Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Power Packaging for Automotive Semiconductors.
The global Power Packaging for Automotive Semiconductors market was valued at US$ 1233 million in 2023 and is anticipated to reach US$ 2120 million by 2030, witnessing a CAGR of 8.7% during the forecast period 2024-2030.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor(Hefei)Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
This report aims to provide a comprehensive presentation of the global market for Power Packaging for Automotive Semiconductors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Power Packaging for Automotive Semiconductors.
Report Scope
The Power Packaging for Automotive Semiconductors market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Power Packaging for Automotive Semiconductors market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Power Packaging for Automotive Semiconductors companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Âé¶¹Ô´´ Segmentation
By Company
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rohm
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor(Hefei)Co., Ltd.
Tongfu Microelectronics (TFME)
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Segment by Type
Diodes
IGBT
MOSFET
Power Management IC
Others
Segment by Application
Automotive OSAT
Automotive IDM
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Power Packaging for Automotive Semiconductors companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Âé¶¹Ô´´ Analysis by Type
1.2.1 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Diodes
1.2.3 IGBT
1.2.4 MOSFET
1.2.5 Power Management IC
1.2.6 Others
1.3 Âé¶¹Ô´´ by Application
1.3.1 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive OSAT
1.3.3 Automotive IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Perspective (2019-2030)
2.2 Power Packaging for Automotive Semiconductors Growth Trends by Region
2.2.1 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Region: 2019 VS 2023 VS 2030
2.2.2 Power Packaging for Automotive Semiconductors Historic Âé¶¹Ô´´ Size by Region (2019-2024)
2.2.3 Power Packaging for Automotive Semiconductors Forecasted Âé¶¹Ô´´ Size by Region (2025-2030)
2.3 Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Dynamics
2.3.1 Power Packaging for Automotive Semiconductors Industry Trends
2.3.2 Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Drivers
2.3.3 Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Challenges
2.3.4 Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Restraints
3 Competition Landscape by Key Players
3.1 Global Top Power Packaging for Automotive Semiconductors Players by Revenue
3.1.1 Global Top Power Packaging for Automotive Semiconductors Players by Revenue (2019-2024)
3.1.2 Global Power Packaging for Automotive Semiconductors Revenue Âé¶¹Ô´´ Share by Players (2019-2024)
3.2 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Power Packaging for Automotive Semiconductors Revenue
3.4 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Concentration Ratio
3.4.1 Global Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Power Packaging for Automotive Semiconductors Revenue in 2023
3.5 Power Packaging for Automotive Semiconductors Key Players Head office and Area Served
3.6 Key Players Power Packaging for Automotive Semiconductors Product Solution and Service
3.7 Date of Enter into Power Packaging for Automotive Semiconductors Âé¶¹Ô´´
3.8 Mergers & Acquisitions, Expansion Plans
4 Power Packaging for Automotive Semiconductors Breakdown Data by Type
4.1 Global Power Packaging for Automotive Semiconductors Historic Âé¶¹Ô´´ Size by Type (2019-2024)
4.2 Global Power Packaging for Automotive Semiconductors Forecasted Âé¶¹Ô´´ Size by Type (2025-2030)
5 Power Packaging for Automotive Semiconductors Breakdown Data by Application
5.1 Global Power Packaging for Automotive Semiconductors Historic Âé¶¹Ô´´ Size by Application (2019-2024)
5.2 Global Power Packaging for Automotive Semiconductors Forecasted Âé¶¹Ô´´ Size by Application (2025-2030)
6 North America
6.1 North America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size (2019-2030)
6.2 North America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2019-2024)
6.4 North America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size (2019-2030)
7.2 Europe Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2019-2024)
7.4 Europe Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size (2019-2030)
8.2 Asia-Pacific Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Region (2019-2024)
8.4 Asia-Pacific Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size (2019-2030)
9.2 Latin America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2019-2024)
9.4 Latin America Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size (2019-2030)
10.2 Middle East & Africa Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2019-2024)
10.4 Middle East & Africa Power Packaging for Automotive Semiconductors Âé¶¹Ô´´ Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP Power Packaging for Automotive Semiconductors Introduction
11.1.4 NXP Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.1.5 NXP Recent Development
11.2 Infineon (Cypress)
11.2.1 Infineon (Cypress) Company Detail
11.2.2 Infineon (Cypress) Business Overview
11.2.3 Infineon (Cypress) Power Packaging for Automotive Semiconductors Introduction
11.2.4 Infineon (Cypress) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.2.5 Infineon (Cypress) Recent Development
11.3 Renesas
11.3.1 Renesas Company Detail
11.3.2 Renesas Business Overview
11.3.3 Renesas Power Packaging for Automotive Semiconductors Introduction
11.3.4 Renesas Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.3.5 Renesas Recent Development
11.4 Texas Instrument
11.4.1 Texas Instrument Company Detail
11.4.2 Texas Instrument Business Overview
11.4.3 Texas Instrument Power Packaging for Automotive Semiconductors Introduction
11.4.4 Texas Instrument Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.4.5 Texas Instrument Recent Development
11.5 STMicroelectronics
11.5.1 STMicroelectronics Company Detail
11.5.2 STMicroelectronics Business Overview
11.5.3 STMicroelectronics Power Packaging for Automotive Semiconductors Introduction
11.5.4 STMicroelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.5.5 STMicroelectronics Recent Development
11.6 Bosch
11.6.1 Bosch Company Detail
11.6.2 Bosch Business Overview
11.6.3 Bosch Power Packaging for Automotive Semiconductors Introduction
11.6.4 Bosch Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.6.5 Bosch Recent Development
11.7 onsemi
11.7.1 onsemi Company Detail
11.7.2 onsemi Business Overview
11.7.3 onsemi Power Packaging for Automotive Semiconductors Introduction
11.7.4 onsemi Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.7.5 onsemi Recent Development
11.8 Mitsubishi Electric
11.8.1 Mitsubishi Electric Company Detail
11.8.2 Mitsubishi Electric Business Overview
11.8.3 Mitsubishi Electric Power Packaging for Automotive Semiconductors Introduction
11.8.4 Mitsubishi Electric Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.8.5 Mitsubishi Electric Recent Development
11.9 Rohm
11.9.1 Rohm Company Detail
11.9.2 Rohm Business Overview
11.9.3 Rohm Power Packaging for Automotive Semiconductors Introduction
11.9.4 Rohm Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.9.5 Rohm Recent Development
11.10 Microchip (Microsemi)
11.10.1 Microchip (Microsemi) Company Detail
11.10.2 Microchip (Microsemi) Business Overview
11.10.3 Microchip (Microsemi) Power Packaging for Automotive Semiconductors Introduction
11.10.4 Microchip (Microsemi) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.10.5 Microchip (Microsemi) Recent Development
11.11 Amkor
11.11.1 Amkor Company Detail
11.11.2 Amkor Business Overview
11.11.3 Amkor Power Packaging for Automotive Semiconductors Introduction
11.11.4 Amkor Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.11.5 Amkor Recent Development
11.12 ASE (SPIL)
11.12.1 ASE (SPIL) Company Detail
11.12.2 ASE (SPIL) Business Overview
11.12.3 ASE (SPIL) Power Packaging for Automotive Semiconductors Introduction
11.12.4 ASE (SPIL) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.12.5 ASE (SPIL) Recent Development
11.13 UTAC
11.13.1 UTAC Company Detail
11.13.2 UTAC Business Overview
11.13.3 UTAC Power Packaging for Automotive Semiconductors Introduction
11.13.4 UTAC Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.13.5 UTAC Recent Development
11.14 JCET (STATS ChipPAC)
11.14.1 JCET (STATS ChipPAC) Company Detail
11.14.2 JCET (STATS ChipPAC) Business Overview
11.14.3 JCET (STATS ChipPAC) Power Packaging for Automotive Semiconductors Introduction
11.14.4 JCET (STATS ChipPAC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.14.5 JCET (STATS ChipPAC) Recent Development
11.15 Carsem
11.15.1 Carsem Company Detail
11.15.2 Carsem Business Overview
11.15.3 Carsem Power Packaging for Automotive Semiconductors Introduction
11.15.4 Carsem Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.15.5 Carsem Recent Development
11.16 King Yuan Electronics Corp. (KYEC)
11.16.1 King Yuan Electronics Corp. (KYEC) Company Detail
11.16.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.16.3 King Yuan Electronics Corp. (KYEC) Power Packaging for Automotive Semiconductors Introduction
11.16.4 King Yuan Electronics Corp. (KYEC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.16.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.17 KINGPAK Technology Inc
11.17.1 KINGPAK Technology Inc Company Detail
11.17.2 KINGPAK Technology Inc Business Overview
11.17.3 KINGPAK Technology Inc Power Packaging for Automotive Semiconductors Introduction
11.17.4 KINGPAK Technology Inc Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.17.5 KINGPAK Technology Inc Recent Development
11.18 Powertech Technology Inc. (PTI)
11.18.1 Powertech Technology Inc. (PTI) Company Detail
11.18.2 Powertech Technology Inc. (PTI) Business Overview
11.18.3 Powertech Technology Inc. (PTI) Power Packaging for Automotive Semiconductors Introduction
11.18.4 Powertech Technology Inc. (PTI) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.18.5 Powertech Technology Inc. (PTI) Recent Development
11.19 SFA Semicon
11.19.1 SFA Semicon Company Detail
11.19.2 SFA Semicon Business Overview
11.19.3 SFA Semicon Power Packaging for Automotive Semiconductors Introduction
11.19.4 SFA Semicon Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.19.5 SFA Semicon Recent Development
11.20 Unisem Group
11.20.1 Unisem Group Company Detail
11.20.2 Unisem Group Business Overview
11.20.3 Unisem Group Power Packaging for Automotive Semiconductors Introduction
11.20.4 Unisem Group Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.20.5 Unisem Group Recent Development
11.21 Chipbond Technology Corporation
11.21.1 Chipbond Technology Corporation Company Detail
11.21.2 Chipbond Technology Corporation Business Overview
11.21.3 Chipbond Technology Corporation Power Packaging for Automotive Semiconductors Introduction
11.21.4 Chipbond Technology Corporation Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.21.5 Chipbond Technology Corporation Recent Development
11.22 ChipMOS TECHNOLOGIES
11.22.1 ChipMOS TECHNOLOGIES Company Detail
11.22.2 ChipMOS TECHNOLOGIES Business Overview
11.22.3 ChipMOS TECHNOLOGIES Power Packaging for Automotive Semiconductors Introduction
11.22.4 ChipMOS TECHNOLOGIES Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.22.5 ChipMOS TECHNOLOGIES Recent Development
11.23 OSE CORP.
11.23.1 OSE CORP. Company Detail
11.23.2 OSE CORP. Business Overview
11.23.3 OSE CORP. Power Packaging for Automotive Semiconductors Introduction
11.23.4 OSE CORP. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.23.5 OSE CORP. Recent Development
11.24 Sigurd Microelectronics
11.24.1 Sigurd Microelectronics Company Detail
11.24.2 Sigurd Microelectronics Business Overview
11.24.3 Sigurd Microelectronics Power Packaging for Automotive Semiconductors Introduction
11.24.4 Sigurd Microelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.24.5 Sigurd Microelectronics Recent Development
11.25 Natronix Semiconductor Technology
11.25.1 Natronix Semiconductor Technology Company Detail
11.25.2 Natronix Semiconductor Technology Business Overview
11.25.3 Natronix Semiconductor Technology Power Packaging for Automotive Semiconductors Introduction
11.25.4 Natronix Semiconductor Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.25.5 Natronix Semiconductor Technology Recent Development
11.26 Nepes
11.26.1 Nepes Company Detail
11.26.2 Nepes Business Overview
11.26.3 Nepes Power Packaging for Automotive Semiconductors Introduction
11.26.4 Nepes Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.26.5 Nepes Recent Development
11.27 KESM Industries Berhad
11.27.1 KESM Industries Berhad Company Detail
11.27.2 KESM Industries Berhad Business Overview
11.27.3 KESM Industries Berhad Power Packaging for Automotive Semiconductors Introduction
11.27.4 KESM Industries Berhad Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.27.5 KESM Industries Berhad Recent Development
11.28 Forehope Electronic (Ningbo) Co.,Ltd.
11.28.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
11.28.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.28.3 Forehope Electronic (Ningbo) Co.,Ltd. Power Packaging for Automotive Semiconductors Introduction
11.28.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.28.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.29 Union Semiconductor(Hefei)Co., Ltd.
11.29.1 Union Semiconductor(Hefei)Co., Ltd. Company Detail
11.29.2 Union Semiconductor(Hefei)Co., Ltd. Business Overview
11.29.3 Union Semiconductor(Hefei)Co., Ltd. Power Packaging for Automotive Semiconductors Introduction
11.29.4 Union Semiconductor(Hefei)Co., Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.29.5 Union Semiconductor(Hefei)Co., Ltd. Recent Development
11.30 Tongfu Microelectronics (TFME)
11.30.1 Tongfu Microelectronics (TFME) Company Detail
11.30.2 Tongfu Microelectronics (TFME) Business Overview
11.30.3 Tongfu Microelectronics (TFME) Power Packaging for Automotive Semiconductors Introduction
11.30.4 Tongfu Microelectronics (TFME) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.30.5 Tongfu Microelectronics (TFME) Recent Development
11.31 HT-tech
11.31.1 HT-tech Company Detail
11.31.2 HT-tech Business Overview
11.31.3 HT-tech Power Packaging for Automotive Semiconductors Introduction
11.31.4 HT-tech Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.31.5 HT-tech Recent Development
11.32 China Wafer Level CSP Co., Ltd
11.32.1 China Wafer Level CSP Co., Ltd Company Detail
11.32.2 China Wafer Level CSP Co., Ltd Business Overview
11.32.3 China Wafer Level CSP Co., Ltd Power Packaging for Automotive Semiconductors Introduction
11.32.4 China Wafer Level CSP Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.32.5 China Wafer Level CSP Co., Ltd Recent Development
11.33 Ningbo ChipEx Semiconductor Co., Ltd
11.33.1 Ningbo ChipEx Semiconductor Co., Ltd Company Detail
11.33.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.33.3 Ningbo ChipEx Semiconductor Co., Ltd Power Packaging for Automotive Semiconductors Introduction
11.33.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.33.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.34 Guangdong Leadyo IC Testing
11.34.1 Guangdong Leadyo IC Testing Company Detail
11.34.2 Guangdong Leadyo IC Testing Business Overview
11.34.3 Guangdong Leadyo IC Testing Power Packaging for Automotive Semiconductors Introduction
11.34.4 Guangdong Leadyo IC Testing Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.34.5 Guangdong Leadyo IC Testing Recent Development
11.35 Unimos Microelectronics (Shanghai)
11.35.1 Unimos Microelectronics (Shanghai) Company Detail
11.35.2 Unimos Microelectronics (Shanghai) Business Overview
11.35.3 Unimos Microelectronics (Shanghai) Power Packaging for Automotive Semiconductors Introduction
11.35.4 Unimos Microelectronics (Shanghai) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.35.5 Unimos Microelectronics (Shanghai) Recent Development
11.36 Sino Technology
11.36.1 Sino Technology Company Detail
11.36.2 Sino Technology Business Overview
11.36.3 Sino Technology Power Packaging for Automotive Semiconductors Introduction
11.36.4 Sino Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.36.5 Sino Technology Recent Development
11.37 Taiji Semiconductor (Suzhou)
11.37.1 Taiji Semiconductor (Suzhou) Company Detail
11.37.2 Taiji Semiconductor (Suzhou) Business Overview
11.37.3 Taiji Semiconductor (Suzhou) Power Packaging for Automotive Semiconductors Introduction
11.37.4 Taiji Semiconductor (Suzhou) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.37.5 Taiji Semiconductor (Suzhou) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rohm
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor(Hefei)Co., Ltd.
Tongfu Microelectronics (TFME)
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
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*If Applicable.