High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
The global High Density Interconnect market was valued at US$ 13200 million in 2023 and is anticipated to reach US$ 26120 million by 2030, witnessing a CAGR of 10.1% during the forecast period 2024-2030.
North American market for High Density Interconnect is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for High Density Interconnect is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of High Density Interconnect include IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq and Unitech Printed Circuit Board Corp., etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for High Density Interconnect, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Density Interconnect.
Report Scope
The High Density Interconnect market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Density Interconnect market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Density Interconnect manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
IBIDEN Group
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Group
ZDT
Compeq
Unitech Printed Circuit Board Corp.
LG Innotek
Tripod Technology
TTM Technologies
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
CCTC
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Bittele Electronics
Epec
W眉rth Elektronik
NOD Electronics
San Francisco Circuits
PCBCart
Advanced Circuits
Segment by Type
Single Panel
Double Panel
Others
Segment by Application
Automotive Electronics
Consumer Electronics
Other Electronic Products
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High Density Interconnect manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High Density Interconnect by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High Density Interconnect in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 High Density Interconnect 麻豆原创 Overview
1.1 Product Definition
1.2 High Density Interconnect Segment by Type
1.2.1 Global High Density Interconnect 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Single Panel
1.2.3 Double Panel
1.2.4 Others
1.3 High Density Interconnect Segment by Application
1.3.1 Global High Density Interconnect 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automotive Electronics
1.3.3 Consumer Electronics
1.3.4 Other Electronic Products
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global High Density Interconnect Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global High Density Interconnect Production Estimates and Forecasts (2019-2030)
1.4.4 Global High Density Interconnect 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global High Density Interconnect Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global High Density Interconnect Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of High Density Interconnect, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global High Density Interconnect 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global High Density Interconnect Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of High Density Interconnect, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of High Density Interconnect, Product Offered and Application
2.8 Global Key Manufacturers of High Density Interconnect, Date of Enter into This Industry
2.9 High Density Interconnect 麻豆原创 Competitive Situation and Trends
2.9.1 High Density Interconnect 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest High Density Interconnect Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 High Density Interconnect Production by Region
3.1 Global High Density Interconnect Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global High Density Interconnect Production Value by Region (2019-2030)
3.2.1 Global High Density Interconnect Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of High Density Interconnect by Region (2025-2030)
3.3 Global High Density Interconnect Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global High Density Interconnect Production by Region (2019-2030)
3.4.1 Global High Density Interconnect Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of High Density Interconnect by Region (2025-2030)
3.5 Global High Density Interconnect 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global High Density Interconnect Production and Value, Year-over-Year Growth
3.6.1 North America High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.3 China High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
4 High Density Interconnect Consumption by Region
4.1 Global High Density Interconnect Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global High Density Interconnect Consumption by Region (2019-2030)
4.2.1 Global High Density Interconnect Consumption by Region (2019-2024)
4.2.2 Global High Density Interconnect Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America High Density Interconnect Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe High Density Interconnect Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific High Density Interconnect Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific High Density Interconnect Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa High Density Interconnect Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global High Density Interconnect Production by Type (2019-2030)
5.1.1 Global High Density Interconnect Production by Type (2019-2024)
5.1.2 Global High Density Interconnect Production by Type (2025-2030)
5.1.3 Global High Density Interconnect Production 麻豆原创 Share by Type (2019-2030)
5.2 Global High Density Interconnect Production Value by Type (2019-2030)
5.2.1 Global High Density Interconnect Production Value by Type (2019-2024)
5.2.2 Global High Density Interconnect Production Value by Type (2025-2030)
5.2.3 Global High Density Interconnect Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global High Density Interconnect Price by Type (2019-2030)
6 Segment by Application
6.1 Global High Density Interconnect Production by Application (2019-2030)
6.1.1 Global High Density Interconnect Production by Application (2019-2024)
6.1.2 Global High Density Interconnect Production by Application (2025-2030)
6.1.3 Global High Density Interconnect Production 麻豆原创 Share by Application (2019-2030)
6.2 Global High Density Interconnect Production Value by Application (2019-2030)
6.2.1 Global High Density Interconnect Production Value by Application (2019-2024)
6.2.2 Global High Density Interconnect Production Value by Application (2025-2030)
6.2.3 Global High Density Interconnect Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global High Density Interconnect Price by Application (2019-2030)
7 Key Companies Profiled
7.1 IBIDEN Group
7.1.1 IBIDEN Group High Density Interconnect Corporation Information
7.1.2 IBIDEN Group High Density Interconnect Product Portfolio
7.1.3 IBIDEN Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.1.4 IBIDEN Group Main Business and 麻豆原创s Served
7.1.5 IBIDEN Group Recent Developments/Updates
7.2 Unimicron
7.2.1 Unimicron High Density Interconnect Corporation Information
7.2.2 Unimicron High Density Interconnect Product Portfolio
7.2.3 Unimicron High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Unimicron Main Business and 麻豆原创s Served
7.2.5 Unimicron Recent Developments/Updates
7.3 AT&S
7.3.1 AT&S High Density Interconnect Corporation Information
7.3.2 AT&S High Density Interconnect Product Portfolio
7.3.3 AT&S High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.3.4 AT&S Main Business and 麻豆原创s Served
7.3.5 AT&S Recent Developments/Updates
7.4 SEMCO
7.4.1 SEMCO High Density Interconnect Corporation Information
7.4.2 SEMCO High Density Interconnect Product Portfolio
7.4.3 SEMCO High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.4.4 SEMCO Main Business and 麻豆原创s Served
7.4.5 SEMCO Recent Developments/Updates
7.5 NCAB Group
7.5.1 NCAB Group High Density Interconnect Corporation Information
7.5.2 NCAB Group High Density Interconnect Product Portfolio
7.5.3 NCAB Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.5.4 NCAB Group Main Business and 麻豆原创s Served
7.5.5 NCAB Group Recent Developments/Updates
7.6 Young Poong Group
7.6.1 Young Poong Group High Density Interconnect Corporation Information
7.6.2 Young Poong Group High Density Interconnect Product Portfolio
7.6.3 Young Poong Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Young Poong Group Main Business and 麻豆原创s Served
7.6.5 Young Poong Group Recent Developments/Updates
7.7 ZDT
7.7.1 ZDT High Density Interconnect Corporation Information
7.7.2 ZDT High Density Interconnect Product Portfolio
7.7.3 ZDT High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ZDT Main Business and 麻豆原创s Served
7.7.5 ZDT Recent Developments/Updates
7.8 Compeq
7.8.1 Compeq High Density Interconnect Corporation Information
7.8.2 Compeq High Density Interconnect Product Portfolio
7.8.3 Compeq High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Compeq Main Business and 麻豆原创s Served
7.7.5 Compeq Recent Developments/Updates
7.9 Unitech Printed Circuit Board Corp.
7.9.1 Unitech Printed Circuit Board Corp. High Density Interconnect Corporation Information
7.9.2 Unitech Printed Circuit Board Corp. High Density Interconnect Product Portfolio
7.9.3 Unitech Printed Circuit Board Corp. High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Unitech Printed Circuit Board Corp. Main Business and 麻豆原创s Served
7.9.5 Unitech Printed Circuit Board Corp. Recent Developments/Updates
7.10 LG Innotek
7.10.1 LG Innotek High Density Interconnect Corporation Information
7.10.2 LG Innotek High Density Interconnect Product Portfolio
7.10.3 LG Innotek High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.10.4 LG Innotek Main Business and 麻豆原创s Served
7.10.5 LG Innotek Recent Developments/Updates
7.11 Tripod Technology
7.11.1 Tripod Technology High Density Interconnect Corporation Information
7.11.2 Tripod Technology High Density Interconnect Product Portfolio
7.11.3 Tripod Technology High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Tripod Technology Main Business and 麻豆原创s Served
7.11.5 Tripod Technology Recent Developments/Updates
7.12 TTM Technologies
7.12.1 TTM Technologies High Density Interconnect Corporation Information
7.12.2 TTM Technologies High Density Interconnect Product Portfolio
7.12.3 TTM Technologies High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.12.4 TTM Technologies Main Business and 麻豆原创s Served
7.12.5 TTM Technologies Recent Developments/Updates
7.13 Daeduck
7.13.1 Daeduck High Density Interconnect Corporation Information
7.13.2 Daeduck High Density Interconnect Product Portfolio
7.13.3 Daeduck High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Daeduck Main Business and 麻豆原创s Served
7.13.5 Daeduck Recent Developments/Updates
7.14 HannStar Board
7.14.1 HannStar Board High Density Interconnect Corporation Information
7.14.2 HannStar Board High Density Interconnect Product Portfolio
7.14.3 HannStar Board High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.14.4 HannStar Board Main Business and 麻豆原创s Served
7.14.5 HannStar Board Recent Developments/Updates
7.15 Nan Ya PCB
7.15.1 Nan Ya PCB High Density Interconnect Corporation Information
7.15.2 Nan Ya PCB High Density Interconnect Product Portfolio
7.15.3 Nan Ya PCB High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Nan Ya PCB Main Business and 麻豆原创s Served
7.15.5 Nan Ya PCB Recent Developments/Updates
7.16 CMK Corporation
7.16.1 CMK Corporation High Density Interconnect Corporation Information
7.16.2 CMK Corporation High Density Interconnect Product Portfolio
7.16.3 CMK Corporation High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.16.4 CMK Corporation Main Business and 麻豆原创s Served
7.16.5 CMK Corporation Recent Developments/Updates
7.17 Kingboard
7.17.1 Kingboard High Density Interconnect Corporation Information
7.17.2 Kingboard High Density Interconnect Product Portfolio
7.17.3 Kingboard High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.17.4 Kingboard Main Business and 麻豆原创s Served
7.17.5 Kingboard Recent Developments/Updates
7.18 Ellington
7.18.1 Ellington High Density Interconnect Corporation Information
7.18.2 Ellington High Density Interconnect Product Portfolio
7.18.3 Ellington High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Ellington Main Business and 麻豆原创s Served
7.18.5 Ellington Recent Developments/Updates
7.19 CCTC
7.19.1 CCTC High Density Interconnect Corporation Information
7.19.2 CCTC High Density Interconnect Product Portfolio
7.19.3 CCTC High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.19.4 CCTC Main Business and 麻豆原创s Served
7.19.5 CCTC Recent Developments/Updates
7.20 Wuzhu Technology
7.20.1 Wuzhu Technology High Density Interconnect Corporation Information
7.20.2 Wuzhu Technology High Density Interconnect Product Portfolio
7.20.3 Wuzhu Technology High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Wuzhu Technology Main Business and 麻豆原创s Served
7.20.5 Wuzhu Technology Recent Developments/Updates
7.21 Kinwong
7.21.1 Kinwong High Density Interconnect Corporation Information
7.21.2 Kinwong High Density Interconnect Product Portfolio
7.21.3 Kinwong High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.21.4 Kinwong Main Business and 麻豆原创s Served
7.21.5 Kinwong Recent Developments/Updates
7.22 Aoshikang
7.22.1 Aoshikang High Density Interconnect Corporation Information
7.22.2 Aoshikang High Density Interconnect Product Portfolio
7.22.3 Aoshikang High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.22.4 Aoshikang Main Business and 麻豆原创s Served
7.22.5 Aoshikang Recent Developments/Updates
7.23 Sierra Circuits
7.23.1 Sierra Circuits High Density Interconnect Corporation Information
7.23.2 Sierra Circuits High Density Interconnect Product Portfolio
7.23.3 Sierra Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.23.4 Sierra Circuits Main Business and 麻豆原创s Served
7.23.5 Sierra Circuits Recent Developments/Updates
7.24 Bittele Electronics
7.24.1 Bittele Electronics High Density Interconnect Corporation Information
7.24.2 Bittele Electronics High Density Interconnect Product Portfolio
7.24.3 Bittele Electronics High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.24.4 Bittele Electronics Main Business and 麻豆原创s Served
7.24.5 Bittele Electronics Recent Developments/Updates
7.25 Epec
7.25.1 Epec High Density Interconnect Corporation Information
7.25.2 Epec High Density Interconnect Product Portfolio
7.25.3 Epec High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.25.4 Epec Main Business and 麻豆原创s Served
7.25.5 Epec Recent Developments/Updates
7.26 W眉rth Elektronik
7.26.1 W眉rth Elektronik High Density Interconnect Corporation Information
7.26.2 W眉rth Elektronik High Density Interconnect Product Portfolio
7.26.3 W眉rth Elektronik High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.26.4 W眉rth Elektronik Main Business and 麻豆原创s Served
7.26.5 W眉rth Elektronik Recent Developments/Updates
7.27 NOD Electronics
7.27.1 NOD Electronics High Density Interconnect Corporation Information
7.27.2 NOD Electronics High Density Interconnect Product Portfolio
7.27.3 NOD Electronics High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.27.4 NOD Electronics Main Business and 麻豆原创s Served
7.27.5 NOD Electronics Recent Developments/Updates
7.28 San Francisco Circuits
7.28.1 San Francisco Circuits High Density Interconnect Corporation Information
7.28.2 San Francisco Circuits High Density Interconnect Product Portfolio
7.28.3 San Francisco Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.28.4 San Francisco Circuits Main Business and 麻豆原创s Served
7.28.5 San Francisco Circuits Recent Developments/Updates
7.29 PCBCart
7.29.1 PCBCart High Density Interconnect Corporation Information
7.29.2 PCBCart High Density Interconnect Product Portfolio
7.29.3 PCBCart High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.29.4 PCBCart Main Business and 麻豆原创s Served
7.29.5 PCBCart Recent Developments/Updates
7.30 Advanced Circuits
7.30.1 Advanced Circuits High Density Interconnect Corporation Information
7.30.2 Advanced Circuits High Density Interconnect Product Portfolio
7.30.3 Advanced Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.30.4 Advanced Circuits Main Business and 麻豆原创s Served
7.30.5 Advanced Circuits Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 High Density Interconnect Industry Chain Analysis
8.2 High Density Interconnect Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 High Density Interconnect Production Mode & Process
8.4 High Density Interconnect Sales and 麻豆原创ing
8.4.1 High Density Interconnect Sales Channels
8.4.2 High Density Interconnect Distributors
8.5 High Density Interconnect Customers
9 High Density Interconnect 麻豆原创 Dynamics
9.1 High Density Interconnect Industry Trends
9.2 High Density Interconnect 麻豆原创 Drivers
9.3 High Density Interconnect 麻豆原创 Challenges
9.4 High Density Interconnect 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
IBIDEN Group
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Group
ZDT
Compeq
Unitech Printed Circuit Board Corp.
LG Innotek
Tripod Technology
TTM Technologies
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
CCTC
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Bittele Electronics
Epec
W眉rth Elektronik
NOD Electronics
San Francisco Circuits
PCBCart
Advanced Circuits
听
听
*If Applicable.
