Global IC Package Substrate Material 麻豆原创 Research Report 2025

Publication ID:

PB502250225

Publication Date:

February 27, 2025

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

The global market for IC Package Substrate Material was valued at US$ 6950 million in the year 2024 and is projected to reach a revised size of US$ 11680 million by 2031, growing at a CAGR of 7.6% during the forecast period.
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
At the regional level, the Chinese mainland market accounts for about 9% of the world. From the product perspective, substrate resin is currently the most important packaging material, accounting for 41%, and it is expected that it will continue to be the largest type in the future. From the application perspective, FC-BGA is currently the most important application, accounting for 38%.
At present, global manufacturers are mainly concentrated in the Asia-Pacific region, and China has also developed very rapidly in recent years. Major companies include Ajinomoto, Changchun, Mitsubishi Gas, Nanya Plastics, Showa Denko, Mitsui Metals and Panasonic Electric, etc. The top five companies account for more than 30%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
IC packaging substrate materials are affected by the following factors: First, the 2019 COVID-19 pandemic swept the world, causing serious impacts on all industries around the world. Although high-tech industries such as semiconductor chips have not been fatally hit, the fluctuations in the macro environment have also indirectly affected the normal development of the semiconductor packaging industry market. Second, with the expansion of Sino-US trade frictions, many Taiwanese and Chinese companies have been affected, and some Chinese semiconductor manufacturers have chosen to build factories in other countries and regions for production. Third, because chips belong to high-tech industries, they require a high level of manufacturing technology. Some countries or companies have mastered the latest technology, but due to some factors, they have not been made public. The existence of technical barriers has restricted the development of the IC packaging substrate material industry. Of course, challenges and opportunities coexist. In recent years, the United States, Europe, Japan and other countries have introduced bills to increase support for their IC packaging substrate materials and related industries, including various grants and subsidy policies. The rise of industries such as 5G/6G, the Internet of Things, and new energy vehicles has increased the demand for chips and greatly promoted the development of the chip industry. In addition, the rapid development of integrated circuits has driven the large-scale expansion of the entire semiconductor industry. Personal computers and smartphones are still important sources of demand for the chip industry, and strong demand is an important factor in the expansion of the chip industry. With the improvement of living standards, people's entertainment needs have been improved. The rise of wearable devices and entertainment devices has further increased the demand for chips. Chip packaging technology has involved various materials, electronics, thermal, mechanics, chemistry, reliability and other disciplines. It is a high-tech industry that is increasingly valued and developed in parallel with integrated circuit chips. With the simultaneous development of design, chip manufacturing and packaging and testing, the importance of packaging in the entire IC industry chain is unquestionable. The proportions are gradually tending towards reasonable and coordinated development, and its importance is increasing.
This report aims to provide a comprehensive presentation of the global market for IC Package Substrate Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrate Material.
The IC Package Substrate Material market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Package Substrate Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrate Material companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Mitsubishi Gas Chemical
Ajinomoto
Resonac Corporation
Panasonic
Mitsui Mining & Smelting
Nan Ya Plastics
Sumitomo Bakelite
Chang Chun Group
Sekisui Chemical
WaferChem Technology
ITEQ
Segment by Type
Substrate Resin
Copper Foil
Insulation Materials
Drill
Other
Segment by Application
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Package Substrate Material company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

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Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global IC Package Substrate Material 麻豆原创 Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Substrate Resin
1.2.3 Copper Foil
1.2.4 Insulation Materials
1.2.5 Drill
1.2.6 Other
1.3 麻豆原创 by Application
1.3.1 Global IC Package Substrate Material 麻豆原创 Growth by Application: 2020 VS 2024 VS 2031
1.3.2 FC-BGA
1.3.3 FC-CSP
1.3.4 WB BGA
1.3.5 WB CSP
1.3.6 RF Module
1.3.7 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Package Substrate Material 麻豆原创 Perspective (2020-2031)
2.2 Global IC Package Substrate Material Growth Trends by Region
2.2.1 Global IC Package Substrate Material 麻豆原创 Size by Region: 2020 VS 2024 VS 2031
2.2.2 IC Package Substrate Material Historic 麻豆原创 Size by Region (2020-2025)
2.2.3 IC Package Substrate Material Forecasted 麻豆原创 Size by Region (2026-2031)
2.3 IC Package Substrate Material 麻豆原创 Dynamics
2.3.1 IC Package Substrate Material Industry Trends
2.3.2 IC Package Substrate Material 麻豆原创 Drivers
2.3.3 IC Package Substrate Material 麻豆原创 Challenges
2.3.4 IC Package Substrate Material 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Package Substrate Material Players by Revenue
3.1.1 Global Top IC Package Substrate Material Players by Revenue (2020-2025)
3.1.2 Global IC Package Substrate Material Revenue 麻豆原创 Share by Players (2020-2025)
3.2 Global Top IC Package Substrate Material Players by Company Type and 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by IC Package Substrate Material Revenue
3.4 Global IC Package Substrate Material 麻豆原创 Concentration Ratio
3.4.1 Global IC Package Substrate Material 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Package Substrate Material Revenue in 2024
3.5 Global Key Players of IC Package Substrate Material Head office and Area Served
3.6 Global Key Players of IC Package Substrate Material, Product and Application
3.7 Global Key Players of IC Package Substrate Material, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Package Substrate Material Breakdown Data by Type
4.1 Global IC Package Substrate Material Historic 麻豆原创 Size by Type (2020-2025)
4.2 Global IC Package Substrate Material Forecasted 麻豆原创 Size by Type (2026-2031)
5 IC Package Substrate Material Breakdown Data by Application
5.1 Global IC Package Substrate Material Historic 麻豆原创 Size by Application (2020-2025)
5.2 Global IC Package Substrate Material Forecasted 麻豆原创 Size by Application (2026-2031)
6 North America
6.1 North America IC Package Substrate Material 麻豆原创 Size (2020-2031)
6.2 North America IC Package Substrate Material 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America IC Package Substrate Material 麻豆原创 Size by Country (2020-2025)
6.4 North America IC Package Substrate Material 麻豆原创 Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Package Substrate Material 麻豆原创 Size (2020-2031)
7.2 Europe IC Package Substrate Material 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe IC Package Substrate Material 麻豆原创 Size by Country (2020-2025)
7.4 Europe IC Package Substrate Material 麻豆原创 Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Package Substrate Material 麻豆原创 Size (2020-2031)
8.2 Asia-Pacific IC Package Substrate Material 麻豆原创 Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific IC Package Substrate Material 麻豆原创 Size by Region (2020-2025)
8.4 Asia-Pacific IC Package Substrate Material 麻豆原创 Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Package Substrate Material 麻豆原创 Size (2020-2031)
9.2 Latin America IC Package Substrate Material 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America IC Package Substrate Material 麻豆原创 Size by Country (2020-2025)
9.4 Latin America IC Package Substrate Material 麻豆原创 Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Package Substrate Material 麻豆原创 Size (2020-2031)
10.2 Middle East & Africa IC Package Substrate Material 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa IC Package Substrate Material 麻豆原创 Size by Country (2020-2025)
10.4 Middle East & Africa IC Package Substrate Material 麻豆原创 Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Mitsubishi Gas Chemical
11.1.1 Mitsubishi Gas Chemical Company Details
11.1.2 Mitsubishi Gas Chemical Business Overview
11.1.3 Mitsubishi Gas Chemical IC Package Substrate Material Introduction
11.1.4 Mitsubishi Gas Chemical Revenue in IC Package Substrate Material Business (2020-2025)
11.1.5 Mitsubishi Gas Chemical Recent Development
11.2 Ajinomoto
11.2.1 Ajinomoto Company Details
11.2.2 Ajinomoto Business Overview
11.2.3 Ajinomoto IC Package Substrate Material Introduction
11.2.4 Ajinomoto Revenue in IC Package Substrate Material Business (2020-2025)
11.2.5 Ajinomoto Recent Development
11.3 Resonac Corporation
11.3.1 Resonac Corporation Company Details
11.3.2 Resonac Corporation Business Overview
11.3.3 Resonac Corporation IC Package Substrate Material Introduction
11.3.4 Resonac Corporation Revenue in IC Package Substrate Material Business (2020-2025)
11.3.5 Resonac Corporation Recent Development
11.4 Panasonic
11.4.1 Panasonic Company Details
11.4.2 Panasonic Business Overview
11.4.3 Panasonic IC Package Substrate Material Introduction
11.4.4 Panasonic Revenue in IC Package Substrate Material Business (2020-2025)
11.4.5 Panasonic Recent Development
11.5 Mitsui Mining & Smelting
11.5.1 Mitsui Mining & Smelting Company Details
11.5.2 Mitsui Mining & Smelting Business Overview
11.5.3 Mitsui Mining & Smelting IC Package Substrate Material Introduction
11.5.4 Mitsui Mining & Smelting Revenue in IC Package Substrate Material Business (2020-2025)
11.5.5 Mitsui Mining & Smelting Recent Development
11.6 Nan Ya Plastics
11.6.1 Nan Ya Plastics Company Details
11.6.2 Nan Ya Plastics Business Overview
11.6.3 Nan Ya Plastics IC Package Substrate Material Introduction
11.6.4 Nan Ya Plastics Revenue in IC Package Substrate Material Business (2020-2025)
11.6.5 Nan Ya Plastics Recent Development
11.7 Sumitomo Bakelite
11.7.1 Sumitomo Bakelite Company Details
11.7.2 Sumitomo Bakelite Business Overview
11.7.3 Sumitomo Bakelite IC Package Substrate Material Introduction
11.7.4 Sumitomo Bakelite Revenue in IC Package Substrate Material Business (2020-2025)
11.7.5 Sumitomo Bakelite Recent Development
11.8 Chang Chun Group
11.8.1 Chang Chun Group Company Details
11.8.2 Chang Chun Group Business Overview
11.8.3 Chang Chun Group IC Package Substrate Material Introduction
11.8.4 Chang Chun Group Revenue in IC Package Substrate Material Business (2020-2025)
11.8.5 Chang Chun Group Recent Development
11.9 Sekisui Chemical
11.9.1 Sekisui Chemical Company Details
11.9.2 Sekisui Chemical Business Overview
11.9.3 Sekisui Chemical IC Package Substrate Material Introduction
11.9.4 Sekisui Chemical Revenue in IC Package Substrate Material Business (2020-2025)
11.9.5 Sekisui Chemical Recent Development
11.10 WaferChem Technology
11.10.1 WaferChem Technology Company Details
11.10.2 WaferChem Technology Business Overview
11.10.3 WaferChem Technology IC Package Substrate Material Introduction
11.10.4 WaferChem Technology Revenue in IC Package Substrate Material Business (2020-2025)
11.10.5 WaferChem Technology Recent Development
11.11 ITEQ
11.11.1 ITEQ Company Details
11.11.2 ITEQ Business Overview
11.11.3 ITEQ IC Package Substrate Material Introduction
11.11.4 ITEQ Revenue in IC Package Substrate Material Business (2020-2025)
11.11.5 ITEQ Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 麻豆原创 Size Estimation
13.1.1.3 麻豆原创 Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

Mitsubishi Gas Chemical
Ajinomoto
Resonac Corporation
Panasonic
Mitsui Mining & Smelting
Nan Ya Plastics
Sumitomo Bakelite
Chang Chun Group
Sekisui Chemical
WaferChem Technology
ITEQ

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