The global Substrate-like PCB (SLP) market was valued at US$ 2755 million in 2023 and is anticipated to reach US$ 3590 million by 2030, witnessing a CAGR of 3.9% during the forecast period 2024-2030.
Substrate-like PCB is abbreviated as SLP, which belongs to the category of PCB. Compared with HDI, the line width/line spacing of SLP can be shortened to 20/35 microns at the minimum. However, in terms of process, it cannot reach the specifications of IC substrate, and it is between HDI and IC substrate.
From the perspective of downstream applications, the current mainstream of SLP-like substrates is used in consumer electronics, such as smart phones. In terms of substrate-like manufacturing, since the mainstream line width/line spacing is 20-30 microns (Zhen Ding Technology's 25-micron SLP has been mass-produced), SLP is mainly manufactured using MSAP process technology. Compared with HDI, under the same conditions, the number of electronic components carried can reach twice that of HDI.
In terms of market competition, the leading companies of SLP-like substrates are mainly Zhen Ding Technology, Kinsus, Meiko, TTM Technologies, etc. The share of the world's top 5 companies exceeds 65%, and the core companies are mainly distributed in Taiwan, Japan, South Korea and the United States. With its high-density wiring, multi-layer stacking structure and excellent advanced packaging compatibility, SLP technology has successfully met the needs of increasingly miniaturized and high-performance electronic products. With the continuous advancement of technology, SLP technology is moving towards higher density and finer lines. However, compared with IC substrates, there is still a certain gap in the fineness of substrate-like substrates, which to a certain extent limits its price competitiveness in high-end applications such as mobile phones, thereby affecting the improvement of profit levels.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Substrate-like PCB (SLP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Substrate-like PCB (SLP).
The Substrate-like PCB (SLP) market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Substrate-like PCB (SLP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Substrate-like PCB (SLP) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Zhen Ding Technology
KINSUS
COMPEQ
Daeduck GDS
TTM Technologies
础罢锛哠
Ibiden
Korea Circuit
Samsung Electro-Mechanics
Meiko
Shenzhen Fastprint Circuit Tech
Unimicron
Shenzhen Kinwong Electronic
Leader-Tech Electronics
AKM Meadville
by Type
L/S 30渭m
L/S 25渭m
Others
by Application
Smart Phone
Other Consumer Electronics
Automotive Electronics
Others
Production by Region
North America
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Substrate-like PCB (SLP) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Substrate-like PCB (SLP) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Substrate-like PCB (SLP) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Substrate-like PCB (SLP) 麻豆原创 Overview
1.1 Product Definition
1.2 Substrate-like PCB (SLP) by Type
1.2.1 Global Substrate-like PCB (SLP) 麻豆原创 Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 L/S 30渭m
1.2.3 L/S 25渭m
1.2.4 Others
1.3 Substrate-like PCB (SLP) by Application
1.3.1 Global Substrate-like PCB (SLP) 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smart Phone
1.3.3 Other Consumer Electronics
1.3.4 Automotive Electronics
1.3.5 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Substrate-like PCB (SLP) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Substrate-like PCB (SLP) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Substrate-like PCB (SLP) Production Estimates and Forecasts (2019-2030)
1.4.4 Global Substrate-like PCB (SLP) 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Substrate-like PCB (SLP) Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global Substrate-like PCB (SLP) Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of Substrate-like PCB (SLP), Industry Ranking, 2022 VS 2023
2.4 Global Substrate-like PCB (SLP) 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Substrate-like PCB (SLP) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Substrate-like PCB (SLP), Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Substrate-like PCB (SLP), Product Type & Application
2.8 Global Key Manufacturers of Substrate-like PCB (SLP), Date of Enter into This Industry
2.9 Global Substrate-like PCB (SLP) 麻豆原创 Competitive Situation and Trends
2.9.1 Global Substrate-like PCB (SLP) 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Substrate-like PCB (SLP) Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Substrate-like PCB (SLP) Production by Region
3.1 Global Substrate-like PCB (SLP) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Substrate-like PCB (SLP) Production Value by Region (2019-2030)
3.2.1 Global Substrate-like PCB (SLP) Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Substrate-like PCB (SLP) by Region (2025-2030)
3.3 Global Substrate-like PCB (SLP) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Substrate-like PCB (SLP) Production by Region (2019-2030)
3.4.1 Global Substrate-like PCB (SLP) Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Substrate-like PCB (SLP) by Region (2025-2030)
3.5 Global Substrate-like PCB (SLP) 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global Substrate-like PCB (SLP) Production and Value, Year-over-Year Growth
3.6.1 North America Substrate-like PCB (SLP) Production Value Estimates and Forecasts (2019-2030)
3.6.2 China Substrate-like PCB (SLP) Production Value Estimates and Forecasts (2019-2030)
3.6.3 Japan Substrate-like PCB (SLP) Production Value Estimates and Forecasts (2019-2030)
3.6.4 South Korea Substrate-like PCB (SLP) Production Value Estimates and Forecasts (2019-2030)
4 Substrate-like PCB (SLP) Consumption by Region
4.1 Global Substrate-like PCB (SLP) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Substrate-like PCB (SLP) Consumption by Region (2019-2030)
4.2.1 Global Substrate-like PCB (SLP) Consumption by Region (2019-2030)
4.2.2 Global Substrate-like PCB (SLP) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Substrate-like PCB (SLP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Substrate-like PCB (SLP) Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Substrate-like PCB (SLP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Substrate-like PCB (SLP) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Substrate-like PCB (SLP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Substrate-like PCB (SLP) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Substrate-like PCB (SLP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Substrate-like PCB (SLP) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Substrate-like PCB (SLP) Production by Type (2019-2030)
5.1.1 Global Substrate-like PCB (SLP) Production by Type (2019-2024)
5.1.2 Global Substrate-like PCB (SLP) Production by Type (2025-2030)
5.1.3 Global Substrate-like PCB (SLP) Production 麻豆原创 Share by Type (2019-2030)
5.2 Global Substrate-like PCB (SLP) Production Value by Type (2019-2030)
5.2.1 Global Substrate-like PCB (SLP) Production Value by Type (2019-2024)
5.2.2 Global Substrate-like PCB (SLP) Production Value by Type (2025-2030)
5.2.3 Global Substrate-like PCB (SLP) Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global Substrate-like PCB (SLP) Price by Type (2019-2030)
6 Segment by Application
6.1 Global Substrate-like PCB (SLP) Production by Application (2019-2030)
6.1.1 Global Substrate-like PCB (SLP) Production by Application (2019-2024)
6.1.2 Global Substrate-like PCB (SLP) Production by Application (2025-2030)
6.1.3 Global Substrate-like PCB (SLP) Production 麻豆原创 Share by Application (2019-2030)
6.2 Global Substrate-like PCB (SLP) Production Value by Application (2019-2030)
6.2.1 Global Substrate-like PCB (SLP) Production Value by Application (2019-2024)
6.2.2 Global Substrate-like PCB (SLP) Production Value by Application (2025-2030)
6.2.3 Global Substrate-like PCB (SLP) Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global Substrate-like PCB (SLP) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Zhen Ding Technology
7.1.1 Zhen Ding Technology Substrate-like PCB (SLP) Company Information
7.1.2 Zhen Ding Technology Substrate-like PCB (SLP) Product Portfolio
7.1.3 Zhen Ding Technology Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Zhen Ding Technology Main Business and 麻豆原创s Served
7.1.5 Zhen Ding Technology Recent Developments/Updates
7.2 KINSUS
7.2.1 KINSUS Substrate-like PCB (SLP) Company Information
7.2.2 KINSUS Substrate-like PCB (SLP) Product Portfolio
7.2.3 KINSUS Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 KINSUS Main Business and 麻豆原创s Served
7.2.5 KINSUS Recent Developments/Updates
7.3 COMPEQ
7.3.1 COMPEQ Substrate-like PCB (SLP) Company Information
7.3.2 COMPEQ Substrate-like PCB (SLP) Product Portfolio
7.3.3 COMPEQ Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 COMPEQ Main Business and 麻豆原创s Served
7.3.5 COMPEQ Recent Developments/Updates
7.4 Daeduck GDS
7.4.1 Daeduck GDS Substrate-like PCB (SLP) Company Information
7.4.2 Daeduck GDS Substrate-like PCB (SLP) Product Portfolio
7.4.3 Daeduck GDS Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Daeduck GDS Main Business and 麻豆原创s Served
7.4.5 Daeduck GDS Recent Developments/Updates
7.5 TTM Technologies
7.5.1 TTM Technologies Substrate-like PCB (SLP) Company Information
7.5.2 TTM Technologies Substrate-like PCB (SLP) Product Portfolio
7.5.3 TTM Technologies Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 TTM Technologies Main Business and 麻豆原创s Served
7.5.5 TTM Technologies Recent Developments/Updates
7.6 础罢锛哠
7.6.1 础罢锛哠 Substrate-like PCB (SLP) Company Information
7.6.2 础罢锛哠 Substrate-like PCB (SLP) Product Portfolio
7.6.3 础罢锛哠 Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 础罢锛哠 Main Business and 麻豆原创s Served
7.6.5 础罢锛哠 Recent Developments/Updates
7.7 Ibiden
7.7.1 Ibiden Substrate-like PCB (SLP) Company Information
7.7.2 Ibiden Substrate-like PCB (SLP) Product Portfolio
7.7.3 Ibiden Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Ibiden Main Business and 麻豆原创s Served
7.7.5 Ibiden Recent Developments/Updates
7.8 Korea Circuit
7.8.1 Korea Circuit Substrate-like PCB (SLP) Company Information
7.8.2 Korea Circuit Substrate-like PCB (SLP) Product Portfolio
7.8.3 Korea Circuit Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Korea Circuit Main Business and 麻豆原创s Served
7.8.5 Korea Circuit Recent Developments/Updates
7.9 Samsung Electro-Mechanics
7.9.1 Samsung Electro-Mechanics Substrate-like PCB (SLP) Company Information
7.9.2 Samsung Electro-Mechanics Substrate-like PCB (SLP) Product Portfolio
7.9.3 Samsung Electro-Mechanics Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Samsung Electro-Mechanics Main Business and 麻豆原创s Served
7.9.5 Samsung Electro-Mechanics Recent Developments/Updates
7.10 Meiko
7.10.1 Meiko Substrate-like PCB (SLP) Company Information
7.10.2 Meiko Substrate-like PCB (SLP) Product Portfolio
7.10.3 Meiko Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Meiko Main Business and 麻豆原创s Served
7.10.5 Meiko Recent Developments/Updates
7.11 Shenzhen Fastprint Circuit Tech
7.11.1 Shenzhen Fastprint Circuit Tech Substrate-like PCB (SLP) Company Information
7.11.2 Shenzhen Fastprint Circuit Tech Substrate-like PCB (SLP) Product Portfolio
7.11.3 Shenzhen Fastprint Circuit Tech Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Shenzhen Fastprint Circuit Tech Main Business and 麻豆原创s Served
7.11.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.12 Unimicron
7.12.1 Unimicron Substrate-like PCB (SLP) Company Information
7.12.2 Unimicron Substrate-like PCB (SLP) Product Portfolio
7.12.3 Unimicron Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Unimicron Main Business and 麻豆原创s Served
7.12.5 Unimicron Recent Developments/Updates
7.13 Shenzhen Kinwong Electronic
7.13.1 Shenzhen Kinwong Electronic Substrate-like PCB (SLP) Company Information
7.13.2 Shenzhen Kinwong Electronic Substrate-like PCB (SLP) Product Portfolio
7.13.3 Shenzhen Kinwong Electronic Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Shenzhen Kinwong Electronic Main Business and 麻豆原创s Served
7.13.5 Shenzhen Kinwong Electronic Recent Developments/Updates
7.14 Leader-Tech Electronics
7.14.1 Leader-Tech Electronics Substrate-like PCB (SLP) Company Information
7.14.2 Leader-Tech Electronics Substrate-like PCB (SLP) Product Portfolio
7.14.3 Leader-Tech Electronics Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Leader-Tech Electronics Main Business and 麻豆原创s Served
7.14.5 Leader-Tech Electronics Recent Developments/Updates
7.15 AKM Meadville
7.15.1 AKM Meadville Substrate-like PCB (SLP) Company Information
7.15.2 AKM Meadville Substrate-like PCB (SLP) Product Portfolio
7.15.3 AKM Meadville Substrate-like PCB (SLP) Production, Value, Price and Gross Margin (2019-2024)
7.15.4 AKM Meadville Main Business and 麻豆原创s Served
7.15.5 AKM Meadville Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Substrate-like PCB (SLP) Industry Chain Analysis
8.2 Substrate-like PCB (SLP) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Substrate-like PCB (SLP) Production Mode & Process
8.4 Substrate-like PCB (SLP) Sales and 麻豆原创ing
8.4.1 Substrate-like PCB (SLP) Sales Channels
8.4.2 Substrate-like PCB (SLP) Distributors
8.5 Substrate-like PCB (SLP) Customers
9 Substrate-like PCB (SLP) 麻豆原创 Dynamics
9.1 Substrate-like PCB (SLP) Industry Trends
9.2 Substrate-like PCB (SLP) 麻豆原创 Drivers
9.3 Substrate-like PCB (SLP) 麻豆原创 Challenges
9.4 Substrate-like PCB (SLP) 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Zhen Ding Technology
KINSUS
COMPEQ
Daeduck GDS
TTM Technologies
础罢锛哠
Ibiden
Korea Circuit
Samsung Electro-Mechanics
Meiko
Shenzhen Fastprint Circuit Tech
Unimicron
Shenzhen Kinwong Electronic
Leader-Tech Electronics
AKM Meadville
听
听
*If Applicable.
