High Layer Count PCB with Three or more copper layers, this is achieved by manufacturing the desired number of double sided boards (called inner layers) and bonding them together with glue (pre-preg), standard processes are then followed to complete the board.
The global High Layer Count PCB market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
In terms of production side, this report researches the High Layer Count PCB production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of High Layer Count PCB by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for High Layer Count PCB, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of High Layer Count PCB, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for High Layer Count PCB, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the High Layer Count PCB sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global High Layer Count PCB market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for High Layer Count PCB sales, projected growth trends, production technology, application and end-user industry.
麻豆原创 Segmentation
By Company
TTM Technologies
Meiko
PW Circuits
Tripod Technoloigy
KingBoard
AT&S
Nippon Mektron
Ellington Electronic Technology
Schweizer
Bomin Electronics
Ibiden
ZDT
Compeq
Segment by Type
3-layer High Layer Count PCB
14-layer High Layer Count PCB
32-layer High Layer Count PCB
Others
Segment by Application
Consumer Electronics
Computer
Communications
Industrial/Medical
Automotive
Military/Aerospace
Others
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: High Layer Count PCB production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of High Layer Count PCB in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of High Layer Count PCB manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, High Layer Count PCB sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 High Layer Count PCB Product Introduction
1.2 麻豆原创 by Type
1.2.1 Global High Layer Count PCB 麻豆原创 Size by Type, 2019 VS 2023 VS 2030
1.2.2 3-layer High Layer Count PCB
1.2.3 14-layer High Layer Count PCB
1.2.4 32-layer High Layer Count PCB
1.2.5 Others
1.3 麻豆原创 by Application
1.3.1 Global High Layer Count PCB 麻豆原创 Size by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Computer
1.3.4 Communications
1.3.5 Industrial/Medical
1.3.6 Automotive
1.3.7 Military/Aerospace
1.3.8 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global High Layer Count PCB Production
2.1 Global High Layer Count PCB Production Capacity (2019-2030)
2.2 Global High Layer Count PCB Production by Region: 2019 VS 2023 VS 2030
2.3 Global High Layer Count PCB Production by Region
2.3.1 Global High Layer Count PCB Historic Production by Region (2019-2024)
2.3.2 Global High Layer Count PCB Forecasted Production by Region (2025-2030)
2.3.3 Global High Layer Count PCB Production 麻豆原创 Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
2.9 Taiwan
3 Executive Summary
3.1 Global High Layer Count PCB Revenue Estimates and Forecasts 2019-2030
3.2 Global High Layer Count PCB Revenue by Region
3.2.1 Global High Layer Count PCB Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global High Layer Count PCB Revenue by Region (2019-2024)
3.2.3 Global High Layer Count PCB Revenue by Region (2025-2030)
3.2.4 Global High Layer Count PCB Revenue 麻豆原创 Share by Region (2019-2030)
3.3 Global High Layer Count PCB Sales Estimates and Forecasts 2019-2030
3.4 Global High Layer Count PCB Sales by Region
3.4.1 Global High Layer Count PCB Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global High Layer Count PCB Sales by Region (2019-2024)
3.4.3 Global High Layer Count PCB Sales by Region (2025-2030)
3.4.4 Global High Layer Count PCB Sales 麻豆原创 Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global High Layer Count PCB Sales by Manufacturers
4.1.1 Global High Layer Count PCB Sales by Manufacturers (2019-2024)
4.1.2 Global High Layer Count PCB Sales 麻豆原创 Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of High Layer Count PCB in 2023
4.2 Global High Layer Count PCB Revenue by Manufacturers
4.2.1 Global High Layer Count PCB Revenue by Manufacturers (2019-2024)
4.2.2 Global High Layer Count PCB Revenue 麻豆原创 Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by High Layer Count PCB Revenue in 2023
4.3 Global High Layer Count PCB Sales Price by Manufacturers
4.4 Global Key Players of High Layer Count PCB, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers 麻豆原创 Concentration Ratio (CR5 and HHI)
4.5.2 Global High Layer Count PCB 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of High Layer Count PCB, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of High Layer Count PCB, Product Offered and Application
4.8 Global Key Manufacturers of High Layer Count PCB, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 麻豆原创 Size by Type
5.1 Global High Layer Count PCB Sales by Type
5.1.1 Global High Layer Count PCB Historical Sales by Type (2019-2024)
5.1.2 Global High Layer Count PCB Forecasted Sales by Type (2025-2030)
5.1.3 Global High Layer Count PCB Sales 麻豆原创 Share by Type (2019-2030)
5.2 Global High Layer Count PCB Revenue by Type
5.2.1 Global High Layer Count PCB Historical Revenue by Type (2019-2024)
5.2.2 Global High Layer Count PCB Forecasted Revenue by Type (2025-2030)
5.2.3 Global High Layer Count PCB Revenue 麻豆原创 Share by Type (2019-2030)
5.3 Global High Layer Count PCB Price by Type
5.3.1 Global High Layer Count PCB Price by Type (2019-2024)
5.3.2 Global High Layer Count PCB Price Forecast by Type (2025-2030)
6 麻豆原创 Size by Application
6.1 Global High Layer Count PCB Sales by Application
6.1.1 Global High Layer Count PCB Historical Sales by Application (2019-2024)
6.1.2 Global High Layer Count PCB Forecasted Sales by Application (2025-2030)
6.1.3 Global High Layer Count PCB Sales 麻豆原创 Share by Application (2019-2030)
6.2 Global High Layer Count PCB Revenue by Application
6.2.1 Global High Layer Count PCB Historical Revenue by Application (2019-2024)
6.2.2 Global High Layer Count PCB Forecasted Revenue by Application (2025-2030)
6.2.3 Global High Layer Count PCB Revenue 麻豆原创 Share by Application (2019-2030)
6.3 Global High Layer Count PCB Price by Application
6.3.1 Global High Layer Count PCB Price by Application (2019-2024)
6.3.2 Global High Layer Count PCB Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada High Layer Count PCB 麻豆原创 Size by Type
7.1.1 US & Canada High Layer Count PCB Sales by Type (2019-2030)
7.1.2 US & Canada High Layer Count PCB Revenue by Type (2019-2030)
7.2 US & Canada High Layer Count PCB 麻豆原创 Size by Application
7.2.1 US & Canada High Layer Count PCB Sales by Application (2019-2030)
7.2.2 US & Canada High Layer Count PCB Revenue by Application (2019-2030)
7.3 US & Canada High Layer Count PCB Sales by Country
7.3.1 US & Canada High Layer Count PCB Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada High Layer Count PCB Sales by Country (2019-2030)
7.3.3 US & Canada High Layer Count PCB Revenue by Country (2019-2030)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe High Layer Count PCB 麻豆原创 Size by Type
8.1.1 Europe High Layer Count PCB Sales by Type (2019-2030)
8.1.2 Europe High Layer Count PCB Revenue by Type (2019-2030)
8.2 Europe High Layer Count PCB 麻豆原创 Size by Application
8.2.1 Europe High Layer Count PCB Sales by Application (2019-2030)
8.2.2 Europe High Layer Count PCB Revenue by Application (2019-2030)
8.3 Europe High Layer Count PCB Sales by Country
8.3.1 Europe High Layer Count PCB Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe High Layer Count PCB Sales by Country (2019-2030)
8.3.3 Europe High Layer Count PCB Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China High Layer Count PCB 麻豆原创 Size by Type
9.1.1 China High Layer Count PCB Sales by Type (2019-2030)
9.1.2 China High Layer Count PCB Revenue by Type (2019-2030)
9.2 China High Layer Count PCB 麻豆原创 Size by Application
9.2.1 China High Layer Count PCB Sales by Application (2019-2030)
9.2.2 China High Layer Count PCB Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia High Layer Count PCB 麻豆原创 Size by Type
10.1.1 Asia High Layer Count PCB Sales by Type (2019-2030)
10.1.2 Asia High Layer Count PCB Revenue by Type (2019-2030)
10.2 Asia High Layer Count PCB 麻豆原创 Size by Application
10.2.1 Asia High Layer Count PCB Sales by Application (2019-2030)
10.2.2 Asia High Layer Count PCB Revenue by Application (2019-2030)
10.3 Asia High Layer Count PCB Sales by Region
10.3.1 Asia High Layer Count PCB Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia High Layer Count PCB Revenue by Region (2019-2030)
10.3.3 Asia High Layer Count PCB Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America High Layer Count PCB 麻豆原创 Size by Type
11.1.1 Middle East, Africa and Latin America High Layer Count PCB Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America High Layer Count PCB Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America High Layer Count PCB 麻豆原创 Size by Application
11.2.1 Middle East, Africa and Latin America High Layer Count PCB Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America High Layer Count PCB Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America High Layer Count PCB Sales by Country
11.3.1 Middle East, Africa and Latin America High Layer Count PCB Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America High Layer Count PCB Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America High Layer Count PCB Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 TTM Technologies
12.1.1 TTM Technologies Company Information
12.1.2 TTM Technologies Overview
12.1.3 TTM Technologies High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 TTM Technologies High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 TTM Technologies Recent Developments
12.2 Meiko
12.2.1 Meiko Company Information
12.2.2 Meiko Overview
12.2.3 Meiko High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 Meiko High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Meiko Recent Developments
12.3 PW Circuits
12.3.1 PW Circuits Company Information
12.3.2 PW Circuits Overview
12.3.3 PW Circuits High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 PW Circuits High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 PW Circuits Recent Developments
12.4 Tripod Technoloigy
12.4.1 Tripod Technoloigy Company Information
12.4.2 Tripod Technoloigy Overview
12.4.3 Tripod Technoloigy High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 Tripod Technoloigy High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Tripod Technoloigy Recent Developments
12.5 KingBoard
12.5.1 KingBoard Company Information
12.5.2 KingBoard Overview
12.5.3 KingBoard High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 KingBoard High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 KingBoard Recent Developments
12.6 AT&S
12.6.1 AT&S Company Information
12.6.2 AT&S Overview
12.6.3 AT&S High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 AT&S High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 AT&S Recent Developments
12.7 Nippon Mektron
12.7.1 Nippon Mektron Company Information
12.7.2 Nippon Mektron Overview
12.7.3 Nippon Mektron High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Nippon Mektron High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Nippon Mektron Recent Developments
12.8 Ellington Electronic Technology
12.8.1 Ellington Electronic Technology Company Information
12.8.2 Ellington Electronic Technology Overview
12.8.3 Ellington Electronic Technology High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 Ellington Electronic Technology High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Ellington Electronic Technology Recent Developments
12.9 Schweizer
12.9.1 Schweizer Company Information
12.9.2 Schweizer Overview
12.9.3 Schweizer High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 Schweizer High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Schweizer Recent Developments
12.10 Bomin Electronics
12.10.1 Bomin Electronics Company Information
12.10.2 Bomin Electronics Overview
12.10.3 Bomin Electronics High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 Bomin Electronics High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Bomin Electronics Recent Developments
12.11 Ibiden
12.11.1 Ibiden Company Information
12.11.2 Ibiden Overview
12.11.3 Ibiden High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.11.4 Ibiden High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Ibiden Recent Developments
12.12 ZDT
12.12.1 ZDT Company Information
12.12.2 ZDT Overview
12.12.3 ZDT High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.12.4 ZDT High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 ZDT Recent Developments
12.13 Compeq
12.13.1 Compeq Company Information
12.13.2 Compeq Overview
12.13.3 Compeq High Layer Count PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.13.4 Compeq High Layer Count PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Compeq Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 High Layer Count PCB Industry Chain Analysis
13.2 High Layer Count PCB Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 High Layer Count PCB Production Mode & Process
13.4 High Layer Count PCB Sales and 麻豆原创ing
13.4.1 High Layer Count PCB Sales Channels
13.4.2 High Layer Count PCB Distributors
13.5 High Layer Count PCB Customers
14 High Layer Count PCB 麻豆原创 Dynamics
14.1 High Layer Count PCB Industry Trends
14.2 High Layer Count PCB 麻豆原创 Drivers
14.3 High Layer Count PCB 麻豆原创 Challenges
14.4 High Layer Count PCB 麻豆原创 Restraints
15 Key Finding in The Global High Layer Count PCB Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
TTM Technologies
Meiko
PW Circuits
Tripod Technoloigy
KingBoard
AT&S
Nippon Mektron
Ellington Electronic Technology
Schweizer
Bomin Electronics
Ibiden
ZDT
Compeq
听
听
*If Applicable.
