The global market for Land Grid Array (LGA) Packaging was valued at US$ 439 million in the year 2024 and is projected to reach a revised size of US$ 714 million by 2031, growing at a CAGR of 7.3% during the forecast period.
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package outline. It is especially suitable for application that required high electrical performance.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Land Grid Array (LGA) Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Land Grid Array (LGA) Packaging.
The Land Grid Array (LGA) Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Land Grid Array (LGA) Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Land Grid Array (LGA) Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Orient Semiconductor Electronics
NXP
Maxim Integrated
Thales Group
Analog Devices
ASE Holdings
GS Nanotech
Amkor
by Type
Hot Air Soldering
Infrared Soldering
by Application
Consumer Electronics
Automotive
Optoelectronic Components
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Land Grid Array (LGA) Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Land Grid Array (LGA) Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Land Grid Array (LGA) Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Land Grid Array (LGA) Packaging 麻豆原创 Overview
1.1 Product Definition
1.2 Land Grid Array (LGA) Packaging by Type
1.2.1 Global Land Grid Array (LGA) Packaging 麻豆原创 Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Hot Air Soldering
1.2.3 Infrared Soldering
1.3 Land Grid Array (LGA) Packaging by Application
1.3.1 Global Land Grid Array (LGA) Packaging 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Optoelectronic Components
1.3.5 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Land Grid Array (LGA) Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Land Grid Array (LGA) Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Land Grid Array (LGA) Packaging 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Land Grid Array (LGA) Packaging Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global Land Grid Array (LGA) Packaging Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of Land Grid Array (LGA) Packaging, Industry Ranking, 2023 VS 2024
2.4 Global Land Grid Array (LGA) Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Land Grid Array (LGA) Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Land Grid Array (LGA) Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Land Grid Array (LGA) Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Land Grid Array (LGA) Packaging, Date of Enter into This Industry
2.9 Land Grid Array (LGA) Packaging 麻豆原创 Competitive Situation and Trends
2.9.1 Land Grid Array (LGA) Packaging 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Land Grid Array (LGA) Packaging Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Land Grid Array (LGA) Packaging Production by Region
3.1 Global Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Land Grid Array (LGA) Packaging Production Value by Region (2020-2031)
3.2.1 Global Land Grid Array (LGA) Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Land Grid Array (LGA) Packaging by Region (2026-2031)
3.3 Global Land Grid Array (LGA) Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Land Grid Array (LGA) Packaging Production Volume by Region (2020-2031)
3.4.1 Global Land Grid Array (LGA) Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Land Grid Array (LGA) Packaging by Region (2026-2031)
3.5 Global Land Grid Array (LGA) Packaging 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global Land Grid Array (LGA) Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Land Grid Array (LGA) Packaging Production Value Estimates and Forecasts (2020-2031)
4 Land Grid Array (LGA) Packaging Consumption by Region
4.1 Global Land Grid Array (LGA) Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Land Grid Array (LGA) Packaging Consumption by Region (2020-2031)
4.2.1 Global Land Grid Array (LGA) Packaging Consumption by Region (2020-2025)
4.2.2 Global Land Grid Array (LGA) Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Land Grid Array (LGA) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Land Grid Array (LGA) Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Land Grid Array (LGA) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Land Grid Array (LGA) Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Land Grid Array (LGA) Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Land Grid Array (LGA) Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Land Grid Array (LGA) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Land Grid Array (LGA) Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Land Grid Array (LGA) Packaging Production by Type (2020-2031)
5.1.1 Global Land Grid Array (LGA) Packaging Production by Type (2020-2025)
5.1.2 Global Land Grid Array (LGA) Packaging Production by Type (2026-2031)
5.1.3 Global Land Grid Array (LGA) Packaging Production 麻豆原创 Share by Type (2020-2031)
5.2 Global Land Grid Array (LGA) Packaging Production Value by Type (2020-2031)
5.2.1 Global Land Grid Array (LGA) Packaging Production Value by Type (2020-2025)
5.2.2 Global Land Grid Array (LGA) Packaging Production Value by Type (2026-2031)
5.2.3 Global Land Grid Array (LGA) Packaging Production Value 麻豆原创 Share by Type (2020-2031)
5.3 Global Land Grid Array (LGA) Packaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global Land Grid Array (LGA) Packaging Production by Application (2020-2031)
6.1.1 Global Land Grid Array (LGA) Packaging Production by Application (2020-2025)
6.1.2 Global Land Grid Array (LGA) Packaging Production by Application (2026-2031)
6.1.3 Global Land Grid Array (LGA) Packaging Production 麻豆原创 Share by Application (2020-2031)
6.2 Global Land Grid Array (LGA) Packaging Production Value by Application (2020-2031)
6.2.1 Global Land Grid Array (LGA) Packaging Production Value by Application (2020-2025)
6.2.2 Global Land Grid Array (LGA) Packaging Production Value by Application (2026-2031)
6.2.3 Global Land Grid Array (LGA) Packaging Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global Land Grid Array (LGA) Packaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Orient Semiconductor Electronics
7.1.1 Orient Semiconductor Electronics Land Grid Array (LGA) Packaging Company Information
7.1.2 Orient Semiconductor Electronics Land Grid Array (LGA) Packaging Product Portfolio
7.1.3 Orient Semiconductor Electronics Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Orient Semiconductor Electronics Main Business and 麻豆原创s Served
7.1.5 Orient Semiconductor Electronics Recent Developments/Updates
7.2 NXP
7.2.1 NXP Land Grid Array (LGA) Packaging Company Information
7.2.2 NXP Land Grid Array (LGA) Packaging Product Portfolio
7.2.3 NXP Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 NXP Main Business and 麻豆原创s Served
7.2.5 NXP Recent Developments/Updates
7.3 Maxim Integrated
7.3.1 Maxim Integrated Land Grid Array (LGA) Packaging Company Information
7.3.2 Maxim Integrated Land Grid Array (LGA) Packaging Product Portfolio
7.3.3 Maxim Integrated Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Maxim Integrated Main Business and 麻豆原创s Served
7.3.5 Maxim Integrated Recent Developments/Updates
7.4 Thales Group
7.4.1 Thales Group Land Grid Array (LGA) Packaging Company Information
7.4.2 Thales Group Land Grid Array (LGA) Packaging Product Portfolio
7.4.3 Thales Group Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Thales Group Main Business and 麻豆原创s Served
7.4.5 Thales Group Recent Developments/Updates
7.5 Analog Devices
7.5.1 Analog Devices Land Grid Array (LGA) Packaging Company Information
7.5.2 Analog Devices Land Grid Array (LGA) Packaging Product Portfolio
7.5.3 Analog Devices Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Analog Devices Main Business and 麻豆原创s Served
7.5.5 Analog Devices Recent Developments/Updates
7.6 ASE Holdings
7.6.1 ASE Holdings Land Grid Array (LGA) Packaging Company Information
7.6.2 ASE Holdings Land Grid Array (LGA) Packaging Product Portfolio
7.6.3 ASE Holdings Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.6.4 ASE Holdings Main Business and 麻豆原创s Served
7.6.5 ASE Holdings Recent Developments/Updates
7.7 GS Nanotech
7.7.1 GS Nanotech Land Grid Array (LGA) Packaging Company Information
7.7.2 GS Nanotech Land Grid Array (LGA) Packaging Product Portfolio
7.7.3 GS Nanotech Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.7.4 GS Nanotech Main Business and 麻豆原创s Served
7.7.5 GS Nanotech Recent Developments/Updates
7.8 Amkor
7.8.1 Amkor Land Grid Array (LGA) Packaging Company Information
7.8.2 Amkor Land Grid Array (LGA) Packaging Product Portfolio
7.8.3 Amkor Land Grid Array (LGA) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Amkor Main Business and 麻豆原创s Served
7.8.5 Amkor Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Land Grid Array (LGA) Packaging Industry Chain Analysis
8.2 Land Grid Array (LGA) Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Land Grid Array (LGA) Packaging Production Mode & Process Analysis
8.4 Land Grid Array (LGA) Packaging Sales and 麻豆原创ing
8.4.1 Land Grid Array (LGA) Packaging Sales Channels
8.4.2 Land Grid Array (LGA) Packaging Distributors
8.5 Land Grid Array (LGA) Packaging Customer Analysis
9 Land Grid Array (LGA) Packaging 麻豆原创 Dynamics
9.1 Land Grid Array (LGA) Packaging Industry Trends
9.2 Land Grid Array (LGA) Packaging 麻豆原创 Drivers
9.3 Land Grid Array (LGA) Packaging 麻豆原创 Challenges
9.4 Land Grid Array (LGA) Packaging 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Orient Semiconductor Electronics
NXP
Maxim Integrated
Thales Group
Analog Devices
ASE Holdings
GS Nanotech
Amkor
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*If Applicable.
