Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
Âé¶¹Ô´´ Analysis and Insights: Global Printed Circuit Board Laminate Âé¶¹Ô´´
The global Printed Circuit Board Laminate market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Covers:
This report presents an overview of global market for Printed Circuit Board Laminate market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Printed Circuit Board Laminate, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Printed Circuit Board Laminate, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Printed Circuit Board Laminate revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Printed Circuit Board Laminate market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Printed Circuit Board Laminate revenue, projected growth trends, production technology, application and end-user industry.
Âé¶¹Ô´´ Segmentation
By Company
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
Segment by Type
FR-4
High Tg Epoxy
BT Epoxy
Polyimide
Copper Clad
Teflon
Other
Segment by Application
Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Printed Circuit Board Laminate in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Printed Circuit Board Laminate companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Printed Circuit Board Laminate revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Âé¶¹Ô´´ Analysis by Type
1.2.1 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 FR-4
1.2.3 High Tg Epoxy
1.2.4 BT Epoxy
1.2.5 Polyimide
1.2.6 Copper Clad
1.2.7 Teflon
1.2.8 Other
1.3 Âé¶¹Ô´´ by Application
1.3.1 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Automotive
1.3.3 Communications
1.3.4 Industrial Electronics
1.3.5 Consumer Electronics
1.3.6 Aerospace & Defense
1.3.7 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Perspective (2019-2030)
2.2 Global Printed Circuit Board Laminate Growth Trends by Region
2.2.1 Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Region: 2019 VS 2023 VS 2030
2.2.2 Printed Circuit Board Laminate Historic Âé¶¹Ô´´ Size by Region (2019-2024)
2.2.3 Printed Circuit Board Laminate Forecasted Âé¶¹Ô´´ Size by Region (2025-2030)
2.3 Printed Circuit Board Laminate Âé¶¹Ô´´ Dynamics
2.3.1 Printed Circuit Board Laminate Industry Trends
2.3.2 Printed Circuit Board Laminate Âé¶¹Ô´´ Drivers
2.3.3 Printed Circuit Board Laminate Âé¶¹Ô´´ Challenges
2.3.4 Printed Circuit Board Laminate Âé¶¹Ô´´ Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Printed Circuit Board Laminate by Players
3.1.1 Global Printed Circuit Board Laminate Revenue by Players (2019-2024)
3.1.2 Global Printed Circuit Board Laminate Revenue Âé¶¹Ô´´ Share by Players (2019-2024)
3.2 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Printed Circuit Board Laminate, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Concentration Ratio
3.4.1 Global Printed Circuit Board Laminate Âé¶¹Ô´´ Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Printed Circuit Board Laminate Revenue in 2023
3.5 Global Key Players of Printed Circuit Board Laminate Head office and Area Served
3.6 Global Key Players of Printed Circuit Board Laminate, Product and Application
3.7 Global Key Players of Printed Circuit Board Laminate, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Printed Circuit Board Laminate Breakdown Data by Type
4.1 Global Printed Circuit Board Laminate Historic Âé¶¹Ô´´ Size by Type (2019-2024)
4.2 Global Printed Circuit Board Laminate Forecasted Âé¶¹Ô´´ Size by Type (2025-2030)
5 Printed Circuit Board Laminate Breakdown Data by Application
5.1 Global Printed Circuit Board Laminate Historic Âé¶¹Ô´´ Size by Application (2019-2024)
5.2 Global Printed Circuit Board Laminate Forecasted Âé¶¹Ô´´ Size by Application (2025-2030)
6 North America
6.1 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size (2019-2030)
6.2 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type
6.2.1 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2019-2024)
6.2.2 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2025-2030)
6.2.3 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Type (2019-2030)
6.3 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application
6.3.1 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2019-2024)
6.3.2 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2025-2030)
6.3.3 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Application (2019-2030)
6.4 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country
6.4.1 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2019-2024)
6.4.3 North America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size (2019-2030)
7.2 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type
7.2.1 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2019-2024)
7.2.2 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2025-2030)
7.2.3 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Type (2019-2030)
7.3 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application
7.3.1 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2019-2024)
7.3.2 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2025-2030)
7.3.3 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Application (2019-2030)
7.4 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country
7.4.1 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2019-2024)
7.4.3 Europe Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size (2019-2030)
8.2 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type
8.2.1 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2019-2024)
8.2.2 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2025-2030)
8.2.3 China Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Type (2019-2030)
8.3 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application
8.3.1 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2019-2024)
8.3.2 China Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2025-2030)
8.3.3 China Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size (2019-2030)
9.2 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type
9.2.1 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2019-2024)
9.2.2 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2025-2030)
9.2.3 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Type (2019-2030)
9.3 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application
9.3.1 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2019-2024)
9.3.2 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2025-2030)
9.3.3 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Application (2019-2030)
9.4 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Region
9.4.1 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Region (2019-2024)
9.4.3 Asia Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size (2019-2030)
10.2 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type
10.2.1 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application
10.3.1 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country
10.4.1 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Printed Circuit Board Laminate Âé¶¹Ô´´ Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Unimicron Technology Corp.
11.1.1 Unimicron Technology Corp. Company Details
11.1.2 Unimicron Technology Corp. Business Overview
11.1.3 Unimicron Technology Corp. Printed Circuit Board Laminate Introduction
11.1.4 Unimicron Technology Corp. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.1.5 Unimicron Technology Corp. Recent Developments
11.2 Nippon Mektron
11.2.1 Nippon Mektron Company Details
11.2.2 Nippon Mektron Business Overview
11.2.3 Nippon Mektron Printed Circuit Board Laminate Introduction
11.2.4 Nippon Mektron Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.2.5 Nippon Mektron Recent Developments
11.3 Samsung Electro-Mechanics
11.3.1 Samsung Electro-Mechanics Company Details
11.3.2 Samsung Electro-Mechanics Business Overview
11.3.3 Samsung Electro-Mechanics Printed Circuit Board Laminate Introduction
11.3.4 Samsung Electro-Mechanics Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.3.5 Samsung Electro-Mechanics Recent Developments
11.4 Zhen Ding Technology Holding Limited
11.4.1 Zhen Ding Technology Holding Limited Company Details
11.4.2 Zhen Ding Technology Holding Limited Business Overview
11.4.3 Zhen Ding Technology Holding Limited Printed Circuit Board Laminate Introduction
11.4.4 Zhen Ding Technology Holding Limited Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.4.5 Zhen Ding Technology Holding Limited Recent Developments
11.5 Young Poong Electronics Co., Ltd.
11.5.1 Young Poong Electronics Co., Ltd. Company Details
11.5.2 Young Poong Electronics Co., Ltd. Business Overview
11.5.3 Young Poong Electronics Co., Ltd. Printed Circuit Board Laminate Introduction
11.5.4 Young Poong Electronics Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.5.5 Young Poong Electronics Co., Ltd. Recent Developments
11.6 Daeduck Electronics Co., Ltd.
11.6.1 Daeduck Electronics Co., Ltd. Company Details
11.6.2 Daeduck Electronics Co., Ltd. Business Overview
11.6.3 Daeduck Electronics Co., Ltd. Printed Circuit Board Laminate Introduction
11.6.4 Daeduck Electronics Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.6.5 Daeduck Electronics Co., Ltd. Recent Developments
11.7 Ibiden Co., Ltd.
11.7.1 Ibiden Co., Ltd. Company Details
11.7.2 Ibiden Co., Ltd. Business Overview
11.7.3 Ibiden Co., Ltd. Printed Circuit Board Laminate Introduction
11.7.4 Ibiden Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.7.5 Ibiden Co., Ltd. Recent Developments
11.8 Tripod Technology Corporation
11.8.1 Tripod Technology Corporation Company Details
11.8.2 Tripod Technology Corporation Business Overview
11.8.3 Tripod Technology Corporation Printed Circuit Board Laminate Introduction
11.8.4 Tripod Technology Corporation Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.8.5 Tripod Technology Corporation Recent Developments
11.9 TTM Technologies, Inc.
11.9.1 TTM Technologies, Inc. Company Details
11.9.2 TTM Technologies, Inc. Business Overview
11.9.3 TTM Technologies, Inc. Printed Circuit Board Laminate Introduction
11.9.4 TTM Technologies, Inc. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.9.5 TTM Technologies, Inc. Recent Developments
11.10 Austria Technologie & Systemtechnik AG
11.10.1 Austria Technologie & Systemtechnik AG Company Details
11.10.2 Austria Technologie & Systemtechnik AG Business Overview
11.10.3 Austria Technologie & Systemtechnik AG Printed Circuit Board Laminate Introduction
11.10.4 Austria Technologie & Systemtechnik AG Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.10.5 Austria Technologie & Systemtechnik AG Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
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*If Applicable.