Silicon carbide MOSFETs have the characteristics of low on-resistance and small switching losses, which can reduce device losses and improve system efficiency, and are more suitable for high-frequency circuits. It is widely used in the fields of new energy vehicle motor controller, vehicle power supply, solar inverter, charging pile, UPS, PFC power supply and other fields.
This report studies the Silicon carbide (SiC) wafer processing equipment.
The global SiC听Semiconductor Processing Equipment market was valued at US$ 4034 million in 2023 and is anticipated to reach US$ 15370 million by 2030, witnessing a CAGR of 21.6% during the forecast period 2024-2030.
North American market for SiC听Semiconductor Processing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for SiC听Semiconductor Processing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for SiC听Semiconductor Processing Equipment in Silicon Carbide Wafer is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of SiC听Semiconductor Processing Equipment include Applied Materials, Lam Research, Mattson Technology, Inc., SPTS Technologies, Oxford Instruments, Trymax Semiconductor, SCREEN Semiconductor, Tokyo Electron Ltd (TEL), ULVAC, Panasonic, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for SiC听Semiconductor Processing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC听Semiconductor Processing Equipment.
The SiC听Semiconductor Processing Equipment market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global SiC听Semiconductor Processing Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC听Semiconductor Processing Equipment companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Applied Materials
Lam Research
Mattson Technology, Inc.
SPTS Technologies
Oxford Instruments
Trymax Semiconductor
SCREEN Semiconductor
Tokyo Electron Ltd (TEL)
ULVAC
Panasonic
Axcelis
Ion Beam Services (IBS)
Kokusai Electric
Nissin Ion Equipment USA, Inc
Sumitomo Heavy Industries, Ltd.
PR Hoffman, Inc.
Revasum
Logitech
DISCO
TOKYO SEIMITSU (ACCRETECH)
Okamoto Machine Tool Works, Ltd.
KLA Corporation
Onto Innovation
Semilab
Camtek
Unity Semiconductor SAS
PVA TePla
Lasertec
Veeco
Aixtron
Thermco Systems Limited
ASM International NV
NuFlare Technology, Inc.
Naura
GMC Semitech Co.,Ltd
Kingstone Semiconductor
Hwatsing Technology
Angkun Vision (Beijing) Technology
Shanghai Bangxin Semi Technology
Jingsheng Electromechanical
CETC 48
Engis
Wolfspeed
SiCrystal
II-VI Advanced Materials
TankeBlue
Takatori
Meyer Burger
Komatsu NTC
Segment by Type
SiC Crystal Growth Furnace
SiC Cutting Equipment
SiC Epitaxy/HTCVD Equipment
SiC Grinding/CMP Equipment
SiC Deposition Equipment
SiC Thermal Processing Equipment
SiC Etch and Clean Equipment
SiC Ion Implant Equipment
SiC Patterning Equipment
SiC Metrology and Inspection Equipment
SiC Wafer Bonders
Others
Segment by Application
Silicon Carbide Wafer
Silicon Carbide Epitaxial Wafer
Silicon Carbide Devices
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of SiC听Semiconductor Processing Equipment company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global SiC听Semiconductor Processing Equipment 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 SiC Crystal Growth Furnace
1.2.3 SiC Cutting Equipment
1.2.4 SiC Epitaxy/HTCVD Equipment
1.2.5 SiC Grinding/CMP Equipment
1.2.6 SiC Deposition Equipment
1.2.7 SiC Thermal Processing Equipment
1.2.8 SiC Etch and Clean Equipment
1.2.9 SiC Ion Implant Equipment
1.2.10 SiC Patterning Equipment
1.3 麻豆原创 by Application
1.3.1 Global SiC听Semiconductor Processing Equipment 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Silicon Carbide Wafer
1.3.3 Silicon Carbide Epitaxial Wafer
1.3.4 Silicon Carbide Devices
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global SiC听Semiconductor Processing Equipment 麻豆原创 Perspective (2019-2030)
2.2 Global SiC听Semiconductor Processing Equipment Growth Trends by Region
2.2.1 Global SiC听Semiconductor Processing Equipment 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 SiC听Semiconductor Processing Equipment Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 SiC听Semiconductor Processing Equipment Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 SiC听Semiconductor Processing Equipment 麻豆原创 Dynamics
2.3.1 SiC听Semiconductor Processing Equipment Industry Trends
2.3.2 SiC听Semiconductor Processing Equipment 麻豆原创 Drivers
2.3.3 SiC听Semiconductor Processing Equipment 麻豆原创 Challenges
2.3.4 SiC听Semiconductor Processing Equipment 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top SiC听Semiconductor Processing Equipment Players by Revenue
3.1.1 Global Top SiC听Semiconductor Processing Equipment Players by Revenue (2019-2024)
3.1.2 Global SiC听Semiconductor Processing Equipment Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global SiC听Semiconductor Processing Equipment 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by SiC听Semiconductor Processing Equipment Revenue
3.4 Global SiC听Semiconductor Processing Equipment 麻豆原创 Concentration Ratio
3.4.1 Global SiC听Semiconductor Processing Equipment 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by SiC听Semiconductor Processing Equipment Revenue in 2023
3.5 Global Key Players of SiC听Semiconductor Processing Equipment Head office and Area Served
3.6 Global Key Players of SiC听Semiconductor Processing Equipment, Product and Application
3.7 Global Key Players of SiC听Semiconductor Processing Equipment, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 SiC听Semiconductor Processing Equipment Breakdown Data by Type
4.1 Global SiC听Semiconductor Processing Equipment Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global SiC听Semiconductor Processing Equipment Forecasted 麻豆原创 Size by Type (2025-2030)
5 SiC听Semiconductor Processing Equipment Breakdown Data by Application
5.1 Global SiC听Semiconductor Processing Equipment Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global SiC听Semiconductor Processing Equipment Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America SiC听Semiconductor Processing Equipment 麻豆原创 Size (2019-2030)
6.2 North America SiC听Semiconductor Processing Equipment 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2019-2024)
6.4 North America SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe SiC听Semiconductor Processing Equipment 麻豆原创 Size (2019-2030)
7.2 Europe SiC听Semiconductor Processing Equipment 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2019-2024)
7.4 Europe SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific SiC听Semiconductor Processing Equipment 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific SiC听Semiconductor Processing Equipment 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific SiC听Semiconductor Processing Equipment 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific SiC听Semiconductor Processing Equipment 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America SiC听Semiconductor Processing Equipment 麻豆原创 Size (2019-2030)
9.2 Latin America SiC听Semiconductor Processing Equipment 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2019-2024)
9.4 Latin America SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa SiC听Semiconductor Processing Equipment 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa SiC听Semiconductor Processing Equipment 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa SiC听Semiconductor Processing Equipment 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Applied Materials
11.1.1 Applied Materials Company Details
11.1.2 Applied Materials Business Overview
11.1.3 Applied Materials SiC听Semiconductor Processing Equipment Introduction
11.1.4 Applied Materials Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.1.5 Applied Materials Recent Development
11.2 Lam Research
11.2.1 Lam Research Company Details
11.2.2 Lam Research Business Overview
11.2.3 Lam Research SiC听Semiconductor Processing Equipment Introduction
11.2.4 Lam Research Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.2.5 Lam Research Recent Development
11.3 Mattson Technology, Inc.
11.3.1 Mattson Technology, Inc. Company Details
11.3.2 Mattson Technology, Inc. Business Overview
11.3.3 Mattson Technology, Inc. SiC听Semiconductor Processing Equipment Introduction
11.3.4 Mattson Technology, Inc. Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.3.5 Mattson Technology, Inc. Recent Development
11.4 SPTS Technologies
11.4.1 SPTS Technologies Company Details
11.4.2 SPTS Technologies Business Overview
11.4.3 SPTS Technologies SiC听Semiconductor Processing Equipment Introduction
11.4.4 SPTS Technologies Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.4.5 SPTS Technologies Recent Development
11.5 Oxford Instruments
11.5.1 Oxford Instruments Company Details
11.5.2 Oxford Instruments Business Overview
11.5.3 Oxford Instruments SiC听Semiconductor Processing Equipment Introduction
11.5.4 Oxford Instruments Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.5.5 Oxford Instruments Recent Development
11.6 Trymax Semiconductor
11.6.1 Trymax Semiconductor Company Details
11.6.2 Trymax Semiconductor Business Overview
11.6.3 Trymax Semiconductor SiC听Semiconductor Processing Equipment Introduction
11.6.4 Trymax Semiconductor Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.6.5 Trymax Semiconductor Recent Development
11.7 SCREEN Semiconductor
11.7.1 SCREEN Semiconductor Company Details
11.7.2 SCREEN Semiconductor Business Overview
11.7.3 SCREEN Semiconductor SiC听Semiconductor Processing Equipment Introduction
11.7.4 SCREEN Semiconductor Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.7.5 SCREEN Semiconductor Recent Development
11.8 Tokyo Electron Ltd (TEL)
11.8.1 Tokyo Electron Ltd (TEL) Company Details
11.8.2 Tokyo Electron Ltd (TEL) Business Overview
11.8.3 Tokyo Electron Ltd (TEL) SiC听Semiconductor Processing Equipment Introduction
11.8.4 Tokyo Electron Ltd (TEL) Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.8.5 Tokyo Electron Ltd (TEL) Recent Development
11.9 ULVAC
11.9.1 ULVAC Company Details
11.9.2 ULVAC Business Overview
11.9.3 ULVAC SiC听Semiconductor Processing Equipment Introduction
11.9.4 ULVAC Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.9.5 ULVAC Recent Development
11.10 Panasonic
11.10.1 Panasonic Company Details
11.10.2 Panasonic Business Overview
11.10.3 Panasonic SiC听Semiconductor Processing Equipment Introduction
11.10.4 Panasonic Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.10.5 Panasonic Recent Development
11.11 Axcelis
11.11.1 Axcelis Company Details
11.11.2 Axcelis Business Overview
11.11.3 Axcelis SiC听Semiconductor Processing Equipment Introduction
11.11.4 Axcelis Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.11.5 Axcelis Recent Development
11.12 Ion Beam Services (IBS)
11.12.1 Ion Beam Services (IBS) Company Details
11.12.2 Ion Beam Services (IBS) Business Overview
11.12.3 Ion Beam Services (IBS) SiC听Semiconductor Processing Equipment Introduction
11.12.4 Ion Beam Services (IBS) Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.12.5 Ion Beam Services (IBS) Recent Development
11.13 Kokusai Electric
11.13.1 Kokusai Electric Company Details
11.13.2 Kokusai Electric Business Overview
11.13.3 Kokusai Electric SiC听Semiconductor Processing Equipment Introduction
11.13.4 Kokusai Electric Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.13.5 Kokusai Electric Recent Development
11.14 Nissin Ion Equipment USA, Inc
11.14.1 Nissin Ion Equipment USA, Inc Company Details
11.14.2 Nissin Ion Equipment USA, Inc Business Overview
11.14.3 Nissin Ion Equipment USA, Inc SiC听Semiconductor Processing Equipment Introduction
11.14.4 Nissin Ion Equipment USA, Inc Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.14.5 Nissin Ion Equipment USA, Inc Recent Development
11.15 Sumitomo Heavy Industries, Ltd.
11.15.1 Sumitomo Heavy Industries, Ltd. Company Details
11.15.2 Sumitomo Heavy Industries, Ltd. Business Overview
11.15.3 Sumitomo Heavy Industries, Ltd. SiC听Semiconductor Processing Equipment Introduction
11.15.4 Sumitomo Heavy Industries, Ltd. Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.15.5 Sumitomo Heavy Industries, Ltd. Recent Development
11.16 PR Hoffman, Inc.
11.16.1 PR Hoffman, Inc. Company Details
11.16.2 PR Hoffman, Inc. Business Overview
11.16.3 PR Hoffman, Inc. SiC听Semiconductor Processing Equipment Introduction
11.16.4 PR Hoffman, Inc. Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.16.5 PR Hoffman, Inc. Recent Development
11.17 Revasum
11.17.1 Revasum Company Details
11.17.2 Revasum Business Overview
11.17.3 Revasum SiC听Semiconductor Processing Equipment Introduction
11.17.4 Revasum Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.17.5 Revasum Recent Development
11.18 Logitech
11.18.1 Logitech Company Details
11.18.2 Logitech Business Overview
11.18.3 Logitech SiC听Semiconductor Processing Equipment Introduction
11.18.4 Logitech Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.18.5 Logitech Recent Development
11.19 DISCO
11.19.1 DISCO Company Details
11.19.2 DISCO Business Overview
11.19.3 DISCO SiC听Semiconductor Processing Equipment Introduction
11.19.4 DISCO Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.19.5 DISCO Recent Development
11.20 TOKYO SEIMITSU (ACCRETECH)
11.20.1 TOKYO SEIMITSU (ACCRETECH) Company Details
11.20.2 TOKYO SEIMITSU (ACCRETECH) Business Overview
11.20.3 TOKYO SEIMITSU (ACCRETECH) SiC听Semiconductor Processing Equipment Introduction
11.20.4 TOKYO SEIMITSU (ACCRETECH) Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.20.5 TOKYO SEIMITSU (ACCRETECH) Recent Development
11.21 Okamoto Machine Tool Works, Ltd.
11.21.1 Okamoto Machine Tool Works, Ltd. Company Details
11.21.2 Okamoto Machine Tool Works, Ltd. Business Overview
11.21.3 Okamoto Machine Tool Works, Ltd. SiC听Semiconductor Processing Equipment Introduction
11.21.4 Okamoto Machine Tool Works, Ltd. Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.21.5 Okamoto Machine Tool Works, Ltd. Recent Development
11.22 KLA Corporation
11.22.1 KLA Corporation Company Details
11.22.2 KLA Corporation Business Overview
11.22.3 KLA Corporation SiC听Semiconductor Processing Equipment Introduction
11.22.4 KLA Corporation Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.22.5 KLA Corporation Recent Development
11.23 Onto Innovation
11.23.1 Onto Innovation Company Details
11.23.2 Onto Innovation Business Overview
11.23.3 Onto Innovation SiC听Semiconductor Processing Equipment Introduction
11.23.4 Onto Innovation Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.23.5 Onto Innovation Recent Development
11.24 Semilab
11.24.1 Semilab Company Details
11.24.2 Semilab Business Overview
11.24.3 Semilab SiC听Semiconductor Processing Equipment Introduction
11.24.4 Semilab Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.24.5 Semilab Recent Development
11.25 Camtek
11.25.1 Camtek Company Details
11.25.2 Camtek Business Overview
11.25.3 Camtek SiC听Semiconductor Processing Equipment Introduction
11.25.4 Camtek Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.25.5 Camtek Recent Development
11.26 Unity Semiconductor SAS
11.26.1 Unity Semiconductor SAS Company Details
11.26.2 Unity Semiconductor SAS Business Overview
11.26.3 Unity Semiconductor SAS SiC听Semiconductor Processing Equipment Introduction
11.26.4 Unity Semiconductor SAS Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.26.5 Unity Semiconductor SAS Recent Development
11.27 PVA TePla
11.27.1 PVA TePla Company Details
11.27.2 PVA TePla Business Overview
11.27.3 PVA TePla SiC听Semiconductor Processing Equipment Introduction
11.27.4 PVA TePla Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.27.5 PVA TePla Recent Development
11.28 Lasertec
11.28.1 Lasertec Company Details
11.28.2 Lasertec Business Overview
11.28.3 Lasertec SiC听Semiconductor Processing Equipment Introduction
11.28.4 Lasertec Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.28.5 Lasertec Recent Development
11.29 Veeco
11.29.1 Veeco Company Details
11.29.2 Veeco Business Overview
11.29.3 Veeco SiC听Semiconductor Processing Equipment Introduction
11.29.4 Veeco Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.29.5 Veeco Recent Development
11.30 Aixtron
11.30.1 Aixtron Company Details
11.30.2 Aixtron Business Overview
11.30.3 Aixtron SiC听Semiconductor Processing Equipment Introduction
11.30.4 Aixtron Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.30.5 Aixtron Recent Development
11.31 Thermco Systems Limited
11.31.1 Thermco Systems Limited Company Details
11.31.2 Thermco Systems Limited Business Overview
11.31.3 Thermco Systems Limited SiC听Semiconductor Processing Equipment Introduction
11.31.4 Thermco Systems Limited Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.31.5 Thermco Systems Limited Recent Development
11.32 ASM International NV
11.32.1 ASM International NV Company Details
11.32.2 ASM International NV Business Overview
11.32.3 ASM International NV SiC听Semiconductor Processing Equipment Introduction
11.32.4 ASM International NV Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.32.5 ASM International NV Recent Development
11.33 NuFlare Technology, Inc.
11.33.1 NuFlare Technology, Inc. Company Details
11.33.2 NuFlare Technology, Inc. Business Overview
11.33.3 NuFlare Technology, Inc. SiC听Semiconductor Processing Equipment Introduction
11.33.4 NuFlare Technology, Inc. Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.33.5 NuFlare Technology, Inc. Recent Development
11.34 Naura
11.34.1 Naura Company Details
11.34.2 Naura Business Overview
11.34.3 Naura SiC听Semiconductor Processing Equipment Introduction
11.34.4 Naura Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.34.5 Naura Recent Development
11.35 GMC Semitech Co.,Ltd
11.35.1 GMC Semitech Co.,Ltd Company Details
11.35.2 GMC Semitech Co.,Ltd Business Overview
11.35.3 GMC Semitech Co.,Ltd SiC听Semiconductor Processing Equipment Introduction
11.35.4 GMC Semitech Co.,Ltd Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.35.5 GMC Semitech Co.,Ltd Recent Development
11.36 Kingstone Semiconductor
11.36.1 Kingstone Semiconductor Company Details
11.36.2 Kingstone Semiconductor Business Overview
11.36.3 Kingstone Semiconductor SiC听Semiconductor Processing Equipment Introduction
11.36.4 Kingstone Semiconductor Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.36.5 Kingstone Semiconductor Recent Development
11.37 Hwatsing Technology
11.37.1 Hwatsing Technology Company Details
11.37.2 Hwatsing Technology Business Overview
11.37.3 Hwatsing Technology SiC听Semiconductor Processing Equipment Introduction
11.37.4 Hwatsing Technology Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.37.5 Hwatsing Technology Recent Development
11.38 Angkun Vision (Beijing) Technology
11.38.1 Angkun Vision (Beijing) Technology Company Details
11.38.2 Angkun Vision (Beijing) Technology Business Overview
11.38.3 Angkun Vision (Beijing) Technology SiC听Semiconductor Processing Equipment Introduction
11.38.4 Angkun Vision (Beijing) Technology Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.38.5 Angkun Vision (Beijing) Technology Recent Development
11.39 Shanghai Bangxin Semi Technology
11.39.1 Shanghai Bangxin Semi Technology Company Details
11.39.2 Shanghai Bangxin Semi Technology Business Overview
11.39.3 Shanghai Bangxin Semi Technology SiC听Semiconductor Processing Equipment Introduction
11.39.4 Shanghai Bangxin Semi Technology Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.39.5 Shanghai Bangxin Semi Technology Recent Development
11.40 Jingsheng Electromechanical
11.40.1 Jingsheng Electromechanical Company Details
11.40.2 Jingsheng Electromechanical Business Overview
11.40.3 Jingsheng Electromechanical SiC听Semiconductor Processing Equipment Introduction
11.40.4 Jingsheng Electromechanical Revenue in SiC听Semiconductor Processing Equipment Business (2019-2024)
11.40.5 Jingsheng Electromechanical Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 麻豆原创 Size Estimation
13.1.1.3 麻豆原创 Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
Applied Materials
Lam Research
Mattson Technology, Inc.
SPTS Technologies
Oxford Instruments
Trymax Semiconductor
SCREEN Semiconductor
Tokyo Electron Ltd (TEL)
ULVAC
Panasonic
Axcelis
Ion Beam Services (IBS)
Kokusai Electric
Nissin Ion Equipment USA, Inc
Sumitomo Heavy Industries, Ltd.
PR Hoffman, Inc.
Revasum
Logitech
DISCO
TOKYO SEIMITSU (ACCRETECH)
Okamoto Machine Tool Works, Ltd.
KLA Corporation
Onto Innovation
Semilab
Camtek
Unity Semiconductor SAS
PVA TePla
Lasertec
Veeco
Aixtron
Thermco Systems Limited
ASM International NV
NuFlare Technology, Inc.
Naura
GMC Semitech Co.,Ltd
Kingstone Semiconductor
Hwatsing Technology
Angkun Vision (Beijing) Technology
Shanghai Bangxin Semi Technology
Jingsheng Electromechanical
CETC 48
Engis
Wolfspeed
SiCrystal
II-VI Advanced Materials
TankeBlue
Takatori
Meyer Burger
Komatsu NTC
听
听
*If Applicable.
