introduction
11.20.4 SONY Revenue in System in Package (SiP) Technology Business (2018-2023)
11.20.5 SONY Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

NXP
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Hana Micron
Hella
IMEC
Inari Berhad
Infineon
ams
Apple
ARM
Fitbit
Fujitsu
GaN Systems
Huawei
Qualcomm
SONY

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