Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; 鈶� has good heat conduction and heat dissipation; 鈶� good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; 鈶� Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
Highlights
The global Metal Shell for Microelectronic Packages market was valued at US$ 1994.2 million in 2022 and is anticipated to reach US$ 1980.1 million by 2029, witnessing a CAGR of -0.1% during the forecast period 2023-2029. The influence of COVID-19 and the Netherlands-Ukraine War were considered while estimating market sizes.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Metal Shell for Microelectronic Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Metal Shell for Microelectronic Packages.
The Metal Shell for Microelectronic Packages market size, estimations, and forecasts are provided in terms of sales volume (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Metal Shell for Microelectronic Packages market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Metal Shell for Microelectronic Packages manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application and by regions.
By Company
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Segment by Type
TO Shell
Flat Shell
Segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Metal Shell for Microelectronic Packages manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Sales, revenue of Metal Shell for Microelectronic Packages in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 8: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 9: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Metal Shell for Microelectronic Packages 麻豆原创 Overview
1.1 Product Overview and Scope of Metal Shell for Microelectronic Packages
1.2 Metal Shell for Microelectronic Packages Segment by Type
1.2.1 Global Metal Shell for Microelectronic Packages 麻豆原创 Value Comparison by Type (2023-2029)
1.2.2 TO Shell
1.2.3 Flat Shell
1.3 Metal Shell for Microelectronic Packages Segment by Application
1.3.1 Global Metal Shell for Microelectronic Packages 麻豆原创 Value by Application: (2023-2029)
1.3.2 Aeronautics and Astronautics
1.3.3 Petrochemical Industry
1.3.4 Automobile
1.3.5 Optical Communication
1.3.6 Other
1.4 Global Metal Shell for Microelectronic Packages 麻豆原创 Size Estimates and Forecasts
1.4.1 Global Metal Shell for Microelectronic Packages Revenue 2018-2029
1.4.2 Global Metal Shell for Microelectronic Packages Sales 2018-2029
1.4.3 Global Metal Shell for Microelectronic Packages 麻豆原创 Average Price (2018-2029)
1.5 Assumptions and Limitations
2 Metal Shell for Microelectronic Packages 麻豆原创 Competition by Manufacturers
2.1 Global Metal Shell for Microelectronic Packages Sales 麻豆原创 Share by Manufacturers (2018-2023)
2.2 Global Metal Shell for Microelectronic Packages Revenue 麻豆原创 Share by Manufacturers (2018-2023)
2.3 Global Metal Shell for Microelectronic Packages Average Price by Manufacturers (2018-2023)
2.4 Global Metal Shell for Microelectronic Packages Industry Ranking 2021 VS 2022 VS 2023
2.5 Global Key Manufacturers of Metal Shell for Microelectronic Packages, Manufacturing Sites & Headquarters
2.6 Global Key Manufacturers of Metal Shell for Microelectronic Packages, Product Type & Application
2.7 Metal Shell for Microelectronic Packages 麻豆原创 Competitive Situation and Trends
2.7.1 Metal Shell for Microelectronic Packages 麻豆原创 Concentration Rate
2.7.2 The Global Top 5 and Top 10 Largest Metal Shell for Microelectronic Packages Players 麻豆原创 Share by Revenue
2.7.3 Global Metal Shell for Microelectronic Packages 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.8 Manufacturers Mergers & Acquisitions, Expansion Plans
3 Metal Shell for Microelectronic Packages Retrospective 麻豆原创 Scenario by Region
3.1 Global Metal Shell for Microelectronic Packages 麻豆原创 Size by Region: 2018 Versus 2022 Versus 2029
3.2 Global Metal Shell for Microelectronic Packages Global Metal Shell for Microelectronic Packages Sales by Region: 2018-2029
3.2.1 Global Metal Shell for Microelectronic Packages Sales by Region: 2018-2023
3.2.2 Global Metal Shell for Microelectronic Packages Sales by Region: 2024-2029
3.3 Global Metal Shell for Microelectronic Packages Global Metal Shell for Microelectronic Packages Revenue by Region: 2018-2029
3.3.1 Global Metal Shell for Microelectronic Packages Revenue by Region: 2018-2023
3.3.2 Global Metal Shell for Microelectronic Packages Revenue by Region: 2024-2029
3.4 North America Metal Shell for Microelectronic Packages 麻豆原创 Facts & Figures by Country
3.4.1 North America Metal Shell for Microelectronic Packages 麻豆原创 Size by Country: 2018 VS 2022 VS 2029
3.4.2 North America Metal Shell for Microelectronic Packages Sales by Country (2018-2029)
3.4.3 North America Metal Shell for Microelectronic Packages Revenue by Country (2018-2029)
3.4.4 United States
3.4.5 Canada
3.5 Europe Metal Shell for Microelectronic Packages 麻豆原创 Facts & Figures by Country
3.5.1 Europe Metal Shell for Microelectronic Packages 麻豆原创 Size by Country: 2018 VS 2022 VS 2029
3.5.2 Europe Metal Shell for Microelectronic Packages Sales by Country (2018-2029)
3.5.3 Europe Metal Shell for Microelectronic Packages Revenue by Country (2018-2029)
3.5.4 Germany
3.5.5 France
3.5.6 U.K.
3.5.7 Italy
3.5.8 Russia
3.6 Asia Pacific Metal Shell for Microelectronic Packages 麻豆原创 Facts & Figures by Country
3.6.1 Asia Pacific Metal Shell for Microelectronic Packages 麻豆原创 Size by Country: 2018 VS 2022 VS 2029
3.6.2 Asia Pacific Metal Shell for Microelectronic Packages Sales by Country (2018-2029)
3.6.3 Asia Pacific Metal Shell for Microelectronic Packages Revenue by Country (2018-2029)
3.6.4 China
3.6.5 Japan
3.6.6 South Korea
3.6.7 India
3.6.8 Australia
3.6.9 China Taiwan
3.6.10 Indonesia
3.6.11 Thailand
3.6.12 Malaysia
3.7 Latin America Metal Shell for Microelectronic Packages 麻豆原创 Facts & Figures by Country
3.7.1 Latin America Metal Shell for Microelectronic Packages 麻豆原创 Size by Country: 2018 VS 2022 VS 2029
3.7.2 Latin America Metal Shell for Microelectronic Packages Sales by Country (2018-2029)
3.7.3 Latin America Metal Shell for Microelectronic Packages Revenue by Country (2018-2029)
3.7.4 Mexico
3.7.5 Brazil
3.7.6 Argentina
3.8 Middle East and Africa Metal Shell for Microelectronic Packages 麻豆原创 Facts & Figures by Country
3.8.1 Middle East and Africa Metal Shell for Microelectronic Packages 麻豆原创 Size by Country: 2018 VS 2022 VS 2029
3.8.2 Middle East and Africa Metal Shell for Microelectronic Packages Sales by Country (2018-2029)
3.8.3 Middle East and Africa Metal Shell for Microelectronic Packages Revenue by Country (2018-2029)
3.8.4 Turkey
3.8.5 Saudi Arabia
3.8.6 UAE
4 Segment by Type
4.1 Global Metal Shell for Microelectronic Packages Sales by Type (2018-2029)
4.1.1 Global Metal Shell for Microelectronic Packages Sales by Type (2018-2023)
4.1.2 Global Metal Shell for Microelectronic Packages Sales by Type (2024-2029)
4.1.3 Global Metal Shell for Microelectronic Packages Sales 麻豆原创 Share by Type (2018-2029)
4.2 Global Metal Shell for Microelectronic Packages Revenue by Type (2018-2029)
4.2.1 Global Metal Shell for Microelectronic Packages Revenue by Type (2018-2023)
4.2.2 Global Metal Shell for Microelectronic Packages Revenue by Type (2024-2029)
4.2.3 Global Metal Shell for Microelectronic Packages Revenue 麻豆原创 Share by Type (2018-2029)
4.3 Global Metal Shell for Microelectronic Packages Price by Type (2018-2029)
5 Segment by Application
5.1 Global Metal Shell for Microelectronic Packages Sales by Application (2018-2029)
5.1.1 Global Metal Shell for Microelectronic Packages Sales by Application (2018-2023)
5.1.2 Global Metal Shell for Microelectronic Packages Sales by Application (2024-2029)
5.1.3 Global Metal Shell for Microelectronic Packages Sales 麻豆原创 Share by Application (2018-2029)
5.2 Global Metal Shell for Microelectronic Packages Revenue by Application (2018-2029)
5.2.1 Global Metal Shell for Microelectronic Packages Revenue by Application (2018-2023)
5.2.2 Global Metal Shell for Microelectronic Packages Revenue by Application (2024-2029)
5.2.3 Global Metal Shell for Microelectronic Packages Revenue 麻豆原创 Share by Application (2018-2029)
5.3 Global Metal Shell for Microelectronic Packages Price by Application (2018-2029)
6 Key Companies Profiled
6.1 AMETEK(GSP)
6.1.1 AMETEK(GSP) Corporation Information
6.1.2 AMETEK(GSP) Description and Business Overview
6.1.3 AMETEK(GSP) Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.1.4 AMETEK(GSP) Metal Shell for Microelectronic Packages Product Portfolio
6.1.5 AMETEK(GSP) Recent Developments/Updates
6.2 SCHOTT
6.2.1 SCHOTT Corporation Information
6.2.2 SCHOTT Description and Business Overview
6.2.3 SCHOTT Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.2.4 SCHOTT Metal Shell for Microelectronic Packages Product Portfolio
6.2.5 SCHOTT Recent Developments/Updates
6.3 Complete Hermetics
6.3.1 Complete Hermetics Corporation Information
6.3.2 Complete Hermetics Description and Business Overview
6.3.3 Complete Hermetics Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.3.4 Complete Hermetics Metal Shell for Microelectronic Packages Product Portfolio
6.3.5 Complete Hermetics Recent Developments/Updates
6.4 KOTO
6.4.1 KOTO Corporation Information
6.4.2 KOTO Description and Business Overview
6.4.3 KOTO Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.4.4 KOTO Metal Shell for Microelectronic Packages Product Portfolio
6.4.5 KOTO Recent Developments/Updates
6.5 Kyocera
6.5.1 Kyocera Corporation Information
6.5.2 Kyocera Description and Business Overview
6.5.3 Kyocera Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.5.4 Kyocera Metal Shell for Microelectronic Packages Product Portfolio
6.5.5 Kyocera Recent Developments/Updates
6.6 SGA Technologies
6.6.1 SGA Technologies Corporation Information
6.6.2 SGA Technologies Description and Business Overview
6.6.3 SGA Technologies Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.6.4 SGA Technologies Metal Shell for Microelectronic Packages Product Portfolio
6.6.5 SGA Technologies Recent Developments/Updates
6.7 Century Seals
6.6.1 Century Seals Corporation Information
6.6.2 Century Seals Description and Business Overview
6.6.3 Century Seals Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.4.4 Century Seals Metal Shell for Microelectronic Packages Product Portfolio
6.7.5 Century Seals Recent Developments/Updates
6.8 KaiRui
6.8.1 KaiRui Corporation Information
6.8.2 KaiRui Description and Business Overview
6.8.3 KaiRui Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.8.4 KaiRui Metal Shell for Microelectronic Packages Product Portfolio
6.8.5 KaiRui Recent Developments/Updates
6.9 Jiangsu Dongguang Micro-electronics
6.9.1 Jiangsu Dongguang Micro-electronics Corporation Information
6.9.2 Jiangsu Dongguang Micro-electronics Description and Business Overview
6.9.3 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.9.4 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Product Portfolio
6.9.5 Jiangsu Dongguang Micro-electronics Recent Developments/Updates
6.10 Taizhou Hangyu Electric Appliance
6.10.1 Taizhou Hangyu Electric Appliance Corporation Information
6.10.2 Taizhou Hangyu Electric Appliance Description and Business Overview
6.10.3 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.10.4 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Product Portfolio
6.10.5 Taizhou Hangyu Electric Appliance Recent Developments/Updates
6.11 CETC40
6.11.1 CETC40 Corporation Information
6.11.2 CETC40 Metal Shell for Microelectronic Packages Description and Business Overview
6.11.3 CETC40 Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.11.4 CETC40 Metal Shell for Microelectronic Packages Product Portfolio
6.11.5 CETC40 Recent Developments/Updates
6.12 BOJING ELECTRONICS
6.12.1 BOJING ELECTRONICS Corporation Information
6.12.2 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Description and Business Overview
6.12.3 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.12.4 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Product Portfolio
6.12.5 BOJING ELECTRONICS Recent Developments/Updates
6.13 CETC43
6.13.1 CETC43 Corporation Information
6.13.2 CETC43 Metal Shell for Microelectronic Packages Description and Business Overview
6.13.3 CETC43 Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.13.4 CETC43 Metal Shell for Microelectronic Packages Product Portfolio
6.13.5 CETC43 Recent Developments/Updates
6.14 SINOPIONEER
6.14.1 SINOPIONEER Corporation Information
6.14.2 SINOPIONEER Metal Shell for Microelectronic Packages Description and Business Overview
6.14.3 SINOPIONEER Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.14.4 SINOPIONEER Metal Shell for Microelectronic Packages Product Portfolio
6.14.5 SINOPIONEER Recent Developments/Updates
6.15 CCTC
6.15.1 CCTC Corporation Information
6.15.2 CCTC Metal Shell for Microelectronic Packages Description and Business Overview
6.15.3 CCTC Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.15.4 CCTC Metal Shell for Microelectronic Packages Product Portfolio
6.15.5 CCTC Recent Developments/Updates
6.16 XingChuang
6.16.1 XingChuang Corporation Information
6.16.2 XingChuang Metal Shell for Microelectronic Packages Description and Business Overview
6.16.3 XingChuang Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.16.4 XingChuang Metal Shell for Microelectronic Packages Product Portfolio
6.16.5 XingChuang Recent Developments/Updates
6.17 Rizhao Xuri Electronics Co., Ltd.
6.17.1 Rizhao Xuri Electronics Co., Ltd. Corporation Information
6.17.2 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Description and Business Overview
6.17.3 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.17.4 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Product Portfolio
6.17.5 Rizhao Xuri Electronics Co., Ltd. Recent Developments/Updates
6.18 ShengDa Technology
6.18.1 ShengDa Technology Corporation Information
6.18.2 ShengDa Technology Metal Shell for Microelectronic Packages Description and Business Overview
6.18.3 ShengDa Technology Metal Shell for Microelectronic Packages Sales, Revenue and Gross Margin (2018-2023)
6.18.4 ShengDa Technology Metal Shell for Microelectronic Packages Product Portfolio
6.18.5 ShengDa Technology Recent Developments/Updates
7 Industry Chain and Sales Channels Analysis
7.1 Metal Shell for Microelectronic Packages Industry Chain Analysis
7.2 Metal Shell for Microelectronic Packages Key Raw Materials
7.2.1 Key Raw Materials
7.2.2 Raw Materials Key Suppliers
7.3 Metal Shell for Microelectronic Packages Production Mode & Process
7.4 Metal Shell for Microelectronic Packages Sales and 麻豆原创ing
7.4.1 Metal Shell for Microelectronic Packages Sales Channels
7.4.2 Metal Shell for Microelectronic Packages Distributors
7.5 Metal Shell for Microelectronic Packages Customers
8 Metal Shell for Microelectronic Packages 麻豆原创 Dynamics
8.1 Metal Shell for Microelectronic Packages Industry Trends
8.2 Metal Shell for Microelectronic Packages 麻豆原创 Drivers
8.3 Metal Shell for Microelectronic Packages 麻豆原创 Challenges
8.4 Metal Shell for Microelectronic Packages 麻豆原创 Restraints
9 Research Finding and Conclusion
10 Methodology and Data Source
10.1 Methodology/Research Approach
10.1.1 Research Programs/Design
10.1.2 麻豆原创 Size Estimation
10.1.3 麻豆原创 Breakdown and Data Triangulation
10.2 Data Source
10.2.1 Secondary Sources
10.2.2 Primary Sources
10.3 Author List
10.4 Disclaimer
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
听
听
*If Applicable.
