Semiconductor packaging is conducted to guarantee protection to the wafer or substrate. The packaging is built from materials such as plastic, metal, glass or ceramic and is composed of one or more semiconductor electronic components.
Semiconductor packaging materials are base players of discrete semiconductor devices and integrated circuits on which other layers are deposited to complete the circuit. Thinner core materials are ideally used to surro system applications.
The validation of lead substrates has increased in comparison to lead frames and bonding wires as the industry advances more towards leadless and cable-less packages.
The market will experience robust growth due to increased demand for smart mobile devices and electronic goods.
The global Semiconductor Package market was valued at US$ 28660 million in 2023 and is anticipated to reach US$ 42770 million by 2030, witnessing a CAGR of 5.8% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Package.
Report Scope
The Semiconductor Package market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Package market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Package companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
SPIL
ASE
Amkor
JCET
TFME
Siliconware Precision Industries
Powertech Technology Inc
TSMC
Nepes
Walton Advanced Engineering
Unisem
Huatian
Chipbond
UTAC
Chipmos
China Wafer Level CSP
Lingsen Precision
Tianshui Huatian Technology Co., Ltd
King Yuan Electronics CO., Ltd.
Formosa
Carsem
J-Devices
Stats Chippac
Advanced Micro Devices
Segment by Type
Flip Chip
Embedded Die
Fan-in Wafer Level Packaging (Fi Wlp)
Fan-out Wafer Level Packaging
Others
Segment by Application
Consumer Electronics
Automotive Industry
Aerospace and Defense
Medical Devices
Communications and Telecom
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Package companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Semiconductor Package 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Flip Chip
1.2.3 Embedded Die
1.2.4 Fan-in Wafer Level Packaging (Fi Wlp)
1.2.5 Fan-out Wafer Level Packaging
1.2.6 Others
1.3 麻豆原创 by Application
1.3.1 Global Semiconductor Package 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive Industry
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Communications and Telecom
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Package 麻豆原创 Perspective (2019-2030)
2.2 Semiconductor Package Growth Trends by Region
2.2.1 Global Semiconductor Package 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Package Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 Semiconductor Package Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 Semiconductor Package 麻豆原创 Dynamics
2.3.1 Semiconductor Package Industry Trends
2.3.2 Semiconductor Package 麻豆原创 Drivers
2.3.3 Semiconductor Package 麻豆原创 Challenges
2.3.4 Semiconductor Package 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Package Players by Revenue
3.1.1 Global Top Semiconductor Package Players by Revenue (2019-2024)
3.1.2 Global Semiconductor Package Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global Semiconductor Package 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Semiconductor Package Revenue
3.4 Global Semiconductor Package 麻豆原创 Concentration Ratio
3.4.1 Global Semiconductor Package 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Package Revenue in 2023
3.5 Semiconductor Package Key Players Head office and Area Served
3.6 Key Players Semiconductor Package Product Solution and Service
3.7 Date of Enter into Semiconductor Package 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Package Breakdown Data by Type
4.1 Global Semiconductor Package Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global Semiconductor Package Forecasted 麻豆原创 Size by Type (2025-2030)
5 Semiconductor Package Breakdown Data by Application
5.1 Global Semiconductor Package Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global Semiconductor Package Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Package 麻豆原创 Size (2019-2030)
6.2 North America Semiconductor Package 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor Package 麻豆原创 Size by Country (2019-2024)
6.4 North America Semiconductor Package 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor Package 麻豆原创 Size (2019-2030)
7.2 Europe Semiconductor Package 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor Package 麻豆原创 Size by Country (2019-2024)
7.4 Europe Semiconductor Package 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Package 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific Semiconductor Package 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor Package 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor Package 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor Package 麻豆原创 Size (2019-2030)
9.2 Latin America Semiconductor Package 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor Package 麻豆原创 Size by Country (2019-2024)
9.4 Latin America Semiconductor Package 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Package 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa Semiconductor Package 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor Package 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor Package 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 SPIL
11.1.1 SPIL Company Detail
11.1.2 SPIL Business Overview
11.1.3 SPIL Semiconductor Package Introduction
11.1.4 SPIL Revenue in Semiconductor Package Business (2019-2024)
11.1.5 SPIL Recent Development
11.2 ASE
11.2.1 ASE Company Detail
11.2.2 ASE Business Overview
11.2.3 ASE Semiconductor Package Introduction
11.2.4 ASE Revenue in Semiconductor Package Business (2019-2024)
11.2.5 ASE Recent Development
11.3 Amkor
11.3.1 Amkor Company Detail
11.3.2 Amkor Business Overview
11.3.3 Amkor Semiconductor Package Introduction
11.3.4 Amkor Revenue in Semiconductor Package Business (2019-2024)
11.3.5 Amkor Recent Development
11.4 JCET
11.4.1 JCET Company Detail
11.4.2 JCET Business Overview
11.4.3 JCET Semiconductor Package Introduction
11.4.4 JCET Revenue in Semiconductor Package Business (2019-2024)
11.4.5 JCET Recent Development
11.5 TFME
11.5.1 TFME Company Detail
11.5.2 TFME Business Overview
11.5.3 TFME Semiconductor Package Introduction
11.5.4 TFME Revenue in Semiconductor Package Business (2019-2024)
11.5.5 TFME Recent Development
11.6 Siliconware Precision Industries
11.6.1 Siliconware Precision Industries Company Detail
11.6.2 Siliconware Precision Industries Business Overview
11.6.3 Siliconware Precision Industries Semiconductor Package Introduction
11.6.4 Siliconware Precision Industries Revenue in Semiconductor Package Business (2019-2024)
11.6.5 Siliconware Precision Industries Recent Development
11.7 Powertech Technology Inc
11.7.1 Powertech Technology Inc Company Detail
11.7.2 Powertech Technology Inc Business Overview
11.7.3 Powertech Technology Inc Semiconductor Package Introduction
11.7.4 Powertech Technology Inc Revenue in Semiconductor Package Business (2019-2024)
11.7.5 Powertech Technology Inc Recent Development
11.8 TSMC
11.8.1 TSMC Company Detail
11.8.2 TSMC Business Overview
11.8.3 TSMC Semiconductor Package Introduction
11.8.4 TSMC Revenue in Semiconductor Package Business (2019-2024)
11.8.5 TSMC Recent Development
11.9 Nepes
11.9.1 Nepes Company Detail
11.9.2 Nepes Business Overview
11.9.3 Nepes Semiconductor Package Introduction
11.9.4 Nepes Revenue in Semiconductor Package Business (2019-2024)
11.9.5 Nepes Recent Development
11.10 Walton Advanced Engineering
11.10.1 Walton Advanced Engineering Company Detail
11.10.2 Walton Advanced Engineering Business Overview
11.10.3 Walton Advanced Engineering Semiconductor Package Introduction
11.10.4 Walton Advanced Engineering Revenue in Semiconductor Package Business (2019-2024)
11.10.5 Walton Advanced Engineering Recent Development
11.11 Unisem
11.11.1 Unisem Company Detail
11.11.2 Unisem Business Overview
11.11.3 Unisem Semiconductor Package Introduction
11.11.4 Unisem Revenue in Semiconductor Package Business (2019-2024)
11.11.5 Unisem Recent Development
11.12 Huatian
11.12.1 Huatian Company Detail
11.12.2 Huatian Business Overview
11.12.3 Huatian Semiconductor Package Introduction
11.12.4 Huatian Revenue in Semiconductor Package Business (2019-2024)
11.12.5 Huatian Recent Development
11.13 Chipbond
11.13.1 Chipbond Company Detail
11.13.2 Chipbond Business Overview
11.13.3 Chipbond Semiconductor Package Introduction
11.13.4 Chipbond Revenue in Semiconductor Package Business (2019-2024)
11.13.5 Chipbond Recent Development
11.14 UTAC
11.14.1 UTAC Company Detail
11.14.2 UTAC Business Overview
11.14.3 UTAC Semiconductor Package Introduction
11.14.4 UTAC Revenue in Semiconductor Package Business (2019-2024)
11.14.5 UTAC Recent Development
11.15 Chipmos
11.15.1 Chipmos Company Detail
11.15.2 Chipmos Business Overview
11.15.3 Chipmos Semiconductor Package Introduction
11.15.4 Chipmos Revenue in Semiconductor Package Business (2019-2024)
11.15.5 Chipmos Recent Development
11.16 China Wafer Level CSP
11.16.1 China Wafer Level CSP Company Detail
11.16.2 China Wafer Level CSP Business Overview
11.16.3 China Wafer Level CSP Semiconductor Package Introduction
11.16.4 China Wafer Level CSP Revenue in Semiconductor Package Business (2019-2024)
11.16.5 China Wafer Level CSP Recent Development
11.17 Lingsen Precision
11.17.1 Lingsen Precision Company Detail
11.17.2 Lingsen Precision Business Overview
11.17.3 Lingsen Precision Semiconductor Package Introduction
11.17.4 Lingsen Precision Revenue in Semiconductor Package Business (2019-2024)
11.17.5 Lingsen Precision Recent Development
11.18 Tianshui Huatian Technology Co., Ltd
11.18.1 Tianshui Huatian Technology Co., Ltd Company Detail
11.18.2 Tianshui Huatian Technology Co., Ltd Business Overview
11.18.3 Tianshui Huatian Technology Co., Ltd Semiconductor Package Introduction
11.18.4 Tianshui Huatian Technology Co., Ltd Revenue in Semiconductor Package Business (2019-2024)
11.18.5 Tianshui Huatian Technology Co., Ltd Recent Development
11.19 King Yuan Electronics CO., Ltd.
11.19.1 King Yuan Electronics CO., Ltd. Company Detail
11.19.2 King Yuan Electronics CO., Ltd. Business Overview
11.19.3 King Yuan Electronics CO., Ltd. Semiconductor Package Introduction
11.19.4 King Yuan Electronics CO., Ltd. Revenue in Semiconductor Package Business (2019-2024)
11.19.5 King Yuan Electronics CO., Ltd. Recent Development
11.20 Formosa
11.20.1 Formosa Company Detail
11.20.2 Formosa Business Overview
11.20.3 Formosa Semiconductor Package Introduction
11.20.4 Formosa Revenue in Semiconductor Package Business (2019-2024)
11.20.5 Formosa Recent Development
11.21 Carsem
11.21.1 Carsem Company Detail
11.21.2 Carsem Business Overview
11.21.3 Carsem Semiconductor Package Introduction
11.21.4 Carsem Revenue in Semiconductor Package Business (2019-2024)
11.21.5 Carsem Recent Development
11.22 J-Devices
11.22.1 J-Devices Company Detail
11.22.2 J-Devices Business Overview
11.22.3 J-Devices Semiconductor Package Introduction
11.22.4 J-Devices Revenue in Semiconductor Package Business (2019-2024)
11.22.5 J-Devices Recent Development
11.23 Stats Chippac
11.23.1 Stats Chippac Company Detail
11.23.2 Stats Chippac Business Overview
11.23.3 Stats Chippac Semiconductor Package Introduction
11.23.4 Stats Chippac Revenue in Semiconductor Package Business (2019-2024)
11.23.5 Stats Chippac Recent Development
11.24 Advanced Micro Devices
11.24.1 Advanced Micro Devices Company Detail
11.24.2 Advanced Micro Devices Business Overview
11.24.3 Advanced Micro Devices Semiconductor Package Introduction
11.24.4 Advanced Micro Devices Revenue in Semiconductor Package Business (2019-2024)
11.24.5 Advanced Micro Devices Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
SPIL
ASE
Amkor
JCET
TFME
Siliconware Precision Industries
Powertech Technology Inc
TSMC
Nepes
Walton Advanced Engineering
Unisem
Huatian
Chipbond
UTAC
Chipmos
China Wafer Level CSP
Lingsen Precision
Tianshui Huatian Technology Co., Ltd
King Yuan Electronics CO., Ltd.
Formosa
Carsem
J-Devices
Stats Chippac
Advanced Micro Devices
听
听
*If Applicable.
