Opto-Electronic Packaging ensure that a number of major functions are supported for optical interconnections: proper distributions of optical and electrical signals, adequate power delivery and heat removal, and sufficient testing and environmental protection so that standards are met for quality and reliability.
The global Opto-Electronic Packaging market is projected to reach US$ 626.2 million in 2029, increasing from US$ 402 million in 2022, with the CAGR of 5.7% during the period of 2023 to 2029.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Opto-Electronic Packaging market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
GE Inspection Technologies
SCHOTT
Mycronic AB
Jitai
MACOM
U-PAK
Innoptics
Jenoptik
HOPERF
Bay Photonics
PHIX
ALTER TECHNOLOGY
Anteryon
Segment by Type
Hybrid Integrated Circuit Metal Package
Optoelectronic Component Packaging
Microwave Component Packaging
Filter Component Packaging
Sensor Element Packaging
High-power Device Packaging
Segment by Application
Aerospace
Military Communication Equipment
Commercial Communication Equipment
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Opto-Electronic Packaging report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. 麻豆原创 Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: 麻豆原创 Conclusions
Chapter 13: Research Methodology and Data Source
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Opto-Electronic Packaging 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Hybrid Integrated Circuit Metal Package
1.2.3 Optoelectronic Component Packaging
1.2.4 Microwave Component Packaging
1.2.5 Filter Component Packaging
1.2.6 Sensor Element Packaging
1.2.7 High-power Device Packaging
1.3 麻豆原创 by Application
1.3.1 Global Opto-Electronic Packaging 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Aerospace
1.3.3 Military Communication Equipment
1.3.4 Commercial Communication Equipment
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Opto-Electronic Packaging 麻豆原创 Perspective (2018-2029)
2.2 Opto-Electronic Packaging Growth Trends by Region
2.2.1 Global Opto-Electronic Packaging 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Opto-Electronic Packaging Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Opto-Electronic Packaging Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Opto-Electronic Packaging 麻豆原创 Dynamics
2.3.1 Opto-Electronic Packaging Industry Trends
2.3.2 Opto-Electronic Packaging 麻豆原创 Drivers
2.3.3 Opto-Electronic Packaging 麻豆原创 Challenges
2.3.4 Opto-Electronic Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Opto-Electronic Packaging Players by Revenue
3.1.1 Global Top Opto-Electronic Packaging Players by Revenue (2018-2023)
3.1.2 Global Opto-Electronic Packaging Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Opto-Electronic Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Opto-Electronic Packaging Revenue
3.4 Global Opto-Electronic Packaging 麻豆原创 Concentration Ratio
3.4.1 Global Opto-Electronic Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Opto-Electronic Packaging Revenue in 2022
3.5 Opto-Electronic Packaging Key Players Head office and Area Served
3.6 Key Players Opto-Electronic Packaging Product Solution and Service
3.7 Date of Enter into Opto-Electronic Packaging 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Opto-Electronic Packaging Breakdown Data by Type
4.1 Global Opto-Electronic Packaging Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Opto-Electronic Packaging Forecasted 麻豆原创 Size by Type (2024-2029)
5 Opto-Electronic Packaging Breakdown Data by Application
5.1 Global Opto-Electronic Packaging Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Opto-Electronic Packaging Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Opto-Electronic Packaging 麻豆原创 Size (2018-2029)
6.2 North America Opto-Electronic Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Opto-Electronic Packaging 麻豆原创 Size by Country (2018-2023)
6.4 North America Opto-Electronic Packaging 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Opto-Electronic Packaging 麻豆原创 Size (2018-2029)
7.2 Europe Opto-Electronic Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Opto-Electronic Packaging 麻豆原创 Size by Country (2018-2023)
7.4 Europe Opto-Electronic Packaging 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Opto-Electronic Packaging 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Opto-Electronic Packaging 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Opto-Electronic Packaging 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Opto-Electronic Packaging 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Opto-Electronic Packaging 麻豆原创 Size (2018-2029)
9.2 Latin America Opto-Electronic Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Opto-Electronic Packaging 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Opto-Electronic Packaging 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Opto-Electronic Packaging 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Opto-Electronic Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Opto-Electronic Packaging 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Opto-Electronic Packaging 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 GE Inspection Technologies
11.1.1 GE Inspection Technologies Company Detail
11.1.2 GE Inspection Technologies Business Overview
11.1.3 GE Inspection Technologies Opto-Electronic Packaging Introduction
11.1.4 GE Inspection Technologies Revenue in Opto-Electronic Packaging Business (2018-2023)
11.1.5 GE Inspection Technologies Recent Development
11.2 SCHOTT
11.2.1 SCHOTT Company Detail
11.2.2 SCHOTT Business Overview
11.2.3 SCHOTT Opto-Electronic Packaging Introduction
11.2.4 SCHOTT Revenue in Opto-Electronic Packaging Business (2018-2023)
11.2.5 SCHOTT Recent Development
11.3 Mycronic AB
11.3.1 Mycronic AB Company Detail
11.3.2 Mycronic AB Business Overview
11.3.3 Mycronic AB Opto-Electronic Packaging Introduction
11.3.4 Mycronic AB Revenue in Opto-Electronic Packaging Business (2018-2023)
11.3.5 Mycronic AB Recent Development
11.4 Jitai
11.4.1 Jitai Company Detail
11.4.2 Jitai Business Overview
11.4.3 Jitai Opto-Electronic Packaging Introduction
11.4.4 Jitai Revenue in Opto-Electronic Packaging Business (2018-2023)
11.4.5 Jitai Recent Development
11.5 MACOM
11.5.1 MACOM Company Detail
11.5.2 MACOM Business Overview
11.5.3 MACOM Opto-Electronic Packaging Introduction
11.5.4 MACOM Revenue in Opto-Electronic Packaging Business (2018-2023)
11.5.5 MACOM Recent Development
11.6 U-PAK
11.6.1 U-PAK Company Detail
11.6.2 U-PAK Business Overview
11.6.3 U-PAK Opto-Electronic Packaging Introduction
11.6.4 U-PAK Revenue in Opto-Electronic Packaging Business (2018-2023)
11.6.5 U-PAK Recent Development
11.7 Innoptics
11.7.1 Innoptics Company Detail
11.7.2 Innoptics Business Overview
11.7.3 Innoptics Opto-Electronic Packaging Introduction
11.7.4 Innoptics Revenue in Opto-Electronic Packaging Business (2018-2023)
11.7.5 Innoptics Recent Development
11.8 Jenoptik
11.8.1 Jenoptik Company Detail
11.8.2 Jenoptik Business Overview
11.8.3 Jenoptik Opto-Electronic Packaging Introduction
11.8.4 Jenoptik Revenue in Opto-Electronic Packaging Business (2018-2023)
11.8.5 Jenoptik Recent Development
11.9 HOPERF
11.9.1 HOPERF Company Detail
11.9.2 HOPERF Business Overview
11.9.3 HOPERF Opto-Electronic Packaging Introduction
11.9.4 HOPERF Revenue in Opto-Electronic Packaging Business (2018-2023)
11.9.5 HOPERF Recent Development
11.10 Bay Photonics
11.10.1 Bay Photonics Company Detail
11.10.2 Bay Photonics Business Overview
11.10.3 Bay Photonics Opto-Electronic Packaging Introduction
11.10.4 Bay Photonics Revenue in Opto-Electronic Packaging Business (2018-2023)
11.10.5 Bay Photonics Recent Development
11.11 PHIX
11.11.1 PHIX Company Detail
11.11.2 PHIX Business Overview
11.11.3 PHIX Opto-Electronic Packaging Introduction
11.11.4 PHIX Revenue in Opto-Electronic Packaging Business (2018-2023)
11.11.5 PHIX Recent Development
11.12 ALTER TECHNOLOGY
11.12.1 ALTER TECHNOLOGY Company Detail
11.12.2 ALTER TECHNOLOGY Business Overview
11.12.3 ALTER TECHNOLOGY Opto-Electronic Packaging Introduction
11.12.4 ALTER TECHNOLOGY Revenue in Opto-Electronic Packaging Business (2018-2023)
11.12.5 ALTER TECHNOLOGY Recent Development
11.13 Anteryon
11.13.1 Anteryon Company Detail
11.13.2 Anteryon Business Overview
11.13.3 Anteryon Opto-Electronic Packaging Introduction
11.13.4 Anteryon Revenue in Opto-Electronic Packaging Business (2018-2023)
11.13.5 Anteryon Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
GE Inspection Technologies
SCHOTT
Mycronic AB
Jitai
MACOM
U-PAK
Innoptics
Jenoptik
HOPERF
Bay Photonics
PHIX
ALTER TECHNOLOGY
Anteryon
听
听
*If Applicable.
