
The global market for Semiconductor Packaging Adhesives was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging Adhesives, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging Adhesives.
The Semiconductor Packaging Adhesives market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Packaging Adhesives market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging Adhesives manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Panasonic
Henkel
DELO
Master Bond Inc
Nissan Chemical
Lord
Ajinomoto Fine-Techno
Momentive
Sumitomo Bakelite
Shin-Etsu Chemical
Wuxi DKEM
Taichem
Tecore Synchem
DuPont
by Type
Epoxy
Silicone
Other
by Application
Advanced IC Packages
Automotive and Industrial Equipment
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Packaging Adhesives manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Packaging Adhesives by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Packaging Adhesives in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Semiconductor Packaging Adhesives 麻豆原创 Overview
1.1 Product Definition
1.2 Semiconductor Packaging Adhesives by Type
1.2.1 Global Semiconductor Packaging Adhesives 麻豆原创 Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Epoxy
1.2.3 Silicone
1.2.4 Other
1.3 Semiconductor Packaging Adhesives by Application
1.3.1 Global Semiconductor Packaging Adhesives 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Advanced IC Packages
1.3.3 Automotive and Industrial Equipment
1.3.4 Other
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Semiconductor Packaging Adhesives Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Semiconductor Packaging Adhesives Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Semiconductor Packaging Adhesives Production Estimates and Forecasts (2020-2031)
1.4.4 Global Semiconductor Packaging Adhesives 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Semiconductor Packaging Adhesives Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global Semiconductor Packaging Adhesives Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of Semiconductor Packaging Adhesives, Industry Ranking, 2023 VS 2024
2.4 Global Semiconductor Packaging Adhesives 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Semiconductor Packaging Adhesives Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Semiconductor Packaging Adhesives, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Packaging Adhesives, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Packaging Adhesives, Date of Enter into This Industry
2.9 Semiconductor Packaging Adhesives 麻豆原创 Competitive Situation and Trends
2.9.1 Semiconductor Packaging Adhesives 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Packaging Adhesives Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Packaging Adhesives Production by Region
3.1 Global Semiconductor Packaging Adhesives Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Semiconductor Packaging Adhesives Production Value by Region (2020-2031)
3.2.1 Global Semiconductor Packaging Adhesives Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Semiconductor Packaging Adhesives by Region (2026-2031)
3.3 Global Semiconductor Packaging Adhesives Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Semiconductor Packaging Adhesives Production Volume by Region (2020-2031)
3.4.1 Global Semiconductor Packaging Adhesives Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Semiconductor Packaging Adhesives by Region (2026-2031)
3.5 Global Semiconductor Packaging Adhesives 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global Semiconductor Packaging Adhesives Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Packaging Adhesives Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Semiconductor Packaging Adhesives Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Semiconductor Packaging Adhesives Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Semiconductor Packaging Adhesives Production Value Estimates and Forecasts (2020-2031)
4 Semiconductor Packaging Adhesives Consumption by Region
4.1 Global Semiconductor Packaging Adhesives Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Semiconductor Packaging Adhesives Consumption by Region (2020-2031)
4.2.1 Global Semiconductor Packaging Adhesives Consumption by Region (2020-2025)
4.2.2 Global Semiconductor Packaging Adhesives Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Semiconductor Packaging Adhesives Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Semiconductor Packaging Adhesives Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Packaging Adhesives Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Semiconductor Packaging Adhesives Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Packaging Adhesives Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Semiconductor Packaging Adhesives Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Packaging Adhesives Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Semiconductor Packaging Adhesives Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Semiconductor Packaging Adhesives Production by Type (2020-2031)
5.1.1 Global Semiconductor Packaging Adhesives Production by Type (2020-2025)
5.1.2 Global Semiconductor Packaging Adhesives Production by Type (2026-2031)
5.1.3 Global Semiconductor Packaging Adhesives Production 麻豆原创 Share by Type (2020-2031)
5.2 Global Semiconductor Packaging Adhesives Production Value by Type (2020-2031)
5.2.1 Global Semiconductor Packaging Adhesives Production Value by Type (2020-2025)
5.2.2 Global Semiconductor Packaging Adhesives Production Value by Type (2026-2031)
5.2.3 Global Semiconductor Packaging Adhesives Production Value 麻豆原创 Share by Type (2020-2031)
5.3 Global Semiconductor Packaging Adhesives Price by Type (2020-2031)
6 Segment by Application
6.1 Global Semiconductor Packaging Adhesives Production by Application (2020-2031)
6.1.1 Global Semiconductor Packaging Adhesives Production by Application (2020-2025)
6.1.2 Global Semiconductor Packaging Adhesives Production by Application (2026-2031)
6.1.3 Global Semiconductor Packaging Adhesives Production 麻豆原创 Share by Application (2020-2031)
6.2 Global Semiconductor Packaging Adhesives Production Value by Application (2020-2031)
6.2.1 Global Semiconductor Packaging Adhesives Production Value by Application (2020-2025)
6.2.2 Global Semiconductor Packaging Adhesives Production Value by Application (2026-2031)
6.2.3 Global Semiconductor Packaging Adhesives Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global Semiconductor Packaging Adhesives Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Panasonic
7.1.1 Panasonic Semiconductor Packaging Adhesives Company Information
7.1.2 Panasonic Semiconductor Packaging Adhesives Product Portfolio
7.1.3 Panasonic Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Panasonic Main Business and 麻豆原创s Served
7.1.5 Panasonic Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Semiconductor Packaging Adhesives Company Information
7.2.2 Henkel Semiconductor Packaging Adhesives Product Portfolio
7.2.3 Henkel Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Henkel Main Business and 麻豆原创s Served
7.2.5 Henkel Recent Developments/Updates
7.3 DELO
7.3.1 DELO Semiconductor Packaging Adhesives Company Information
7.3.2 DELO Semiconductor Packaging Adhesives Product Portfolio
7.3.3 DELO Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.3.4 DELO Main Business and 麻豆原创s Served
7.3.5 DELO Recent Developments/Updates
7.4 Master Bond Inc
7.4.1 Master Bond Inc Semiconductor Packaging Adhesives Company Information
7.4.2 Master Bond Inc Semiconductor Packaging Adhesives Product Portfolio
7.4.3 Master Bond Inc Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Master Bond Inc Main Business and 麻豆原创s Served
7.4.5 Master Bond Inc Recent Developments/Updates
7.5 Nissan Chemical
7.5.1 Nissan Chemical Semiconductor Packaging Adhesives Company Information
7.5.2 Nissan Chemical Semiconductor Packaging Adhesives Product Portfolio
7.5.3 Nissan Chemical Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Nissan Chemical Main Business and 麻豆原创s Served
7.5.5 Nissan Chemical Recent Developments/Updates
7.6 Lord
7.6.1 Lord Semiconductor Packaging Adhesives Company Information
7.6.2 Lord Semiconductor Packaging Adhesives Product Portfolio
7.6.3 Lord Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Lord Main Business and 麻豆原创s Served
7.6.5 Lord Recent Developments/Updates
7.7 Ajinomoto Fine-Techno
7.7.1 Ajinomoto Fine-Techno Semiconductor Packaging Adhesives Company Information
7.7.2 Ajinomoto Fine-Techno Semiconductor Packaging Adhesives Product Portfolio
7.7.3 Ajinomoto Fine-Techno Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Ajinomoto Fine-Techno Main Business and 麻豆原创s Served
7.7.5 Ajinomoto Fine-Techno Recent Developments/Updates
7.8 Momentive
7.8.1 Momentive Semiconductor Packaging Adhesives Company Information
7.8.2 Momentive Semiconductor Packaging Adhesives Product Portfolio
7.8.3 Momentive Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Momentive Main Business and 麻豆原创s Served
7.8.5 Momentive Recent Developments/Updates
7.9 Sumitomo Bakelite
7.9.1 Sumitomo Bakelite Semiconductor Packaging Adhesives Company Information
7.9.2 Sumitomo Bakelite Semiconductor Packaging Adhesives Product Portfolio
7.9.3 Sumitomo Bakelite Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Sumitomo Bakelite Main Business and 麻豆原创s Served
7.9.5 Sumitomo Bakelite Recent Developments/Updates
7.10 Shin-Etsu Chemical
7.10.1 Shin-Etsu Chemical Semiconductor Packaging Adhesives Company Information
7.10.2 Shin-Etsu Chemical Semiconductor Packaging Adhesives Product Portfolio
7.10.3 Shin-Etsu Chemical Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Shin-Etsu Chemical Main Business and 麻豆原创s Served
7.10.5 Shin-Etsu Chemical Recent Developments/Updates
7.11 Wuxi DKEM
7.11.1 Wuxi DKEM Semiconductor Packaging Adhesives Company Information
7.11.2 Wuxi DKEM Semiconductor Packaging Adhesives Product Portfolio
7.11.3 Wuxi DKEM Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Wuxi DKEM Main Business and 麻豆原创s Served
7.11.5 Wuxi DKEM Recent Developments/Updates
7.12 Taichem
7.12.1 Taichem Semiconductor Packaging Adhesives Company Information
7.12.2 Taichem Semiconductor Packaging Adhesives Product Portfolio
7.12.3 Taichem Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Taichem Main Business and 麻豆原创s Served
7.12.5 Taichem Recent Developments/Updates
7.13 Tecore Synchem
7.13.1 Tecore Synchem Semiconductor Packaging Adhesives Company Information
7.13.2 Tecore Synchem Semiconductor Packaging Adhesives Product Portfolio
7.13.3 Tecore Synchem Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Tecore Synchem Main Business and 麻豆原创s Served
7.13.5 Tecore Synchem Recent Developments/Updates
7.14 DuPont
7.14.1 DuPont Semiconductor Packaging Adhesives Company Information
7.14.2 DuPont Semiconductor Packaging Adhesives Product Portfolio
7.14.3 DuPont Semiconductor Packaging Adhesives Production, Value, Price and Gross Margin (2020-2025)
7.14.4 DuPont Main Business and 麻豆原创s Served
7.14.5 DuPont Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Packaging Adhesives Industry Chain Analysis
8.2 Semiconductor Packaging Adhesives Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Packaging Adhesives Production Mode & Process Analysis
8.4 Semiconductor Packaging Adhesives Sales and 麻豆原创ing
8.4.1 Semiconductor Packaging Adhesives Sales Channels
8.4.2 Semiconductor Packaging Adhesives Distributors
8.5 Semiconductor Packaging Adhesives Customer Analysis
9 Semiconductor Packaging Adhesives 麻豆原创 Dynamics
9.1 Semiconductor Packaging Adhesives Industry Trends
9.2 Semiconductor Packaging Adhesives 麻豆原创 Drivers
9.3 Semiconductor Packaging Adhesives 麻豆原创 Challenges
9.4 Semiconductor Packaging Adhesives 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Panasonic
Henkel
DELO
Master Bond Inc
Nissan Chemical
Lord
Ajinomoto Fine-Techno
Momentive
Sumitomo Bakelite
Shin-Etsu Chemical
Wuxi DKEM
Taichem
Tecore Synchem
DuPont
听
听
*If Applicable.
