Global SiC Module Packaging Technology 麻豆原创 Research Report 2024

Publication ID:

PB510243198

Publication Date:

October 21, 2024

Pages:

141

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

SiC (Silicon carbide) devices have excellent properties that enable high blocking voltage, low loss, high frequency and high temperature operation. Power semiconductors made of long-life SiC significantly reduce energy consumption and can be used to develop smaller and lighter products.
The global SiC Module Packaging Technology market was valued at US$ 1633 million in 2023 and is anticipated to reach US$ 10240 million by 2030, witnessing a CAGR of 23.7% during the forecast period 2024-2030.
The key players of SiC MOSFET modules are STMicroelectronics, Infineon, Wolfspeed, Rohm, Onsemi, BYD Semiconductor, Microchip (Microsemi), Mitsubishi Electric (Vincotech) and Semikron Danfoss, etc. The top three players hold a share over 70 percent.
Report Scope
This report aims to provide a comprehensive presentation of the global market for SiC Module Packaging Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Module Packaging Technology.
The SiC Module Packaging Technology market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global SiC Module Packaging Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC Module Packaging Technology manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
STMicroelectronics
Infineon
Wolfspeed
Rohm
onsemi
BYD Semiconductor
Microchip (Microsemi)
Mitsubishi Electric (Vincotech)
Semikron Danfoss
Fuji Electric
Toshiba
CETC 55
BASiC Semiconductor
SemiQ
SanRex
Bosch
GE Aerospace
Zhuzhou CRRC Times Electric
StarPower
Guangdong AccoPower Semiconductor
Cissoid
United Nova Technology
Hebei Sinopack Electronic Technology
InventChip Technology
ANHI Semiconductor
HAIMOSIC (SHANGHAI)
Shenzhen AST Science Technology
Hangzhou Silan Microelectronics
Wuxi Leapers Semiconductor
WeEn Semiconductors
Denso
by Type
1200痴碳化硅模块
700痴/750痴和900痴碳化硅模块
1700痴/3300痴碳化硅模块
by Application
Main Inverter (Electric Traction)
Industrial Drives
UPS
Trains & Traction
PV & Energy
Others
Production by Region
North America
Europe
Asia-Pacific
Latin America
Middle East & Africa
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Module Packaging Technology manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Module Packaging Technology by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Module Packaging Technology in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 SiC Module Packaging Technology 麻豆原创 Overview
1.1 Product Definition
1.2 SiC Module Packaging Technology by Type
1.2.1 Global SiC Module Packaging Technology 麻豆原创 Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 1200痴碳化硅模块
1.2.3 700痴/750痴和900痴碳化硅模块
1.2.4 1700痴/3300痴碳化硅模块
1.3 SiC Module Packaging Technology by Application
1.3.1 Global SiC Module Packaging Technology 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Main Inverter (Electric Traction)
1.3.3 Industrial Drives
1.3.4 UPS
1.3.5 Trains & Traction
1.3.6 PV & Energy
1.3.7 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global SiC Module Packaging Technology Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global SiC Module Packaging Technology Production Estimates and Forecasts (2019-2030)
1.4.4 Global SiC Module Packaging Technology 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global SiC Module Packaging Technology Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global SiC Module Packaging Technology Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of SiC Module Packaging Technology, Industry Ranking, 2022 VS 2023
2.4 Global SiC Module Packaging Technology 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global SiC Module Packaging Technology Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of SiC Module Packaging Technology, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of SiC Module Packaging Technology, Product Type & Application
2.8 Global Key Manufacturers of SiC Module Packaging Technology, Date of Enter into This Industry
2.9 Global SiC Module Packaging Technology 麻豆原创 Competitive Situation and Trends
2.9.1 Global SiC Module Packaging Technology 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest SiC Module Packaging Technology Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 SiC Module Packaging Technology Production by Region
3.1 Global SiC Module Packaging Technology Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global SiC Module Packaging Technology Production Value by Region (2019-2030)
3.2.1 Global SiC Module Packaging Technology Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of SiC Module Packaging Technology by Region (2025-2030)
3.3 Global SiC Module Packaging Technology Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global SiC Module Packaging Technology Production by Region (2019-2030)
3.4.1 Global SiC Module Packaging Technology Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of SiC Module Packaging Technology by Region (2025-2030)
3.5 Global SiC Module Packaging Technology 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global SiC Module Packaging Technology Production and Value, Year-over-Year Growth
3.6.1 North America SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
3.6.3 Asia-Pacific SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
3.6.4 Latin America SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
3.6.5 Middle East & Africa SiC Module Packaging Technology Production Value Estimates and Forecasts (2019-2030)
4 SiC Module Packaging Technology Consumption by Region
4.1 Global SiC Module Packaging Technology Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global SiC Module Packaging Technology Consumption by Region (2019-2030)
4.2.1 Global SiC Module Packaging Technology Consumption by Region (2019-2030)
4.2.2 Global SiC Module Packaging Technology Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America SiC Module Packaging Technology Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America SiC Module Packaging Technology Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe SiC Module Packaging Technology Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe SiC Module Packaging Technology Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific SiC Module Packaging Technology Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific SiC Module Packaging Technology Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa SiC Module Packaging Technology Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa SiC Module Packaging Technology Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global SiC Module Packaging Technology Production by Type (2019-2030)
5.1.1 Global SiC Module Packaging Technology Production by Type (2019-2024)
5.1.2 Global SiC Module Packaging Technology Production by Type (2025-2030)
5.1.3 Global SiC Module Packaging Technology Production 麻豆原创 Share by Type (2019-2030)
5.2 Global SiC Module Packaging Technology Production Value by Type (2019-2030)
5.2.1 Global SiC Module Packaging Technology Production Value by Type (2019-2024)
5.2.2 Global SiC Module Packaging Technology Production Value by Type (2025-2030)
5.2.3 Global SiC Module Packaging Technology Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global SiC Module Packaging Technology Price by Type (2019-2030)
6 Segment by Application
6.1 Global SiC Module Packaging Technology Production by Application (2019-2030)
6.1.1 Global SiC Module Packaging Technology Production by Application (2019-2024)
6.1.2 Global SiC Module Packaging Technology Production by Application (2025-2030)
6.1.3 Global SiC Module Packaging Technology Production 麻豆原创 Share by Application (2019-2030)
6.2 Global SiC Module Packaging Technology Production Value by Application (2019-2030)
6.2.1 Global SiC Module Packaging Technology Production Value by Application (2019-2024)
6.2.2 Global SiC Module Packaging Technology Production Value by Application (2025-2030)
6.2.3 Global SiC Module Packaging Technology Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global SiC Module Packaging Technology Price by Application (2019-2030)
7 Key Companies Profiled
7.1 STMicroelectronics
7.1.1 STMicroelectronics SiC Module Packaging Technology Company Information
7.1.2 STMicroelectronics SiC Module Packaging Technology Product Portfolio
7.1.3 STMicroelectronics SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.1.4 STMicroelectronics Main Business and 麻豆原创s Served
7.1.5 STMicroelectronics Recent Developments/Updates
7.2 Infineon
7.2.1 Infineon SiC Module Packaging Technology Company Information
7.2.2 Infineon SiC Module Packaging Technology Product Portfolio
7.2.3 Infineon SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Infineon Main Business and 麻豆原创s Served
7.2.5 Infineon Recent Developments/Updates
7.3 Wolfspeed
7.3.1 Wolfspeed SiC Module Packaging Technology Company Information
7.3.2 Wolfspeed SiC Module Packaging Technology Product Portfolio
7.3.3 Wolfspeed SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Wolfspeed Main Business and 麻豆原创s Served
7.3.5 Wolfspeed Recent Developments/Updates
7.4 Rohm
7.4.1 Rohm SiC Module Packaging Technology Company Information
7.4.2 Rohm SiC Module Packaging Technology Product Portfolio
7.4.3 Rohm SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Rohm Main Business and 麻豆原创s Served
7.4.5 Rohm Recent Developments/Updates
7.5 onsemi
7.5.1 onsemi SiC Module Packaging Technology Company Information
7.5.2 onsemi SiC Module Packaging Technology Product Portfolio
7.5.3 onsemi SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.5.4 onsemi Main Business and 麻豆原创s Served
7.5.5 onsemi Recent Developments/Updates
7.6 BYD Semiconductor
7.6.1 BYD Semiconductor SiC Module Packaging Technology Company Information
7.6.2 BYD Semiconductor SiC Module Packaging Technology Product Portfolio
7.6.3 BYD Semiconductor SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.6.4 BYD Semiconductor Main Business and 麻豆原创s Served
7.6.5 BYD Semiconductor Recent Developments/Updates
7.7 Microchip (Microsemi)
7.7.1 Microchip (Microsemi) SiC Module Packaging Technology Company Information
7.7.2 Microchip (Microsemi) SiC Module Packaging Technology Product Portfolio
7.7.3 Microchip (Microsemi) SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Microchip (Microsemi) Main Business and 麻豆原创s Served
7.7.5 Microchip (Microsemi) Recent Developments/Updates
7.8 Mitsubishi Electric (Vincotech)
7.8.1 Mitsubishi Electric (Vincotech) SiC Module Packaging Technology Company Information
7.8.2 Mitsubishi Electric (Vincotech) SiC Module Packaging Technology Product Portfolio
7.8.3 Mitsubishi Electric (Vincotech) SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Mitsubishi Electric (Vincotech) Main Business and 麻豆原创s Served
7.8.5 Mitsubishi Electric (Vincotech) Recent Developments/Updates
7.9 Semikron Danfoss
7.9.1 Semikron Danfoss SiC Module Packaging Technology Company Information
7.9.2 Semikron Danfoss SiC Module Packaging Technology Product Portfolio
7.9.3 Semikron Danfoss SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Semikron Danfoss Main Business and 麻豆原创s Served
7.9.5 Semikron Danfoss Recent Developments/Updates
7.10 Fuji Electric
7.10.1 Fuji Electric SiC Module Packaging Technology Company Information
7.10.2 Fuji Electric SiC Module Packaging Technology Product Portfolio
7.10.3 Fuji Electric SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Fuji Electric Main Business and 麻豆原创s Served
7.10.5 Fuji Electric Recent Developments/Updates
7.11 Toshiba
7.11.1 Toshiba SiC Module Packaging Technology Company Information
7.11.2 Toshiba SiC Module Packaging Technology Product Portfolio
7.11.3 Toshiba SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Toshiba Main Business and 麻豆原创s Served
7.11.5 Toshiba Recent Developments/Updates
7.12 CETC 55
7.12.1 CETC 55 SiC Module Packaging Technology Company Information
7.12.2 CETC 55 SiC Module Packaging Technology Product Portfolio
7.12.3 CETC 55 SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.12.4 CETC 55 Main Business and 麻豆原创s Served
7.12.5 CETC 55 Recent Developments/Updates
7.13 BASiC Semiconductor
7.13.1 BASiC Semiconductor SiC Module Packaging Technology Company Information
7.13.2 BASiC Semiconductor SiC Module Packaging Technology Product Portfolio
7.13.3 BASiC Semiconductor SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.13.4 BASiC Semiconductor Main Business and 麻豆原创s Served
7.13.5 BASiC Semiconductor Recent Developments/Updates
7.14 SemiQ
7.14.1 SemiQ SiC Module Packaging Technology Company Information
7.14.2 SemiQ SiC Module Packaging Technology Product Portfolio
7.14.3 SemiQ SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.14.4 SemiQ Main Business and 麻豆原创s Served
7.14.5 SemiQ Recent Developments/Updates
7.15 SanRex
7.15.1 SanRex SiC Module Packaging Technology Company Information
7.15.2 SanRex SiC Module Packaging Technology Product Portfolio
7.15.3 SanRex SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.15.4 SanRex Main Business and 麻豆原创s Served
7.15.5 SanRex Recent Developments/Updates
7.16 Bosch
7.16.1 Bosch SiC Module Packaging Technology Company Information
7.16.2 Bosch SiC Module Packaging Technology Product Portfolio
7.16.3 Bosch SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Bosch Main Business and 麻豆原创s Served
7.16.5 Bosch Recent Developments/Updates
7.17 GE Aerospace
7.17.1 GE Aerospace SiC Module Packaging Technology Company Information
7.17.2 GE Aerospace SiC Module Packaging Technology Product Portfolio
7.17.3 GE Aerospace SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.17.4 GE Aerospace Main Business and 麻豆原创s Served
7.17.5 GE Aerospace Recent Developments/Updates
7.18 Zhuzhou CRRC Times Electric
7.18.1 Zhuzhou CRRC Times Electric SiC Module Packaging Technology Company Information
7.18.2 Zhuzhou CRRC Times Electric SiC Module Packaging Technology Product Portfolio
7.18.3 Zhuzhou CRRC Times Electric SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Zhuzhou CRRC Times Electric Main Business and 麻豆原创s Served
7.18.5 Zhuzhou CRRC Times Electric Recent Developments/Updates
7.19 StarPower
7.19.1 StarPower SiC Module Packaging Technology Company Information
7.19.2 StarPower SiC Module Packaging Technology Product Portfolio
7.19.3 StarPower SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.19.4 StarPower Main Business and 麻豆原创s Served
7.19.5 StarPower Recent Developments/Updates
7.20 Guangdong AccoPower Semiconductor
7.20.1 Guangdong AccoPower Semiconductor SiC Module Packaging Technology Company Information
7.20.2 Guangdong AccoPower Semiconductor SiC Module Packaging Technology Product Portfolio
7.20.3 Guangdong AccoPower Semiconductor SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Guangdong AccoPower Semiconductor Main Business and 麻豆原创s Served
7.20.5 Guangdong AccoPower Semiconductor Recent Developments/Updates
7.21 Cissoid
7.21.1 Cissoid SiC Module Packaging Technology Company Information
7.21.2 Cissoid SiC Module Packaging Technology Product Portfolio
7.21.3 Cissoid SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.21.4 Cissoid Main Business and 麻豆原创s Served
7.21.5 Cissoid Recent Developments/Updates
7.22 United Nova Technology
7.22.1 United Nova Technology SiC Module Packaging Technology Company Information
7.22.2 United Nova Technology SiC Module Packaging Technology Product Portfolio
7.22.3 United Nova Technology SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.22.4 United Nova Technology Main Business and 麻豆原创s Served
7.22.5 United Nova Technology Recent Developments/Updates
7.23 Hebei Sinopack Electronic Technology
7.23.1 Hebei Sinopack Electronic Technology SiC Module Packaging Technology Company Information
7.23.2 Hebei Sinopack Electronic Technology SiC Module Packaging Technology Product Portfolio
7.23.3 Hebei Sinopack Electronic Technology SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.23.4 Hebei Sinopack Electronic Technology Main Business and 麻豆原创s Served
7.23.5 Hebei Sinopack Electronic Technology Recent Developments/Updates
7.24 InventChip Technology
7.24.1 InventChip Technology SiC Module Packaging Technology Company Information
7.24.2 InventChip Technology SiC Module Packaging Technology Product Portfolio
7.24.3 InventChip Technology SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.24.4 InventChip Technology Main Business and 麻豆原创s Served
7.24.5 InventChip Technology Recent Developments/Updates
7.25 ANHI Semiconductor
7.25.1 ANHI Semiconductor SiC Module Packaging Technology Company Information
7.25.2 ANHI Semiconductor SiC Module Packaging Technology Product Portfolio
7.25.3 ANHI Semiconductor SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.25.4 ANHI Semiconductor Main Business and 麻豆原创s Served
7.25.5 ANHI Semiconductor Recent Developments/Updates
7.26 HAIMOSIC (SHANGHAI)
7.26.1 HAIMOSIC (SHANGHAI) SiC Module Packaging Technology Company Information
7.26.2 HAIMOSIC (SHANGHAI) SiC Module Packaging Technology Product Portfolio
7.26.3 HAIMOSIC (SHANGHAI) SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.26.4 HAIMOSIC (SHANGHAI) Main Business and 麻豆原创s Served
7.26.5 HAIMOSIC (SHANGHAI) Recent Developments/Updates
7.27 Shenzhen AST Science Technology
7.27.1 Shenzhen AST Science Technology SiC Module Packaging Technology Company Information
7.27.2 Shenzhen AST Science Technology SiC Module Packaging Technology Product Portfolio
7.27.3 Shenzhen AST Science Technology SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.27.4 Shenzhen AST Science Technology Main Business and 麻豆原创s Served
7.27.5 Shenzhen AST Science Technology Recent Developments/Updates
7.28 Hangzhou Silan Microelectronics
7.28.1 Hangzhou Silan Microelectronics SiC Module Packaging Technology Company Information
7.28.2 Hangzhou Silan Microelectronics SiC Module Packaging Technology Product Portfolio
7.28.3 Hangzhou Silan Microelectronics SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.28.4 Hangzhou Silan Microelectronics Main Business and 麻豆原创s Served
7.28.5 Hangzhou Silan Microelectronics Recent Developments/Updates
7.29 Wuxi Leapers Semiconductor
7.29.1 Wuxi Leapers Semiconductor SiC Module Packaging Technology Company Information
7.29.2 Wuxi Leapers Semiconductor SiC Module Packaging Technology Product Portfolio
7.29.3 Wuxi Leapers Semiconductor SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.29.4 Wuxi Leapers Semiconductor Main Business and 麻豆原创s Served
7.29.5 Wuxi Leapers Semiconductor Recent Developments/Updates
7.30 WeEn Semiconductors
7.30.1 WeEn Semiconductors SiC Module Packaging Technology Company Information
7.30.2 WeEn Semiconductors SiC Module Packaging Technology Product Portfolio
7.30.3 WeEn Semiconductors SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.30.4 WeEn Semiconductors Main Business and 麻豆原创s Served
7.30.5 WeEn Semiconductors Recent Developments/Updates
7.31 Denso
7.31.1 Denso SiC Module Packaging Technology Company Information
7.31.2 Denso SiC Module Packaging Technology Product Portfolio
7.31.3 Denso SiC Module Packaging Technology Production, Value, Price and Gross Margin (2019-2024)
7.31.4 Denso Main Business and 麻豆原创s Served
7.31.5 Denso Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 SiC Module Packaging Technology Industry Chain Analysis
8.2 SiC Module Packaging Technology Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 SiC Module Packaging Technology Production Mode & Process
8.4 SiC Module Packaging Technology Sales and 麻豆原创ing
8.4.1 SiC Module Packaging Technology Sales Channels
8.4.2 SiC Module Packaging Technology Distributors
8.5 SiC Module Packaging Technology Customers
9 SiC Module Packaging Technology 麻豆原创 Dynamics
9.1 SiC Module Packaging Technology Industry Trends
9.2 SiC Module Packaging Technology 麻豆原创 Drivers
9.3 SiC Module Packaging Technology 麻豆原创 Challenges
9.4 SiC Module Packaging Technology 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

STMicroelectronics
Infineon
Wolfspeed
Rohm
onsemi
BYD Semiconductor
Microchip (Microsemi)
Mitsubishi Electric (Vincotech)
Semikron Danfoss
Fuji Electric
Toshiba
CETC 55
BASiC Semiconductor
SemiQ
SanRex
Bosch
GE Aerospace
Zhuzhou CRRC Times Electric
StarPower
Guangdong AccoPower Semiconductor
Cissoid
United Nova Technology
Hebei Sinopack Electronic Technology
InventChip Technology
ANHI Semiconductor
HAIMOSIC (SHANGHAI)
Shenzhen AST Science Technology
Hangzhou Silan Microelectronics
Wuxi Leapers Semiconductor
WeEn Semiconductors
Denso

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.