For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.
The global Semiconductor Packaging and Assembly Equipment market was valued at US$ 6258.6 million in 2023 and is anticipated to reach US$ 8313.8 million by 2030, witnessing a CAGR of 4.2% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Assembly Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Assembly Equipment.
Report Scope
The Semiconductor Packaging and Assembly Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Packaging and Assembly Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging and Assembly Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
Ulvac Technologies
Segment by Type
Die- Level Packaging and Assembly Equipment
Wafer-Level Packaging and Assembly Equipment
Segment by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Packaging and Assembly Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Packaging and Assembly Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Packaging and Assembly Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Semiconductor Packaging and Assembly Equipment 麻豆原创 Overview
1.1 Product Definition
1.2 Semiconductor Packaging and Assembly Equipment Segment by Type
1.2.1 Global Semiconductor Packaging and Assembly Equipment 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Die- Level Packaging and Assembly Equipment
1.2.3 Wafer-Level Packaging and Assembly Equipment
1.3 Semiconductor Packaging and Assembly Equipment Segment by Application
1.3.1 Global Semiconductor Packaging and Assembly Equipment 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IDM (Integrated Device Manufacturers)
1.3.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Packaging and Assembly Equipment Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Packaging and Assembly Equipment Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Packaging and Assembly Equipment 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Semiconductor Packaging and Assembly Equipment Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Packaging and Assembly Equipment Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Packaging and Assembly Equipment, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Packaging and Assembly Equipment 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Date of Enter into This Industry
2.9 Semiconductor Packaging and Assembly Equipment 麻豆原创 Competitive Situation and Trends
2.9.1 Semiconductor Packaging and Assembly Equipment 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Packaging and Assembly Equipment Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Packaging and Assembly Equipment Production by Region
3.1 Global Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Packaging and Assembly Equipment by Region (2025-2030)
3.3 Global Semiconductor Packaging and Assembly Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Packaging and Assembly Equipment Production by Region (2019-2030)
3.4.1 Global Semiconductor Packaging and Assembly Equipment Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Packaging and Assembly Equipment by Region (2025-2030)
3.5 Global Semiconductor Packaging and Assembly Equipment 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Packaging and Assembly Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Packaging and Assembly Equipment Consumption by Region
4.1 Global Semiconductor Packaging and Assembly Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Packaging and Assembly Equipment Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Packaging and Assembly Equipment Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Packaging and Assembly Equipment Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Packaging and Assembly Equipment Production by Type (2019-2030)
5.1.1 Global Semiconductor Packaging and Assembly Equipment Production by Type (2019-2024)
5.1.2 Global Semiconductor Packaging and Assembly Equipment Production by Type (2025-2030)
5.1.3 Global Semiconductor Packaging and Assembly Equipment Production 麻豆原创 Share by Type (2019-2030)
5.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Packaging and Assembly Equipment Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Packaging and Assembly Equipment Production by Application (2019-2030)
6.1.1 Global Semiconductor Packaging and Assembly Equipment Production by Application (2019-2024)
6.1.2 Global Semiconductor Packaging and Assembly Equipment Production by Application (2025-2030)
6.1.3 Global Semiconductor Packaging and Assembly Equipment Production 麻豆原创 Share by Application (2019-2030)
6.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Packaging and Assembly Equipment Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global Semiconductor Packaging and Assembly Equipment Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Packaging and Assembly Equipment Corporation Information
7.1.2 Applied Materials Semiconductor Packaging and Assembly Equipment Product Portfolio
7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Applied Materials Main Business and 麻豆原创s Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Semiconductor Packaging and Assembly Equipment Corporation Information
7.2.2 ASMPT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.2.3 ASMPT Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.2.4 ASMPT Main Business and 麻豆原创s Served
7.2.5 ASMPT Recent Developments/Updates
7.3 DISCO Corporation
7.3.1 DISCO Corporation Semiconductor Packaging and Assembly Equipment Corporation Information
7.3.2 DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Portfolio
7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.3.4 DISCO Corporation Main Business and 麻豆原创s Served
7.3.5 DISCO Corporation Recent Developments/Updates
7.4 EV Group
7.4.1 EV Group Semiconductor Packaging and Assembly Equipment Corporation Information
7.4.2 EV Group Semiconductor Packaging and Assembly Equipment Product Portfolio
7.4.3 EV Group Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.4.4 EV Group Main Business and 麻豆原创s Served
7.4.5 EV Group Recent Developments/Updates
7.5 Kulicke and Soffa Industries
7.5.1 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Corporation Information
7.5.2 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Portfolio
7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Kulicke and Soffa Industries Main Business and 麻豆原创s Served
7.5.5 Kulicke and Soffa Industries Recent Developments/Updates
7.6 TEL
7.6.1 TEL Semiconductor Packaging and Assembly Equipment Corporation Information
7.6.2 TEL Semiconductor Packaging and Assembly Equipment Product Portfolio
7.6.3 TEL Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.6.4 TEL Main Business and 麻豆原创s Served
7.6.5 TEL Recent Developments/Updates
7.7 Tokyo Seimitsu
7.7.1 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Corporation Information
7.7.2 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Portfolio
7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Tokyo Seimitsu Main Business and 麻豆原创s Served
7.7.5 Tokyo Seimitsu Recent Developments/Updates
7.8 Rudolph Technologies
7.8.1 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
7.8.2 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Rudolph Technologies Main Business and 麻豆原创s Served
7.7.5 Rudolph Technologies Recent Developments/Updates
7.9 SEMES
7.9.1 SEMES Semiconductor Packaging and Assembly Equipment Corporation Information
7.9.2 SEMES Semiconductor Packaging and Assembly Equipment Product Portfolio
7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.9.4 SEMES Main Business and 麻豆原创s Served
7.9.5 SEMES Recent Developments/Updates
7.10 Suss Microtec
7.10.1 Suss Microtec Semiconductor Packaging and Assembly Equipment Corporation Information
7.10.2 Suss Microtec Semiconductor Packaging and Assembly Equipment Product Portfolio
7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Suss Microtec Main Business and 麻豆原创s Served
7.10.5 Suss Microtec Recent Developments/Updates
7.11 Veeco/CNT
7.11.1 Veeco/CNT Semiconductor Packaging and Assembly Equipment Corporation Information
7.11.2 Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.11.3 Veeco/CNT Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Veeco/CNT Main Business and 麻豆原创s Served
7.11.5 Veeco/CNT Recent Developments/Updates
7.12 Ulvac Technologies
7.12.1 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
7.12.2 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Ulvac Technologies Main Business and 麻豆原创s Served
7.12.5 Ulvac Technologies Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Packaging and Assembly Equipment Industry Chain Analysis
8.2 Semiconductor Packaging and Assembly Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Packaging and Assembly Equipment Production Mode & Process
8.4 Semiconductor Packaging and Assembly Equipment Sales and 麻豆原创ing
8.4.1 Semiconductor Packaging and Assembly Equipment Sales Channels
8.4.2 Semiconductor Packaging and Assembly Equipment Distributors
8.5 Semiconductor Packaging and Assembly Equipment Customers
9 Semiconductor Packaging and Assembly Equipment 麻豆原创 Dynamics
9.1 Semiconductor Packaging and Assembly Equipment Industry Trends
9.2 Semiconductor Packaging and Assembly Equipment 麻豆原创 Drivers
9.3 Semiconductor Packaging and Assembly Equipment 麻豆原创 Challenges
9.4 Semiconductor Packaging and Assembly Equipment 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
Ulvac Technologies
听
听
*If Applicable.
