Gallium nitride (GaN) transistors offer fundamental advantages over silicon. In particular, the higher critical electrical field makes it very attractive for power semiconductor devices with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon MOSFETs, which makes GaN HEMTs great for high speed switching applications. Gallium nitride transistors can then be operated with reduced dead-times which results in higher efficiency and enables passive cooling. Operation at high switching frequencies allows the volume of passive components to shrink which improves GaN HEMTs reliability and overall power density.
The global GaN HEMT Die market was valued at US$ 23 million in 2023 and is anticipated to reach US$ 59 million by 2030, witnessing a CAGR of 13.4% during the forecast period 2024-2030.
North American market for GaN HEMT Die is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for GaN HEMT Die is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of GaN HEMT Die include Wolfspeed, WAVEPIA Co., Ltd, GeneSiC (Navitas Semiconductor), Macom, EPC, Microchip, NewSemi Technology and WAVICE, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for GaN HEMT Die, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding GaN HEMT Die.
Report Scope
The GaN HEMT Die market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global GaN HEMT Die market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the GaN HEMT Die manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Wolfspeed
WAVEPIA Co., Ltd
GeneSiC (Navitas Semiconductor)
Macom
EPC
Microchip
NewSemi Technology
WAVICE
Segment by Type
8W
15W
35W
50W
60W
20W
25W
Segment by Application
Ku-band, U/VHF & Broadband Amplifiers
Base Station
Drone & UAV
Radar & Satellite
WiMAX, LTE, WCDMA, GSM
Others
Production by Region
North America
Europe
China
Japan
South Korea
China Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of GaN HEMT Die manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of GaN HEMT Die by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of GaN HEMT Die in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 GaN HEMT Die 麻豆原创 Overview
1.1 Product Definition
1.2 GaN HEMT Die Segment by Type
1.2.1 Global GaN HEMT Die 麻豆原创 Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 8W
1.2.3 15W
1.2.4 35W
1.2.5 50W
1.2.6 60W
1.2.7 20W
1.2.8 25W
1.3 GaN HEMT Die Segment by Application
1.3.1 Global GaN HEMT Die 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Ku-band, U/VHF & Broadband Amplifiers
1.3.3 Base Station
1.3.4 Drone & UAV
1.3.5 Radar & Satellite
1.3.6 WiMAX, LTE, WCDMA, GSM
1.3.7 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global GaN HEMT Die Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global GaN HEMT Die Production Estimates and Forecasts (2019-2030)
1.4.4 Global GaN HEMT Die 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global GaN HEMT Die Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global GaN HEMT Die Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of GaN HEMT Die, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global GaN HEMT Die 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global GaN HEMT Die Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of GaN HEMT Die, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of GaN HEMT Die, Product Offered and Application
2.8 Global Key Manufacturers of GaN HEMT Die, Date of Enter into This Industry
2.9 GaN HEMT Die 麻豆原创 Competitive Situation and Trends
2.9.1 GaN HEMT Die 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest GaN HEMT Die Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 GaN HEMT Die Production by Region
3.1 Global GaN HEMT Die Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global GaN HEMT Die Production Value by Region (2019-2030)
3.2.1 Global GaN HEMT Die Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of GaN HEMT Die by Region (2025-2030)
3.3 Global GaN HEMT Die Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global GaN HEMT Die Production by Region (2019-2030)
3.4.1 Global GaN HEMT Die Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of GaN HEMT Die by Region (2025-2030)
3.5 Global GaN HEMT Die 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global GaN HEMT Die Production and Value, Year-over-Year Growth
3.6.1 North America GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
3.6.3 China GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
3.6.6 China Taiwan GaN HEMT Die Production Value Estimates and Forecasts (2019-2030)
4 GaN HEMT Die Consumption by Region
4.1 Global GaN HEMT Die Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global GaN HEMT Die Consumption by Region (2019-2030)
4.2.1 Global GaN HEMT Die Consumption by Region (2019-2024)
4.2.2 Global GaN HEMT Die Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America GaN HEMT Die Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America GaN HEMT Die Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe GaN HEMT Die Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe GaN HEMT Die Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific GaN HEMT Die Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific GaN HEMT Die Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa GaN HEMT Die Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa GaN HEMT Die Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global GaN HEMT Die Production by Type (2019-2030)
5.1.1 Global GaN HEMT Die Production by Type (2019-2024)
5.1.2 Global GaN HEMT Die Production by Type (2025-2030)
5.1.3 Global GaN HEMT Die Production 麻豆原创 Share by Type (2019-2030)
5.2 Global GaN HEMT Die Production Value by Type (2019-2030)
5.2.1 Global GaN HEMT Die Production Value by Type (2019-2024)
5.2.2 Global GaN HEMT Die Production Value by Type (2025-2030)
5.2.3 Global GaN HEMT Die Production Value 麻豆原创 Share by Type (2019-2030)
5.3 Global GaN HEMT Die Price by Type (2019-2030)
6 Segment by Application
6.1 Global GaN HEMT Die Production by Application (2019-2030)
6.1.1 Global GaN HEMT Die Production by Application (2019-2024)
6.1.2 Global GaN HEMT Die Production by Application (2025-2030)
6.1.3 Global GaN HEMT Die Production 麻豆原创 Share by Application (2019-2030)
6.2 Global GaN HEMT Die Production Value by Application (2019-2030)
6.2.1 Global GaN HEMT Die Production Value by Application (2019-2024)
6.2.2 Global GaN HEMT Die Production Value by Application (2025-2030)
6.2.3 Global GaN HEMT Die Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global GaN HEMT Die Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Wolfspeed
7.1.1 Wolfspeed GaN HEMT Die Corporation Information
7.1.2 Wolfspeed GaN HEMT Die Product Portfolio
7.1.3 Wolfspeed GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Wolfspeed Main Business and 麻豆原创s Served
7.1.5 Wolfspeed Recent Developments/Updates
7.2 WAVEPIA Co., Ltd
7.2.1 WAVEPIA Co., Ltd GaN HEMT Die Corporation Information
7.2.2 WAVEPIA Co., Ltd GaN HEMT Die Product Portfolio
7.2.3 WAVEPIA Co., Ltd GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.2.4 WAVEPIA Co., Ltd Main Business and 麻豆原创s Served
7.2.5 WAVEPIA Co., Ltd Recent Developments/Updates
7.3 GeneSiC (Navitas Semiconductor)
7.3.1 GeneSiC (Navitas Semiconductor) GaN HEMT Die Corporation Information
7.3.2 GeneSiC (Navitas Semiconductor) GaN HEMT Die Product Portfolio
7.3.3 GeneSiC (Navitas Semiconductor) GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.3.4 GeneSiC (Navitas Semiconductor) Main Business and 麻豆原创s Served
7.3.5 GeneSiC (Navitas Semiconductor) Recent Developments/Updates
7.4 Macom
7.4.1 Macom GaN HEMT Die Corporation Information
7.4.2 Macom GaN HEMT Die Product Portfolio
7.4.3 Macom GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Macom Main Business and 麻豆原创s Served
7.4.5 Macom Recent Developments/Updates
7.5 EPC
7.5.1 EPC GaN HEMT Die Corporation Information
7.5.2 EPC GaN HEMT Die Product Portfolio
7.5.3 EPC GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.5.4 EPC Main Business and 麻豆原创s Served
7.5.5 EPC Recent Developments/Updates
7.6 Microchip
7.6.1 Microchip GaN HEMT Die Corporation Information
7.6.2 Microchip GaN HEMT Die Product Portfolio
7.6.3 Microchip GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Microchip Main Business and 麻豆原创s Served
7.6.5 Microchip Recent Developments/Updates
7.7 NewSemi Technology
7.7.1 NewSemi Technology GaN HEMT Die Corporation Information
7.7.2 NewSemi Technology GaN HEMT Die Product Portfolio
7.7.3 NewSemi Technology GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.7.4 NewSemi Technology Main Business and 麻豆原创s Served
7.7.5 NewSemi Technology Recent Developments/Updates
7.8 WAVICE
7.8.1 WAVICE GaN HEMT Die Corporation Information
7.8.2 WAVICE GaN HEMT Die Product Portfolio
7.8.3 WAVICE GaN HEMT Die Production, Value, Price and Gross Margin (2019-2024)
7.8.4 WAVICE Main Business and 麻豆原创s Served
7.7.5 WAVICE Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 GaN HEMT Die Industry Chain Analysis
8.2 GaN HEMT Die Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 GaN HEMT Die Production Mode & Process
8.4 GaN HEMT Die Sales and 麻豆原创ing
8.4.1 GaN HEMT Die Sales Channels
8.4.2 GaN HEMT Die Distributors
8.5 GaN HEMT Die Customers
9 GaN HEMT Die 麻豆原创 Dynamics
9.1 GaN HEMT Die Industry Trends
9.2 GaN HEMT Die 麻豆原创 Drivers
9.3 GaN HEMT Die 麻豆原创 Challenges
9.4 GaN HEMT Die 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Wolfspeed
WAVEPIA Co., Ltd
GeneSiC (Navitas Semiconductor)
Macom
EPC
Microchip
NewSemi Technology
WAVICE
听
听
*If Applicable.
