The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and connecting the upper chip and the lower circuit board. The packaging substrate can protect, fix, and support the chip, enhance the heat conduction and heat dissipation performance of the chip, and also connect the chip and the printed circuit board to realize electrical and physical connections, power distribution, signal distribution, and communication between the internal and external circuits of the chip. Packaging substrates can usually be divided into three types of substrates: organic, inorganic and composite.The organic substrate has a low dielectric constant and is easy to process, which is suitable for high-frequency signal transmission with low thermal conductivity requirements; the non-polar substrate is supported by inorganic ceramics, which has good heat resistance, easy wiring and dimensional stability, but there are certain limitations in cost and material toxicity ; Composite substrates are based on the characteristics of different requirements to compound different organic and inorganic materials. In the future, organic and composite substrates are expected to be mainstream substrate materials...
The global Packaging Substrates market was valued at US$ 14600 million in 2023 and is anticipated to reach US$ 19740 million by 2030, witnessing a CAGR of 4.4% during the forecast period 2024-2030.
The market drivers for packaging substrates include the increasing demand for consumer electronics, automotive electronics, healthcare devices, and high-performance computing applications that require smaller, faster, and more reliable chips and packages. Additionally, the growing popularity of advanced packaging technologies, such as system-in-package (SiP) and fan-out wafer-level packaging (FOWLP), that enable heterogeneous integration and higher functionality is also boosting the demand for packaging substrates.
The constraints of packaging substrates include the environmental impact of substrate production and disposal, the limited availability and rising cost of raw materials, such as copper and resin, the technical challenges of meeting the increasing performance and reliability requirements of semiconductor devices, and the competition from alternative interconnect solutions, such as through-silicon vias (TSVs) and silicon interposers.
The future opportunities for packaging substrates include the development of new materials and designs that can improve the recyclability, sustainability, and circularity of packaging substrates, the innovation of substrate technologies that can support higher density, lower loss, and finer pitch interconnections6, the adoption of digitalization and Internet of Things (IoT) to enhance supply chain transparency and operational efficiency, and the exploration of new markets and applications that can benefit from packaging substrates, such as 5G, artificial intelligence (AI), and self-driving vehicles.
This report aims to provide a comprehensive presentation of the global market for Packaging Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Packaging Substrates.
Report Scope
The Packaging Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Packaging Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Packaging Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
IBIDEN CO.,LTD.
KOBE STEEL,LTD
Kyocera Group
Samsung Group
SIMMTECH Co.,Ltd
Daeduck Group
Unimicron
Nan Ya PCB Co.,Ltd.
KINSUS
AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.)
Shenzhen Xingsen Express Circuit Technology Co.,Ltd.
Segment by Type
Organic Substrate Materials
Electrodeless Substrate Materials
Composite Substrate Materials
Segment by Application
Aerospace
Semiconductors and Electronics
Automobiles and Parts
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Packaging Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Packaging Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Packaging Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Packaging Substrates 麻豆原创 Overview
1.1 Product Definition
1.2 Packaging Substrates Segment by Type
1.2.1 Global Packaging Substrates 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Organic Substrate Materials
1.2.3 Electrodeless Substrate Materials
1.2.4 Composite Substrate Materials
1.3 Packaging Substrates Segment by Application
1.3.1 Global Packaging Substrates 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Aerospace
1.3.3 Semiconductors and Electronics
1.3.4 Automobiles and Parts
1.3.5 Other
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Packaging Substrates Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Packaging Substrates Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Packaging Substrates Production Estimates and Forecasts (2019-2030)
1.4.4 Global Packaging Substrates 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Packaging Substrates Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global Packaging Substrates Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of Packaging Substrates, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Packaging Substrates 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Packaging Substrates Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Packaging Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Packaging Substrates, Product Offered and Application
2.8 Global Key Manufacturers of Packaging Substrates, Date of Enter into This Industry
2.9 Packaging Substrates 麻豆原创 Competitive Situation and Trends
2.9.1 Packaging Substrates 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Packaging Substrates Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Packaging Substrates Production by Region
3.1 Global Packaging Substrates Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Packaging Substrates Production Value by Region (2019-2030)
3.2.1 Global Packaging Substrates Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Packaging Substrates by Region (2025-2030)
3.3 Global Packaging Substrates Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Packaging Substrates Production by Region (2019-2030)
3.4.1 Global Packaging Substrates Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Packaging Substrates by Region (2025-2030)
3.5 Global Packaging Substrates 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global Packaging Substrates Production and Value, Year-over-Year Growth
3.6.1 North America Packaging Substrates Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Packaging Substrates Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Packaging Substrates Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Packaging Substrates Production Value Estimates and Forecasts (2019-2030)
4 Packaging Substrates Consumption by Region
4.1 Global Packaging Substrates Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Packaging Substrates Consumption by Region (2019-2030)
4.2.1 Global Packaging Substrates Consumption by Region (2019-2024)
4.2.2 Global Packaging Substrates Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Packaging Substrates Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Packaging Substrates Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Packaging Substrates Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Packaging Substrates Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Packaging Substrates Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Packaging Substrates Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Packaging Substrates Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Packaging Substrates Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Packaging Substrates Production by Type (2019-2030)
5.1.1 Global Packaging Substrates Production by Type (2019-2024)
5.1.2 Global Packaging Substrates Production by Type (2025-2030)
5.1.3 Global Packaging Substrates Production 麻豆原创 Share by Type (2019-2030)
5.2 Global Packaging Substrates Production Value by Type (2019-2030)
5.2.1 Global Packaging Substrates Production Value by Type (2019-2024)
5.2.2 Global Packaging Substrates Production Value by Type (2025-2030)
5.2.3 Global Packaging Substrates Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global Packaging Substrates Price by Type (2019-2030)
6 Segment by Application
6.1 Global Packaging Substrates Production by Application (2019-2030)
6.1.1 Global Packaging Substrates Production by Application (2019-2024)
6.1.2 Global Packaging Substrates Production by Application (2025-2030)
6.1.3 Global Packaging Substrates Production 麻豆原创 Share by Application (2019-2030)
6.2 Global Packaging Substrates Production Value by Application (2019-2030)
6.2.1 Global Packaging Substrates Production Value by Application (2019-2024)
6.2.2 Global Packaging Substrates Production Value by Application (2025-2030)
6.2.3 Global Packaging Substrates Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global Packaging Substrates Price by Application (2019-2030)
7 Key Companies Profiled
7.1 IBIDEN CO.,LTD.
7.1.1 IBIDEN CO.,LTD. Packaging Substrates Corporation Information
7.1.2 IBIDEN CO.,LTD. Packaging Substrates Product Portfolio
7.1.3 IBIDEN CO.,LTD. Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.1.4 IBIDEN CO.,LTD. Main Business and 麻豆原创s Served
7.1.5 IBIDEN CO.,LTD. Recent Developments/Updates
7.2 KOBE STEEL,LTD
7.2.1 KOBE STEEL,LTD Packaging Substrates Corporation Information
7.2.2 KOBE STEEL,LTD Packaging Substrates Product Portfolio
7.2.3 KOBE STEEL,LTD Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.2.4 KOBE STEEL,LTD Main Business and 麻豆原创s Served
7.2.5 KOBE STEEL,LTD Recent Developments/Updates
7.3 Kyocera Group
7.3.1 Kyocera Group Packaging Substrates Corporation Information
7.3.2 Kyocera Group Packaging Substrates Product Portfolio
7.3.3 Kyocera Group Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Kyocera Group Main Business and 麻豆原创s Served
7.3.5 Kyocera Group Recent Developments/Updates
7.4 Samsung Group
7.4.1 Samsung Group Packaging Substrates Corporation Information
7.4.2 Samsung Group Packaging Substrates Product Portfolio
7.4.3 Samsung Group Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Samsung Group Main Business and 麻豆原创s Served
7.4.5 Samsung Group Recent Developments/Updates
7.5 SIMMTECH Co.,Ltd
7.5.1 SIMMTECH Co.,Ltd Packaging Substrates Corporation Information
7.5.2 SIMMTECH Co.,Ltd Packaging Substrates Product Portfolio
7.5.3 SIMMTECH Co.,Ltd Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.5.4 SIMMTECH Co.,Ltd Main Business and 麻豆原创s Served
7.5.5 SIMMTECH Co.,Ltd Recent Developments/Updates
7.6 Daeduck Group
7.6.1 Daeduck Group Packaging Substrates Corporation Information
7.6.2 Daeduck Group Packaging Substrates Product Portfolio
7.6.3 Daeduck Group Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Daeduck Group Main Business and 麻豆原创s Served
7.6.5 Daeduck Group Recent Developments/Updates
7.7 Unimicron
7.7.1 Unimicron Packaging Substrates Corporation Information
7.7.2 Unimicron Packaging Substrates Product Portfolio
7.7.3 Unimicron Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Unimicron Main Business and 麻豆原创s Served
7.7.5 Unimicron Recent Developments/Updates
7.8 Nan Ya PCB Co.,Ltd.
7.8.1 Nan Ya PCB Co.,Ltd. Packaging Substrates Corporation Information
7.8.2 Nan Ya PCB Co.,Ltd. Packaging Substrates Product Portfolio
7.8.3 Nan Ya PCB Co.,Ltd. Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Nan Ya PCB Co.,Ltd. Main Business and 麻豆原创s Served
7.7.5 Nan Ya PCB Co.,Ltd. Recent Developments/Updates
7.9 KINSUS
7.9.1 KINSUS Packaging Substrates Corporation Information
7.9.2 KINSUS Packaging Substrates Product Portfolio
7.9.3 KINSUS Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.9.4 KINSUS Main Business and 麻豆原创s Served
7.9.5 KINSUS Recent Developments/Updates
7.10 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.)
7.10.1 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.) Packaging Substrates Corporation Information
7.10.2 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.) Packaging Substrates Product Portfolio
7.10.3 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.) Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.10.4 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.) Main Business and 麻豆原创s Served
7.10.5 AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.) Recent Developments/Updates
7.11 Shenzhen Xingsen Express Circuit Technology Co.,Ltd.
7.11.1 Shenzhen Xingsen Express Circuit Technology Co.,Ltd. Packaging Substrates Corporation Information
7.11.2 Shenzhen Xingsen Express Circuit Technology Co.,Ltd. Packaging Substrates Product Portfolio
7.11.3 Shenzhen Xingsen Express Circuit Technology Co.,Ltd. Packaging Substrates Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Shenzhen Xingsen Express Circuit Technology Co.,Ltd. Main Business and 麻豆原创s Served
7.11.5 Shenzhen Xingsen Express Circuit Technology Co.,Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Packaging Substrates Industry Chain Analysis
8.2 Packaging Substrates Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Packaging Substrates Production Mode & Process
8.4 Packaging Substrates Sales and 麻豆原创ing
8.4.1 Packaging Substrates Sales Channels
8.4.2 Packaging Substrates Distributors
8.5 Packaging Substrates Customers
9 Packaging Substrates 麻豆原创 Dynamics
9.1 Packaging Substrates Industry Trends
9.2 Packaging Substrates 麻豆原创 Drivers
9.3 Packaging Substrates 麻豆原创 Challenges
9.4 Packaging Substrates 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
IBIDEN CO.,LTD.
KOBE STEEL,LTD
Kyocera Group
Samsung Group
SIMMTECH Co.,Ltd
Daeduck Group
Unimicron
Nan Ya PCB Co.,Ltd.
KINSUS
AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.)
Shenzhen Xingsen Express Circuit Technology Co.,Ltd.
听
听
*If Applicable.
