Power Integrated ICs combine high-voltage and/or high-current components monolithically with low-voltage/low-current control components. Broadly, three classes of technologies, based on the techniques for isolating the high- and low-voltage components, have been developed for Power Integrated ICs: junction-isolated, self-isolated and dielectrically isolated. Each of these technologies has found its way into applications that result in optimal performance per unit cost. Simultaneously with the development of technologies, several advancements have been made in high-voltage/power devices suitable for integration. These included the reduced surface field lateral double diffused MOS transistor (RESURF LDMOS), the isolated vertical DMOS (VDMOS), the lateral insulated gate bipolar transistor (LIGBT), the high-voltage RESURF bipolar transistors, the Schottky injection FET (SINFET), and the trench sidewall channel DMOS (TDMOS).
麻豆原创 Analysis and Insights: Global PICs (Power Integrated Circuits) 麻豆原创
The global PICs (Power Integrated Circuits) market is projected to grow from US$ 22730 million in 2024 to US$ 29260 million by 2030, at a Compound Annual Growth Rate (CAGR) of 4.3% during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Covers:
This report presents an overview of global market for PICs (Power Integrated Circuits) market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of PICs (Power Integrated Circuits), also provides the revenue of main regions and countries. Highlights of the upcoming market potential for PICs (Power Integrated Circuits), and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the PICs (Power Integrated Circuits) revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global PICs (Power Integrated Circuits) market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for PICs (Power Integrated Circuits) revenue, projected growth trends, production technology, application and end-user industry.
麻豆原创 Segmentation
By Company
Texas Instruments
Infineon
Qualcomm
ON Semi
NXP
Maxim Integrated
Dialog Semiconductor
STMicroelectronics
Toshiba
Analog Devices
Silergy
Power Integrations
ROHM
MediaTek
Microchip
Skyworks
Renesas
Cypress Semiconductor
On-Bright Electronics
Alpha and Omega Semiconductor
Segment by Type
Power Management IC (PMIC)
Driver IC
Segment by Application
Smart Phone
Automotive
High Performance Computing
Industrial
IoT
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of PICs (Power Integrated Circuits) in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of PICs (Power Integrated Circuits) companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, PICs (Power Integrated Circuits) revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global PICs (Power Integrated Circuits) 麻豆原创 Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Power Management IC (PMIC)
1.2.3 Driver IC
1.3 麻豆原创 by Application
1.3.1 Global PICs (Power Integrated Circuits) 麻豆原创 Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Smart Phone
1.3.3 Automotive
1.3.4 High Performance Computing
1.3.5 Industrial
1.3.6 IoT
1.3.7 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global PICs (Power Integrated Circuits) 麻豆原创 Perspective (2019-2030)
2.2 Global PICs (Power Integrated Circuits) Growth Trends by Region
2.2.1 PICs (Power Integrated Circuits) 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 PICs (Power Integrated Circuits) Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 PICs (Power Integrated Circuits) Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 PICs (Power Integrated Circuits) 麻豆原创 Dynamics
2.3.1 PICs (Power Integrated Circuits) Industry Trends
2.3.2 PICs (Power Integrated Circuits) 麻豆原创 Drivers
2.3.3 PICs (Power Integrated Circuits) 麻豆原创 Challenges
2.3.4 PICs (Power Integrated Circuits) 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue PICs (Power Integrated Circuits) by Players
3.1.1 Global PICs (Power Integrated Circuits) Revenue by Players (2019-2024)
3.1.2 Global PICs (Power Integrated Circuits) Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global PICs (Power Integrated Circuits) 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of PICs (Power Integrated Circuits), Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global PICs (Power Integrated Circuits) 麻豆原创 Concentration Ratio
3.4.1 Global PICs (Power Integrated Circuits) 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by PICs (Power Integrated Circuits) Revenue in 2023
3.5 Global Key Players of PICs (Power Integrated Circuits) Head office and Area Served
3.6 Global Key Players of PICs (Power Integrated Circuits), Product and Application
3.7 Global Key Players of PICs (Power Integrated Circuits), Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 PICs (Power Integrated Circuits) Breakdown Data by Type
4.1 Global PICs (Power Integrated Circuits) Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global PICs (Power Integrated Circuits) Forecasted 麻豆原创 Size by Type (2025-2030)
5 PICs (Power Integrated Circuits) Breakdown Data by Application
5.1 Global PICs (Power Integrated Circuits) Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global PICs (Power Integrated Circuits) Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America PICs (Power Integrated Circuits) 麻豆原创 Size (2019-2030)
6.2 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Type
6.2.1 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2019-2024)
6.2.2 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2025-2030)
6.2.3 North America PICs (Power Integrated Circuits) 麻豆原创 Share by Type (2019-2030)
6.3 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Application
6.3.1 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2019-2024)
6.3.2 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2025-2030)
6.3.3 North America PICs (Power Integrated Circuits) 麻豆原创 Share by Application (2019-2030)
6.4 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Country
6.4.1 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2019-2024)
6.4.3 North America PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2025-2030)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe PICs (Power Integrated Circuits) 麻豆原创 Size (2019-2030)
7.2 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Type
7.2.1 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2019-2024)
7.2.2 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2025-2030)
7.2.3 Europe PICs (Power Integrated Circuits) 麻豆原创 Share by Type (2019-2030)
7.3 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Application
7.3.1 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2019-2024)
7.3.2 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2025-2030)
7.3.3 Europe PICs (Power Integrated Circuits) 麻豆原创 Share by Application (2019-2030)
7.4 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Country
7.4.1 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2019-2024)
7.4.3 Europe PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China PICs (Power Integrated Circuits) 麻豆原创 Size (2019-2030)
8.2 China PICs (Power Integrated Circuits) 麻豆原创 Size by Type
8.2.1 China PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2019-2024)
8.2.2 China PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2025-2030)
8.2.3 China PICs (Power Integrated Circuits) 麻豆原创 Share by Type (2019-2030)
8.3 China PICs (Power Integrated Circuits) 麻豆原创 Size by Application
8.3.1 China PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2019-2024)
8.3.2 China PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2025-2030)
8.3.3 China PICs (Power Integrated Circuits) 麻豆原创 Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia PICs (Power Integrated Circuits) 麻豆原创 Size (2019-2030)
9.2 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Type
9.2.1 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2019-2024)
9.2.2 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2025-2030)
9.2.3 Asia PICs (Power Integrated Circuits) 麻豆原创 Share by Type (2019-2030)
9.3 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Application
9.3.1 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2019-2024)
9.3.2 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2025-2030)
9.3.3 Asia PICs (Power Integrated Circuits) 麻豆原创 Share by Application (2019-2030)
9.4 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Region
9.4.1 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Region (2019-2024)
9.4.3 Asia PICs (Power Integrated Circuits) 麻豆原创 Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size (2019-2030)
10.2 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Type
10.2.1 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Application
10.3.1 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Country
10.4.1 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America PICs (Power Integrated Circuits) 麻豆原创 Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Texas Instruments
11.1.1 Texas Instruments Company Details
11.1.2 Texas Instruments Business Overview
11.1.3 Texas Instruments PICs (Power Integrated Circuits) Introduction
11.1.4 Texas Instruments Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.1.5 Texas Instruments Recent Developments
11.2 Infineon
11.2.1 Infineon Company Details
11.2.2 Infineon Business Overview
11.2.3 Infineon PICs (Power Integrated Circuits) Introduction
11.2.4 Infineon Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.2.5 Infineon Recent Developments
11.3 Qualcomm
11.3.1 Qualcomm Company Details
11.3.2 Qualcomm Business Overview
11.3.3 Qualcomm PICs (Power Integrated Circuits) Introduction
11.3.4 Qualcomm Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.3.5 Qualcomm Recent Developments
11.4 ON Semi
11.4.1 ON Semi Company Details
11.4.2 ON Semi Business Overview
11.4.3 ON Semi PICs (Power Integrated Circuits) Introduction
11.4.4 ON Semi Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.4.5 ON Semi Recent Developments
11.5 NXP
11.5.1 NXP Company Details
11.5.2 NXP Business Overview
11.5.3 NXP PICs (Power Integrated Circuits) Introduction
11.5.4 NXP Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.5.5 NXP Recent Developments
11.6 Maxim Integrated
11.6.1 Maxim Integrated Company Details
11.6.2 Maxim Integrated Business Overview
11.6.3 Maxim Integrated PICs (Power Integrated Circuits) Introduction
11.6.4 Maxim Integrated Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.6.5 Maxim Integrated Recent Developments
11.7 Dialog Semiconductor
11.7.1 Dialog Semiconductor Company Details
11.7.2 Dialog Semiconductor Business Overview
11.7.3 Dialog Semiconductor PICs (Power Integrated Circuits) Introduction
11.7.4 Dialog Semiconductor Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.7.5 Dialog Semiconductor Recent Developments
11.8 STMicroelectronics
11.8.1 STMicroelectronics Company Details
11.8.2 STMicroelectronics Business Overview
11.8.3 STMicroelectronics PICs (Power Integrated Circuits) Introduction
11.8.4 STMicroelectronics Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.8.5 STMicroelectronics Recent Developments
11.9 Toshiba
11.9.1 Toshiba Company Details
11.9.2 Toshiba Business Overview
11.9.3 Toshiba PICs (Power Integrated Circuits) Introduction
11.9.4 Toshiba Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.9.5 Toshiba Recent Developments
11.10 Analog Devices
11.10.1 Analog Devices Company Details
11.10.2 Analog Devices Business Overview
11.10.3 Analog Devices PICs (Power Integrated Circuits) Introduction
11.10.4 Analog Devices Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.10.5 Analog Devices Recent Developments
11.11 Silergy
11.11.1 Silergy Company Details
11.11.2 Silergy Business Overview
11.11.3 Silergy PICs (Power Integrated Circuits) Introduction
11.11.4 Silergy Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.11.5 Silergy Recent Developments
11.12 Power Integrations
11.12.1 Power Integrations Company Details
11.12.2 Power Integrations Business Overview
11.12.3 Power Integrations PICs (Power Integrated Circuits) Introduction
11.12.4 Power Integrations Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.12.5 Power Integrations Recent Developments
11.13 ROHM
11.13.1 ROHM Company Details
11.13.2 ROHM Business Overview
11.13.3 ROHM PICs (Power Integrated Circuits) Introduction
11.13.4 ROHM Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.13.5 ROHM Recent Developments
11.14 MediaTek
11.14.1 MediaTek Company Details
11.14.2 MediaTek Business Overview
11.14.3 MediaTek PICs (Power Integrated Circuits) Introduction
11.14.4 MediaTek Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.14.5 MediaTek Recent Developments
11.15 Microchip
11.15.1 Microchip Company Details
11.15.2 Microchip Business Overview
11.15.3 Microchip PICs (Power Integrated Circuits) Introduction
11.15.4 Microchip Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.15.5 Microchip Recent Developments
11.16 Skyworks
11.16.1 Skyworks Company Details
11.16.2 Skyworks Business Overview
11.16.3 Skyworks PICs (Power Integrated Circuits) Introduction
11.16.4 Skyworks Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.16.5 Skyworks Recent Developments
11.17 Renesas
11.17.1 Renesas Company Details
11.17.2 Renesas Business Overview
11.17.3 Renesas PICs (Power Integrated Circuits) Introduction
11.17.4 Renesas Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.17.5 Renesas Recent Developments
11.18 Cypress Semiconductor
11.18.1 Cypress Semiconductor Company Details
11.18.2 Cypress Semiconductor Business Overview
11.18.3 Cypress Semiconductor PICs (Power Integrated Circuits) Introduction
11.18.4 Cypress Semiconductor Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.18.5 Cypress Semiconductor Recent Developments
11.19 On-Bright Electronics
11.19.1 On-Bright Electronics Company Details
11.19.2 On-Bright Electronics Business Overview
11.19.3 On-Bright Electronics PICs (Power Integrated Circuits) Introduction
11.19.4 On-Bright Electronics Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.19.5 On-Bright Electronics Recent Developments
11.20 Alpha and Omega Semiconductor
11.20.1 Alpha and Omega Semiconductor Company Details
11.20.2 Alpha and Omega Semiconductor Business Overview
11.20.3 Alpha and Omega Semiconductor PICs (Power Integrated Circuits) Introduction
11.20.4 Alpha and Omega Semiconductor Revenue in PICs (Power Integrated Circuits) Business (2019-2024)
11.20.5 Alpha and Omega Semiconductor Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Texas Instruments
Infineon
Qualcomm
ON Semi
NXP
Maxim Integrated
Dialog Semiconductor
STMicroelectronics
Toshiba
Analog Devices
Silergy
Power Integrations
ROHM
MediaTek
Microchip
Skyworks
Renesas
Cypress Semiconductor
On-Bright Electronics
Alpha and Omega Semiconductor
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*If Applicable.
