IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
The global IC Package Substrate Material market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for IC Package Substrate Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The China market for IC Package Substrate Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The Europe market for IC Package Substrate Material is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The global key manufacturers of IC Package Substrate Material include Ajinomoto, Mitsubishi Gas Chemical, Mitsui Mining & Smelting, Panasonic, TTM Technologies, ASE Metarial, Ibiden, Unimicron and Kinsus, etc. In 2023, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the IC Package Substrate Material production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of IC Package Substrate Material by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for IC Package Substrate Material, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of IC Package Substrate Material, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for IC Package Substrate Material, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the IC Package Substrate Material sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global IC Package Substrate Material market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for IC Package Substrate Material sales, projected growth trends, production technology, application and end-user industry.
麻豆原创 Segmentation
By Company
Ajinomoto
Mitsubishi Gas Chemical
Mitsui Mining & Smelting
Panasonic
TTM Technologies
ASE Metarial
Ibiden
Unimicron
Kinsus
Shennan Circuit
Nanya
Showa Denko
Segment by Type
Copper Foil
Resin Substrate
Dry Film (Solid Photoresist)
Wet Film (Liquid Photoresist)
Metal (Copper, Nickel, Gold Salt)
Others
Segment by Application
Memory Chip Packaging Substrate
Mems Packaging System
Rf Module Packaging Substrate
Others
Production by Region
North America
Europe
China
Japan
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: IC Package Substrate Material production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of IC Package Substrate Material in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of IC Package Substrate Material manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, IC Package Substrate Material sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 IC Package Substrate Material Product Introduction
1.2 麻豆原创 by Type
1.2.1 Global IC Package Substrate Material 麻豆原创 Size by Type, 2019 VS 2023 VS 2030
1.2.2 Copper Foil
1.2.3 Resin Substrate
1.2.4 Dry Film (Solid Photoresist)
1.2.5 Wet Film (Liquid Photoresist)
1.2.6 Metal (Copper, Nickel, Gold Salt)
1.2.7 Others
1.3 麻豆原创 by Application
1.3.1 Global IC Package Substrate Material 麻豆原创 Size by Application, 2019 VS 2023 VS 2030
1.3.2 Memory Chip Packaging Substrate
1.3.3 Mems Packaging System
1.3.4 Rf Module Packaging Substrate
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global IC Package Substrate Material Production
2.1 Global IC Package Substrate Material Production Capacity (2019-2030)
2.2 Global IC Package Substrate Material Production by Region: 2019 VS 2023 VS 2030
2.3 Global IC Package Substrate Material Production by Region
2.3.1 Global IC Package Substrate Material Historic Production by Region (2019-2024)
2.3.2 Global IC Package Substrate Material Forecasted Production by Region (2025-2030)
2.3.3 Global IC Package Substrate Material Production 麻豆原创 Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Executive Summary
3.1 Global IC Package Substrate Material Revenue Estimates and Forecasts 2019-2030
3.2 Global IC Package Substrate Material Revenue by Region
3.2.1 Global IC Package Substrate Material Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global IC Package Substrate Material Revenue by Region (2019-2024)
3.2.3 Global IC Package Substrate Material Revenue by Region (2025-2030)
3.2.4 Global IC Package Substrate Material Revenue 麻豆原创 Share by Region (2019-2030)
3.3 Global IC Package Substrate Material Sales Estimates and Forecasts 2019-2030
3.4 Global IC Package Substrate Material Sales by Region
3.4.1 Global IC Package Substrate Material Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global IC Package Substrate Material Sales by Region (2019-2024)
3.4.3 Global IC Package Substrate Material Sales by Region (2025-2030)
3.4.4 Global IC Package Substrate Material Sales 麻豆原创 Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global IC Package Substrate Material Sales by Manufacturers
4.1.1 Global IC Package Substrate Material Sales by Manufacturers (2019-2024)
4.1.2 Global IC Package Substrate Material Sales 麻豆原创 Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of IC Package Substrate Material in 2023
4.2 Global IC Package Substrate Material Revenue by Manufacturers
4.2.1 Global IC Package Substrate Material Revenue by Manufacturers (2019-2024)
4.2.2 Global IC Package Substrate Material Revenue 麻豆原创 Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by IC Package Substrate Material Revenue in 2023
4.3 Global IC Package Substrate Material Sales Price by Manufacturers
4.4 Global Key Players of IC Package Substrate Material, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers 麻豆原创 Concentration Ratio (CR5 and HHI)
4.5.2 Global IC Package Substrate Material 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of IC Package Substrate Material, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of IC Package Substrate Material, Product Offered and Application
4.8 Global Key Manufacturers of IC Package Substrate Material, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 麻豆原创 Size by Type
5.1 Global IC Package Substrate Material Sales by Type
5.1.1 Global IC Package Substrate Material Historical Sales by Type (2019-2024)
5.1.2 Global IC Package Substrate Material Forecasted Sales by Type (2025-2030)
5.1.3 Global IC Package Substrate Material Sales 麻豆原创 Share by Type (2019-2030)
5.2 Global IC Package Substrate Material Revenue by Type
5.2.1 Global IC Package Substrate Material Historical Revenue by Type (2019-2024)
5.2.2 Global IC Package Substrate Material Forecasted Revenue by Type (2025-2030)
5.2.3 Global IC Package Substrate Material Revenue 麻豆原创 Share by Type (2019-2030)
5.3 Global IC Package Substrate Material Price by Type
5.3.1 Global IC Package Substrate Material Price by Type (2019-2024)
5.3.2 Global IC Package Substrate Material Price Forecast by Type (2025-2030)
6 麻豆原创 Size by Application
6.1 Global IC Package Substrate Material Sales by Application
6.1.1 Global IC Package Substrate Material Historical Sales by Application (2019-2024)
6.1.2 Global IC Package Substrate Material Forecasted Sales by Application (2025-2030)
6.1.3 Global IC Package Substrate Material Sales 麻豆原创 Share by Application (2019-2030)
6.2 Global IC Package Substrate Material Revenue by Application
6.2.1 Global IC Package Substrate Material Historical Revenue by Application (2019-2024)
6.2.2 Global IC Package Substrate Material Forecasted Revenue by Application (2025-2030)
6.2.3 Global IC Package Substrate Material Revenue 麻豆原创 Share by Application (2019-2030)
6.3 Global IC Package Substrate Material Price by Application
6.3.1 Global IC Package Substrate Material Price by Application (2019-2024)
6.3.2 Global IC Package Substrate Material Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada IC Package Substrate Material 麻豆原创 Size by Type
7.1.1 US & Canada IC Package Substrate Material Sales by Type (2019-2030)
7.1.2 US & Canada IC Package Substrate Material Revenue by Type (2019-2030)
7.2 US & Canada IC Package Substrate Material 麻豆原创 Size by Application
7.2.1 US & Canada IC Package Substrate Material Sales by Application (2019-2030)
7.2.2 US & Canada IC Package Substrate Material Revenue by Application (2019-2030)
7.3 US & Canada IC Package Substrate Material Sales by Country
7.3.1 US & Canada IC Package Substrate Material Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada IC Package Substrate Material Sales by Country (2019-2030)
7.3.3 US & Canada IC Package Substrate Material Revenue by Country (2019-2030)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe IC Package Substrate Material 麻豆原创 Size by Type
8.1.1 Europe IC Package Substrate Material Sales by Type (2019-2030)
8.1.2 Europe IC Package Substrate Material Revenue by Type (2019-2030)
8.2 Europe IC Package Substrate Material 麻豆原创 Size by Application
8.2.1 Europe IC Package Substrate Material Sales by Application (2019-2030)
8.2.2 Europe IC Package Substrate Material Revenue by Application (2019-2030)
8.3 Europe IC Package Substrate Material Sales by Country
8.3.1 Europe IC Package Substrate Material Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe IC Package Substrate Material Sales by Country (2019-2030)
8.3.3 Europe IC Package Substrate Material Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China IC Package Substrate Material 麻豆原创 Size by Type
9.1.1 China IC Package Substrate Material Sales by Type (2019-2030)
9.1.2 China IC Package Substrate Material Revenue by Type (2019-2030)
9.2 China IC Package Substrate Material 麻豆原创 Size by Application
9.2.1 China IC Package Substrate Material Sales by Application (2019-2030)
9.2.2 China IC Package Substrate Material Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia IC Package Substrate Material 麻豆原创 Size by Type
10.1.1 Asia IC Package Substrate Material Sales by Type (2019-2030)
10.1.2 Asia IC Package Substrate Material Revenue by Type (2019-2030)
10.2 Asia IC Package Substrate Material 麻豆原创 Size by Application
10.2.1 Asia IC Package Substrate Material Sales by Application (2019-2030)
10.2.2 Asia IC Package Substrate Material Revenue by Application (2019-2030)
10.3 Asia IC Package Substrate Material Sales by Region
10.3.1 Asia IC Package Substrate Material Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia IC Package Substrate Material Revenue by Region (2019-2030)
10.3.3 Asia IC Package Substrate Material Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America IC Package Substrate Material 麻豆原创 Size by Type
11.1.1 Middle East, Africa and Latin America IC Package Substrate Material Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America IC Package Substrate Material Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America IC Package Substrate Material 麻豆原创 Size by Application
11.2.1 Middle East, Africa and Latin America IC Package Substrate Material Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America IC Package Substrate Material Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America IC Package Substrate Material Sales by Country
11.3.1 Middle East, Africa and Latin America IC Package Substrate Material Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America IC Package Substrate Material Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America IC Package Substrate Material Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Ajinomoto
12.1.1 Ajinomoto Company Information
12.1.2 Ajinomoto Overview
12.1.3 Ajinomoto IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 Ajinomoto IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Ajinomoto Recent Developments
12.2 Mitsubishi Gas Chemical
12.2.1 Mitsubishi Gas Chemical Company Information
12.2.2 Mitsubishi Gas Chemical Overview
12.2.3 Mitsubishi Gas Chemical IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 Mitsubishi Gas Chemical IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Mitsubishi Gas Chemical Recent Developments
12.3 Mitsui Mining & Smelting
12.3.1 Mitsui Mining & Smelting Company Information
12.3.2 Mitsui Mining & Smelting Overview
12.3.3 Mitsui Mining & Smelting IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Mitsui Mining & Smelting IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Mitsui Mining & Smelting Recent Developments
12.4 Panasonic
12.4.1 Panasonic Company Information
12.4.2 Panasonic Overview
12.4.3 Panasonic IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 Panasonic IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Panasonic Recent Developments
12.5 TTM Technologies
12.5.1 TTM Technologies Company Information
12.5.2 TTM Technologies Overview
12.5.3 TTM Technologies IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 TTM Technologies IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 TTM Technologies Recent Developments
12.6 ASE Metarial
12.6.1 ASE Metarial Company Information
12.6.2 ASE Metarial Overview
12.6.3 ASE Metarial IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 ASE Metarial IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 ASE Metarial Recent Developments
12.7 Ibiden
12.7.1 Ibiden Company Information
12.7.2 Ibiden Overview
12.7.3 Ibiden IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Ibiden IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Ibiden Recent Developments
12.8 Unimicron
12.8.1 Unimicron Company Information
12.8.2 Unimicron Overview
12.8.3 Unimicron IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 Unimicron IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Unimicron Recent Developments
12.9 Kinsus
12.9.1 Kinsus Company Information
12.9.2 Kinsus Overview
12.9.3 Kinsus IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 Kinsus IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Kinsus Recent Developments
12.10 Shennan Circuit
12.10.1 Shennan Circuit Company Information
12.10.2 Shennan Circuit Overview
12.10.3 Shennan Circuit IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 Shennan Circuit IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Shennan Circuit Recent Developments
12.11 Nanya
12.11.1 Nanya Company Information
12.11.2 Nanya Overview
12.11.3 Nanya IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.11.4 Nanya IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Nanya Recent Developments
12.12 Showa Denko
12.12.1 Showa Denko Company Information
12.12.2 Showa Denko Overview
12.12.3 Showa Denko IC Package Substrate Material Capacity, Sales, Price, Revenue and Gross Margin (2019-2024)
12.12.4 Showa Denko IC Package Substrate Material Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 Showa Denko Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 IC Package Substrate Material Industry Chain Analysis
13.2 IC Package Substrate Material Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 IC Package Substrate Material Production Mode & Process
13.4 IC Package Substrate Material Sales and 麻豆原创ing
13.4.1 IC Package Substrate Material Sales Channels
13.4.2 IC Package Substrate Material Distributors
13.5 IC Package Substrate Material Customers
14 IC Package Substrate Material 麻豆原创 Dynamics
14.1 IC Package Substrate Material Industry Trends
14.2 IC Package Substrate Material 麻豆原创 Drivers
14.3 IC Package Substrate Material 麻豆原创 Challenges
14.4 IC Package Substrate Material 麻豆原创 Restraints
15 Key Finding in The Global IC Package Substrate Material Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Ajinomoto
Mitsubishi Gas Chemical
Mitsui Mining & Smelting
Panasonic
TTM Technologies
ASE Metarial
Ibiden
Unimicron
Kinsus
Shennan Circuit
Nanya
Showa Denko
听
听
*If Applicable.
