Global Semiconductor Assembly Materials 麻豆原创 Research Report 2024

Publication ID:

PB506241459

Publication Date:

June 19, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Semiconductor Assembly Materials used in the assembly of semiconductor products including die attach adhesives, die encapsulants, lid seal adhesives, permanent bonding dielectrics and thermal interface materials.
The global Semiconductor Assembly Materials market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly Materials.
Report Scope
The Semiconductor Assembly Materials market size, estimations, and forecasts are provided in terms of output/shipments (Kg) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Dupont
Permabond
Henkel Adhesive Technologies
NAMICS Corporation
Master Bond
Dow Corning Corp
Epak Electronics
Laird Performance Materials
Boyd Corporation
SEMIKRON
Linseis
Segment by Type
Die Attach Adhesives
Die Encapsulants
Lid Seal Adhesives
Permanent Bonding Dielectrics
Thermal Interface Materials
Segment by Application
Automation
Electrically Insulating
Servers and Computers
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Assembly Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Assembly Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Assembly Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Semiconductor Assembly Materials 麻豆原创 Overview
1.1 Product Definition
1.2 Semiconductor Assembly Materials Segment by Type
1.2.1 Global Semiconductor Assembly Materials 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Die Attach Adhesives
1.2.3 Die Encapsulants
1.2.4 Lid Seal Adhesives
1.2.5 Permanent Bonding Dielectrics
1.2.6 Thermal Interface Materials
1.3 Semiconductor Assembly Materials Segment by Application
1.3.1 Global Semiconductor Assembly Materials 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automation
1.3.3 Electrically Insulating
1.3.4 Servers and Computers
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Assembly Materials Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Assembly Materials Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Assembly Materials 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Semiconductor Assembly Materials Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Assembly Materials Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Assembly Materials, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Assembly Materials 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Assembly Materials Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Assembly Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Assembly Materials, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Assembly Materials, Date of Enter into This Industry
2.9 Semiconductor Assembly Materials 麻豆原创 Competitive Situation and Trends
2.9.1 Semiconductor Assembly Materials 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Assembly Materials Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Assembly Materials Production by Region
3.1 Global Semiconductor Assembly Materials Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Assembly Materials Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Assembly Materials Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Assembly Materials by Region (2025-2030)
3.3 Global Semiconductor Assembly Materials Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Assembly Materials Production by Region (2019-2030)
3.4.1 Global Semiconductor Assembly Materials Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Assembly Materials by Region (2025-2030)
3.5 Global Semiconductor Assembly Materials 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Assembly Materials Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Semiconductor Assembly Materials Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Assembly Materials Consumption by Region
4.1 Global Semiconductor Assembly Materials Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Assembly Materials Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Assembly Materials Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Assembly Materials Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Assembly Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Assembly Materials Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Assembly Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Assembly Materials Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Assembly Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Assembly Materials Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Assembly Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Assembly Materials Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Assembly Materials Production by Type (2019-2030)
5.1.1 Global Semiconductor Assembly Materials Production by Type (2019-2024)
5.1.2 Global Semiconductor Assembly Materials Production by Type (2025-2030)
5.1.3 Global Semiconductor Assembly Materials Production 麻豆原创 Share by Type (2019-2030)
5.2 Global Semiconductor Assembly Materials Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Assembly Materials Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Assembly Materials Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Assembly Materials Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global Semiconductor Assembly Materials Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Assembly Materials Production by Application (2019-2030)
6.1.1 Global Semiconductor Assembly Materials Production by Application (2019-2024)
6.1.2 Global Semiconductor Assembly Materials Production by Application (2025-2030)
6.1.3 Global Semiconductor Assembly Materials Production 麻豆原创 Share by Application (2019-2030)
6.2 Global Semiconductor Assembly Materials Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Assembly Materials Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Assembly Materials Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Assembly Materials Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global Semiconductor Assembly Materials Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Dupont
7.1.1 Dupont Semiconductor Assembly Materials Corporation Information
7.1.2 Dupont Semiconductor Assembly Materials Product Portfolio
7.1.3 Dupont Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Dupont Main Business and 麻豆原创s Served
7.1.5 Dupont Recent Developments/Updates
7.2 Permabond
7.2.1 Permabond Semiconductor Assembly Materials Corporation Information
7.2.2 Permabond Semiconductor Assembly Materials Product Portfolio
7.2.3 Permabond Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Permabond Main Business and 麻豆原创s Served
7.2.5 Permabond Recent Developments/Updates
7.3 Henkel Adhesive Technologies
7.3.1 Henkel Adhesive Technologies Semiconductor Assembly Materials Corporation Information
7.3.2 Henkel Adhesive Technologies Semiconductor Assembly Materials Product Portfolio
7.3.3 Henkel Adhesive Technologies Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Henkel Adhesive Technologies Main Business and 麻豆原创s Served
7.3.5 Henkel Adhesive Technologies Recent Developments/Updates
7.4 NAMICS Corporation
7.4.1 NAMICS Corporation Semiconductor Assembly Materials Corporation Information
7.4.2 NAMICS Corporation Semiconductor Assembly Materials Product Portfolio
7.4.3 NAMICS Corporation Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.4.4 NAMICS Corporation Main Business and 麻豆原创s Served
7.4.5 NAMICS Corporation Recent Developments/Updates
7.5 Master Bond
7.5.1 Master Bond Semiconductor Assembly Materials Corporation Information
7.5.2 Master Bond Semiconductor Assembly Materials Product Portfolio
7.5.3 Master Bond Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Master Bond Main Business and 麻豆原创s Served
7.5.5 Master Bond Recent Developments/Updates
7.6 Dow Corning Corp
7.6.1 Dow Corning Corp Semiconductor Assembly Materials Corporation Information
7.6.2 Dow Corning Corp Semiconductor Assembly Materials Product Portfolio
7.6.3 Dow Corning Corp Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Dow Corning Corp Main Business and 麻豆原创s Served
7.6.5 Dow Corning Corp Recent Developments/Updates
7.7 Epak Electronics
7.7.1 Epak Electronics Semiconductor Assembly Materials Corporation Information
7.7.2 Epak Electronics Semiconductor Assembly Materials Product Portfolio
7.7.3 Epak Electronics Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Epak Electronics Main Business and 麻豆原创s Served
7.7.5 Epak Electronics Recent Developments/Updates
7.8 Laird Performance Materials
7.8.1 Laird Performance Materials Semiconductor Assembly Materials Corporation Information
7.8.2 Laird Performance Materials Semiconductor Assembly Materials Product Portfolio
7.8.3 Laird Performance Materials Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Laird Performance Materials Main Business and 麻豆原创s Served
7.7.5 Laird Performance Materials Recent Developments/Updates
7.9 Boyd Corporation
7.9.1 Boyd Corporation Semiconductor Assembly Materials Corporation Information
7.9.2 Boyd Corporation Semiconductor Assembly Materials Product Portfolio
7.9.3 Boyd Corporation Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Boyd Corporation Main Business and 麻豆原创s Served
7.9.5 Boyd Corporation Recent Developments/Updates
7.10 SEMIKRON
7.10.1 SEMIKRON Semiconductor Assembly Materials Corporation Information
7.10.2 SEMIKRON Semiconductor Assembly Materials Product Portfolio
7.10.3 SEMIKRON Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.10.4 SEMIKRON Main Business and 麻豆原创s Served
7.10.5 SEMIKRON Recent Developments/Updates
7.11 Linseis
7.11.1 Linseis Semiconductor Assembly Materials Corporation Information
7.11.2 Linseis Semiconductor Assembly Materials Product Portfolio
7.11.3 Linseis Semiconductor Assembly Materials Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Linseis Main Business and 麻豆原创s Served
7.11.5 Linseis Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Assembly Materials Industry Chain Analysis
8.2 Semiconductor Assembly Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Assembly Materials Production Mode & Process
8.4 Semiconductor Assembly Materials Sales and 麻豆原创ing
8.4.1 Semiconductor Assembly Materials Sales Channels
8.4.2 Semiconductor Assembly Materials Distributors
8.5 Semiconductor Assembly Materials Customers
9 Semiconductor Assembly Materials 麻豆原创 Dynamics
9.1 Semiconductor Assembly Materials Industry Trends
9.2 Semiconductor Assembly Materials 麻豆原创 Drivers
9.3 Semiconductor Assembly Materials 麻豆原创 Challenges
9.4 Semiconductor Assembly Materials 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Dupont
Permabond
Henkel Adhesive Technologies
NAMICS Corporation
Master Bond
Dow Corning Corp
Epak Electronics
Laird Performance Materials
Boyd Corporation
SEMIKRON
Linseis

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